240results about How to "Difficult to manufacture" patented technology

A method for issuing a credential includes scanning in documents (e.g., breeder or ID documents) used to verify the applicant of the credential and creating data records including the image of the documents. As a means to reduce fraud, these data records are linked to the credential and to the issuer location, operator and time and place of issuance. If the document includes machine readable information, the method automatically reads the machine readable information from the document and uses at least part of the machine readable information from the document to pre-populate a form used to create a credential, such as an identification document. The method includes applying a transformation to the image of the document that enables protection against fraudulent use. The transformation secures the image of the document from tampering and/or enables tracking of the use of the document image to deter fraud. A method of verifying a credential comprises reading a physical security feature attribute on the credential, reading a logical attribute on the credential, and comparing information from the physical security feature with the logical storage element on the credential to verify the credential.

Methods for fabricating compound material wafers are described. An embodiment of the method includes providing a donor substrate having a surface, forming a weakened zone in the donor substrate to define a transfer layer that includes the donor substrate surface, bonding the surface of the transfer layer to a handle substrate, and detaching the donor substrate at the weakened zone to transfer the transfer layer onto the handle substrate. Consequently, a compound material wafer is formed, and the transfer layer detached donor wafer provides a remainder substrate having a surface where the transfer layer was detached. Next, an additional layer is deposited onto a surface of the remainder substrate to increase its thickness and to form a reconditioned substrate, and the reconditioned substrate is recycled as a donor substrate for fabricating additional compound material wafers.

The present invention provides an imaging lens device, which has a widely extended focusing range and exhibits good resolution over the entire focusing range. The imaging lens device comprises a liquid crystal lens for focusing an object at a prescribed distance, comprising a liquid crystal layer, a first transparent substrate disposed adjacent to one surface of the liquid crystal layer and having a first electrode and having Fresnel lens surface formed on the boundary with the liquid crystal layer, a second transparent substrate disposed adjacent to the other surface of the liquid crystal layer and having a second electrode; a controller for changing the refractive index of the liquid crystal layer for extraordinary ray by changing electric voltage applied between the first electrode and the second electrode; and an imaging element for taking an image of the object. The liquid crystal lens functions as a diffractive optical element for an extraordinary ray when the liquid crystal layer has a prescribed refractive index for an extraordinary ray incident upon the liquid crystal layer.

A method and apparatus of fabricating a semiconductor device are disclosed. The semiconductor device may include a buffer chip package having a buffer chip mounted on a buffer chip substrate and at least one memory package mounted on the buffer chip substrate, wherein the at least one memory package may include a plurality of memory chips. Further, the buffer chip package may have a plurality of external connection terminals.

A lens cap and an LED package structure using the same are provided. The lens cap includes a cap body made of a transparent material for being covered on a point light source. The cap body includes a first incident surface, which is a curved surface raised on a inner side of the cap body and refracts light emitted by the point light source into the cap body. A reflective surface is formed the outer side of the cap body and is opposite to the first incident surface, wherein the reflective surface reflects the light refracted by the first incident surface. A light-transmitting surface is formed on the outer side of the cap body, and the light reflected by the reflective surface is projected onto the light-transmitting surface to exit the cap body. Thus, the light is emitted towards the lateral of the lens cap along a horizontal direction.

According to the present invention, which is a display device in which a light-emitting element where an organic substance generating luminescence referred to as electroluminescence or a medium including a mixture of an organic substance and an inorganic substance is sandwiched between electrodes is connected to a TFT, the invention is to manufacture a display panel by forming at least one or more of a conductive layer which forms a wiring or an electrode and a pattern necessary for manufacturing a display panel such as a mask layer for forming a predetermined pattern is formed by a method capable of selectively forming a pattern. A droplet discharge method capable of forming a predetermined pattern by selectively discharging a droplet of a composition in accordance with a particular object and by forming a conductive layer or an insulating layer is used as a method capable of selectively forming a pattern.

A pair of rimless spectacles includes two lenses, a frame including two temple units and a bridge, and a connection mechanism. The connection mechanism includes a plurality of first connectors spacedly provided at the lenses at a predetermined location and a plurality of second connectors provided at a predetermined location of each of the temple units and the bridge respectively, wherein the second connectors are coupled with the first connectors respectively to couple the temple units at two outer sides of the lenses respectively and to couple the bridge between two inner sides of the lenses respectively in a tool-less manner.

A pair of rimless spectacles includes two lenses, a frame including two temple units and a bridge, and a connection mechanism. The connection mechanism includes a plurality of first connectors spacedly provided at the lenses at a predetermined location and a plurality of second connectors provided at a predetermined location of each of the temple units and the bridge respectively, wherein the second connectors are coupled with the first connectors respectively to couple the temple units at two outer sides of the lenses respectively and to couple the bridge between two inner sides of the lenses respectively in a tool-less manner.

Disclosed are systems, devices, and methodologies that facilitate increasing the effective fill-factor of digital sensors. In general, fill-factor relates to the active area or photosensor region of the sensor with respect to the inactive area/deadzone or space between pixels. By increasing the effective fill-factor, transmission of optical information is increased to the sensor while mitigating information loss between pixels. A digital camera may contain a sensor that is responsive to electromagnetic radiation and a coherent scattering medium between the sensor and a lens that diffuses the electromagnetic radiation with respect to the sensor in order to increase the effective fill-factor.

An assembly includes a semiconductor device having surface-connecting terminals, a substrate having surface-connecting pads, and a capacitor having an approximately plate-shaped capacitor main body having a first surface on which the semiconductor device is mounted and a second surface at which the capacitor main body is mounted on the substrate and a plurality of electrically conductive vias penetrating the capacitor main body between the first and second surfaces and connected to the surface-connecting terminals and the surface-connecting pads.

An additive manufacturing method may involve: Providing a first and a second material, the second material capable of reacting with the first material to form a reaction product; forming at least the first material into a first layer; subjecting at least a portion of the first layer to energy in the presence of the second material, the energy being sufficient to initiate a reaction between at least the first and second materials to form a portion of the article, the portion of the article comprising the reaction product; forming a second layer of at least the first material on the first layer; and subjecting at least a portion of the second layer to energy in the presence of the second material, the energy being sufficient to initiate a reaction between the first and second materials to form an additional portion of the article.

An optical lens system for image taking includes, in order from an object side to an image side, a first lens element with negative refractive power having a concave object-side surface and a concave image-side surface, a second lens element with positive refractive power having a convex image-side surface, and a third lens element with negative refractive power having a concave image-side surface of the third lens element near an optical axis and a convex image-side surface of the third lens element away from the optical axis. Both the object-side surface and the image-side surface of the third lens element are aspheric. The third lens element is made of plastic.

A lightweight and compact super-insulation system that is also capable of supporting a high level of compressive load is described. The system utilizes spacers to provide structural support and utilize controlled buckling of a thin protective outer skin supported by spacers to form strong catenary surfaces to protect insulation material underneath. The spacers may comprise an aerogel, or an aerogel may provide insulation separate from the spacer yet contained within the thin outer skin. The system will be useful for thermal management of variety of deep underwater structures such as pipe-in-pipe apparatus, risers or subsea trees for ultra-deep water oil-and-gas exploration.

A controlled collapse chip connection (C4) structure having stronger resistance to failure is constructed for use with integrated circuit devices having copper wiring. Failure resistance is obtained by replacing the mechanically weak final passivation to copper interface. The weak interface is eliminated by use of a specific peg on peg structure together with a layer of shunt metal having excellent adhesion and barrier characteristics. A shunt metal, e.g., Ta or TaN, is placed between both the copper and final passivation and the copper and C4 metals such that it overlaps the edge of the peg defined wiring mesh to encase the copper. Overlap is obtained by the peg on peg structure where a SiO2 peg defines the copper wire mesh and a smaller Si3N4 peg placed on the SiO2 peg defines the overlap above the mesh wire and provides the ability to pattern the overlayer shunt without exposure of the copper conductor.

Solid compositions with improved physical stability comprise an amorphous, low-solubility drug, a poloxamer, and a stabilizing polymer. The compositions provide good physical stability during storage and concentration enhancement of dissolved drug when administered to an aqueous environment of use.

An object of the present invention is to provide solid catalyst component for manufacturing an olefin polymer having an excellent particulate morphology without the concern of causing fouling, and a polymerization of olefin in the presence of said solid catalyst component.

A solid catalyst (K) for olefin polymerization of the invention is characterized by meeting the following requirements [1] and [2]:

• [1] a loss of ignition is 30 wt % or less as measured on a differential thermogravimeter; and
• [2] after treating the catalyst with water vapor of room temperature and then contacting it with acetonitrile, a component eluted into the acetonitrile comprises a compound having a molecular skeleton represented by the following general formula [I].

(R in the above formula [I] is a hydrogen atom or an alkyl group having 1 to 12 carbon atoms.)