42results about How to "Address cooling needs" patented technology

An air current pipe system includes a machine case and a system fan inside the air hole located on the rear backboard of the machine case. The characteristics of the invention are that there a guiding wind flute possessing the air inlet and at least one air outlet. The air inlet covers the system fan. The air outlet is installed above the CPU inside the machine case. The invention guarantees thatCPU with super-high primary frequency as well as the heating elements on the host board and the hard disks and the plug-in cards can operate under the safe temperature range.

The invention provides a heat superconductive panel fin radiator with fins on the surface thereof. The radiator herein includes: a radiator substrate; a plurality of heat superconductive heating panels which are parallelly disposed at intervals on the surface of the radiator substrate; each heat superconductive heating panel is provided with a heat superconductive pipeline which is formed therein, and the heat superconductive pipeline is a closed pipeline which is filled with a heat conductive working medium; a radiating fin structure which is disposed on at least one surface of each heat superconductive heating panel; the radiating fin structure includes at least one radiating fin which extends in wave form along the direction in parallel to the surface of the heat superconductive heating panel. According to the invention, the heat superconductive panel fin radiator herein has the characteristics of high fin efficiency, large heat exchange area per unit volume, strong radiating capability, small size, light weight, flexible and various appearance and structure, low cost and small radiator substrate. The heat superconductive panel fin radiator herein can deploy devices with large power, is suitable to lower temperature environment of alpine regions in winter, and addresses the anti-freezing problem of heat pipes and water-cooled radiators.

The invention discloses an immersed liquid cooling sintering porous capillary core coupling micro-channel heat dissipation device. An exhaust micro-channel copper substrate comprises a square boss and a circular soaking table, the boss is located at the center position of the upper side of the soaking table, a *-shaped exhaust micro-channel is formed in the boss through linear cutting, and a boiling-evaporation sintering porous capillary core is in the shape of a prismatic table. The top of the boiling-evaporation sintering porous capillary core is provided with a porous capillary core conical groove, the bottom of the boiling-evaporation sintering porous capillary core and the top face of the polished exhaust micro-channel copper substrate are in contact with each other and are sintered into a whole, a heat conduction piece adheres to the bottom of the soaking table, and a chip heat source adheres to the bottom of the heat conduction piece. The chip heat source is embedded on a packaging substrate, and a heat insulation silica gel pad capable of nesting the heat conduction piece and the chip heat source between the soaking table and the packaging substrate is tightly attached to the packaging substrate. According to the immersed liquid cooling sintering porous capillary core coupling micro-channel heat dissipation device, the phase-change heat transfer capacity and the working stability of the device under medium-high heat flow can be remarkably improved.

The invention provides a thermal superconducting fin radiator with a phase change heat storage function. The thermal superconducting fin radiator comprises a substrate, a cover plate, a phase change heat storage structure and thermal superconducting plate fins, wherein the substrate comprises a main body part; the main body part is provided with opposite first surface and second surface; a grooveis formed in the first surface of the main body part; the cover plate covers the groove and seals the groove; the groove is filled with the phase change heat storage structure; and one end of each thermal superconducting plate fin is inserted into the substrate at the bottom of the groove and the other end passes through the cover plate and extends to the upper part of the cover plate. The phase change heat storage structure is capable of absorbing and storing a large amount of transient heat caused by short-term overload or fluctuations of power devices and keeping the temperature of the radiator and the power devices stable. The thermal superconducting plate fins have the advantages of high cooling efficiency and small thermal resistance, and are not limited by low temperature.

The invention discloses an automatic radiator capable of being assembled autonomously. The automatic radiator comprises a base. A heat dissipation area is arranged on the left side of the upper end face of the base. A fan box is fixedly arranged on the right side of the upper end surface of the base; a fan transmission cavity is formed in the fan box; a fan shaft is rotatably connected to the leftwall in the fan transmission cavity; a fan rotating area is arranged between the heat dissipation area and the fan box; a power cavity is formed in the base and located below the fan transmission cavity. A rotating shaft is arranged between the fan transmission cavity and the power cavity in a penetrating manner. By means of the mode of adding the cooling fins and enlarging the cooling area, theactual cooling requirements are met by freely increasing and decreasing the cooling fins; the cooling area is automatically increased by detecting the temperature; and meanwhile, the cooling fins areautomatically subjected to air cooling and water cooling, so that the rapid cooling effect is achieved, and various cooling requirements are met.

The invention provides a graphene thin-film device including a target part and a graphene thin film attached to the surface of the target part, the thickness of the graphene thin film is in the range of 0.34nm-4nm, The graphene thin-film device has an excellent cooling effect, and can meet large-power cooling needs and high-density packaging. The invention further provides a preparation method of the graphene thin-film device. through the organic combination of a liquid phase stripping method and semiconductor preparation technology, the graphene thin film is prepared on the surface of the target part, the preparation process and operation are simple, high-temperature process is not needed, production of a large-size thin film is facilitated, the thin film is suitable for batch production, the thickness and shape of the prepared graphene thin film are controllable, the graphene thin film is tightly combined with the surface of the target part, problems that interface cooling materials in the prior art are bad in cooling effect, and cannot meet the large-power device cooling demands for high-intensity system packaging are solved, and a good foundation is better provided for a high-power electronic device.

The invention relates to a converter device radiator and is a device for radiating heat of traction converter equipment of a low-speed rail transit motor train unit. The radiator comprises a circulating pipeline, a walking air radiator and a forced air radiator, wherein a circularly flowing cooling medium is arranged in the circulating pipeline, the walking air radiator is arranged on the circulating pipeline, the walking air radiator is constructed to be capable of utilizing walking air to radiate a cooling medium in the circulating pipeline when the train runs, the forced air radiator is arranged on the circulating pipeline, and the forced air radiator is constructed to be capable of opening forced air to dissipate heat of a cooling medium in the circulating pipeline, and the circulatingpipeline is in contact with each power module of the traction converter and exchanges heat with the power modules. The radiator is advantaged in that the walking air can be used for heat dissipationwhen the train runs, and heat dissipation can be carried out on the converter device when the train enters a station.

The invention discloses a graded manifold micro-channel heat dissipation device. The graded manifold micro-channel heat dissipation device mainly comprises a first-stage micro-channel, a second-stage micro-channel, a third-stage micro-channel and a bottom plate part. The four layers of channels are packaged through the bonding technology, working medium inlets and working medium outlets are located in the top, and the number of the micro-channels and the number of the manifold channels can be increased according to the heat exchange area. A heat exchange working medium flows into the third-stage micro-channel through the first-stage micro-channel and the second-stage micro-channel, is split into the last eight inlets from the first two inlets and flows to the surface of the analog chip, and the temperature distribution uniformity of the surface of the analog chip is improved through uniform distribution of the working medium. And the working medium after heat exchange is converged into the first-stage micro-channels through the third-stage micro-channels and the second-stage micro-channels, and finally is converged to an outlet in the middle through the two first-stage micro-channels to flow out. The flow channel is segmented into a plurality of micro-channel units, the flow length is shortened, so that the pressure drop is reduced, a thermal boundary layer is difficult to develop in the micro-channel, and the heat exchange coefficient is increased and the total thermal resistance is reduced. The device has the advantages of being small in occupied area, low in power consumption and high in heat dissipation capacity, and can be used for meeting the heat dissipation requirement exceeding the heat flux density.

An array type multistage semiconductor refrigeration device for a large-target-surface detector relates to the field of vacuum refrigeration packaging of photoelectric imaging detectors, solves the problems that an existing detector refrigerating device is complex in structure and large in size, further affects the refrigerating effect of the detector and the like, and comprises the large-target-surface detector, a cold plate, an array multistage semiconductor refrigerator and a heat sink, wherein the large-target-surface detector and the cold plate are bonded through high-thermal-conductivityepoxy resin glue, and the cold end of the array multistage semiconductor refrigerator and the cold plate are welded through low-temperature welding flux, and the hot end of the array multistage semiconductor refrigerator and the heat sink are welded through low-temperature welding flux. According to the invention, array type multistage semiconductor refrigeration adopts a thermoelectric refrigeration mode, and is free of noise, vibration and refrigerant; the multistage semiconductor can realize the requirement for large imaging temperature difference of the detector; the array type semiconductor can realize the requirement for large heat productivity of the detector; and the method can be well applied to the current large-target-surface (pixel 6K*6K) CMOS detector.

The invention provides a heat radiation protection device and a spectrum therapy instrument. The spectrum therapy instrument comprises a plurality of light sources and a heat radiation protection device. The heat radiation protection device comprises an area light source substrate, heat radiation bases, heat radiation fans, heat conduction pipes and heat radiation fins. The multiple heat radiationbases are arranged on the area light source substrate. Second installation parts are respectively arranged between adjacent heat radiation bases. The heat radiation fans are installed in the second installation parts respectively. The adjacent heat radiation bases are connected by the heat conduction pipes. The heat radiation fins are arranged on the pipe bodies of the heat conduction pipes to increase the heat radiation area. By integrating the heat radiation bases, the heat conduction pipes, heat conduction fluid, the heat radiation fins and the heat radiation fans and quickly transferringthe heat generated by the light sources to the heat radiation fin group through the heat conduction pipe network, multiple heat radiation and intelligent temperature control are realized. A fast and efficient heat radiation cycle system is formed, which is more efficient, intelligent and environment-friendly than air cooling. The heat radiation protection device is small, simple and easy to operate, can meet the requirement of light sources for long-time work and guarantee the working life of light sources, can radiate heat quickly, has high efficiency, and is convenient to install and use.

The invention relates to the technical field of heat dissipation, and provides a vapor chamber and electronic equipment, the vapor chamber comprises a first shell and a second shell which are oppositely arranged, and the first shell and the second shell define a closed cavity; the first shell comprises a bottom wall used for making contact with a heat source, the second shell is provided with a top wall right opposite to the bottom wall, a first capillary structure is arranged on the bottom wall and comprises a heat source area capillary structure and a non-heat source area capillary structure, and the heat source area capillary structure comprises a plurality of convex capillary structures and / or a plurality of first concave capillary structures. According to the vapor chamber, a plurality of convex capillary structures and / or a plurality of first concave capillary structures are arranged on the heat source area capillary structure of the first capillary structure of an evaporation area over the VC heat source, so that the evaporation area of a working medium in the VC is increased, and the evaporation thermal resistance of the working medium in the VC is reduced; the heat dissipation problem of the VC in a high-power-consumption and high-heat-flux chip application scene is solved.

The invention discloses a copper-aluminum composite material heat dissipation structure for a high-power-consumption single board. The invention belongs to the technical field of high-power-consumption single-board heat dissipation. The copper-aluminum composite material heat dissipation structure comprises a high-power-consumption single-board PCB and a chipset arranged on the high-power-consumption single-board PCB. The copper-aluminum composite material heat dissipation structure further comprises a copper-aluminum composite heat dissipation body installed on the high-power-consumption single-board PCB, a heat dissipation fan is arranged on one side face of the copper-aluminum composite heat dissipation body, the other side face of the copper-aluminum composite heat dissipation body isattached to the surface of the chipset through a heat conduction medium, and then the purposes of meeting the high power consumption of the LED lamp and meeting the strict requirement for the use environment size are achieved.

The invention discloses a heat dissipation system of an amphibious armored vehicle, and belongs to the technical field of vehicle heat dissipation. The heat dissipation system comprises three-path circulations of a fresh water path, a seawater path and an oil path, and the three-path circulations are separately circulated through a fresh water pump, a seawater pump and an oil pump to drive coolingmedia to circulate; under the land working condition, the fresh water path circulation and the oil path circulation work simultaneously, and the seawater path circulation does not work; and under theoffshore working condition, the fresh water path circulation, the oil path circulation and the seawater path circulation work simultaneously. The fresh water path circulation is provided with an expansion water tank which is used for balancing the pressure of the system water side and the exhaust and water supplement of the system. According to the heat dissipation system, the heat sources of thevehicle are classified according to different cooling media, then heat dissipation components are circularly built according to the characteristics of the marine and onshore double working conditionsof the vehicle, and the heat dissipation requirements of a high-power-density engine and advanced transmission can be met.

The invention relates to a mobile phone cooling device, in particular to a mobile phone cooling device employing a USB fan. The mobile phone cooling device comprises a heating chip in a mobile phone, a USB female port and an external USB fan, wherein the mobile phone cooling device is characterized in that a strip heat transfer part is connected between the heating chip in the mobile phone and the USB female port; the strip heat transfer part has certain insulativity or an insulating layer is arranged between the strip heat transfer part and the USB female port; the external USB fan is provided with a USB male port, an electric cooling fan and metal cooling tubes; the USB male port is matched with the USB female port of the mobile phone; a metal connection shell of the USB male port is in heat transfer connection with the metal cooling tubes on the USB fan; and a power line of the USB male port is connected with the electric cooling fan.

The invention relates to a compressor oil return device, an air conditioning system and an oil return control method. The compressor oil return device comprises a double-suction double-exhaust compressor, and an oil separator and an oil return component which are connected to the double-suction double-exhaust compressor, wherein the oil return component comprises an oil return valve and a connecting pipe; the oil return valve comprises a valve body, a valve needle, a fixed block and a sliding block; the fixed block is fixedly connected into the valve body; the fixed block divides the valve body into an upper cavity and a lower cavity; the sliding block is arranged in the lower cavity and located below the fixed block; a middle cavity is arranged between the sliding block and the fixed block; a flow channel communicated with the upper cavity and the lower cavity is arranged in the middle cavity; and the valve needle matched with the flow channel is arranged under the flow channel. The length of the valve needle extending into the flow channel is changed through vertical sliding of the sliding block in order to achieve adjustment of the oil return amount. The oil return valve is simple in structure, low in manufacturing cost and convenient to use, the problems of high oil discharge rate and difficult lubricating oil return in a direct exhaust compression cylinder of the double-suction double-exhaust compressor can be effectively solved, the abrasion of the compressor is reduced, and the service life is prolonged.

The invention discloses a battery thermal management device and a vehicle. The battery thermal management device comprises: a box body; at least two water cooling plates which are sequentially arranged on the inner wall of the same side of the box body, wherein the adjacent water cooling plates are communicated; and at least two battery modules which are sequentially arranged on the sides, away from the box body, of the water cooling plates, wherein any battery module at least corresponds to one water cooling plate. According to the battery thermal management device provided by the invention, the at least two water-cooling plates are arranged opposite to the box body in a single-layer form, so that the heat dissipation area is increased, the heat dissipation requirement of the plurality of battery modules is met, the at least two battery modules are arranged opposite to the water-cooling plates in a single-layer form, the temperature uniformity of the plurality of heat dissipation modules is improved, the heat dissipation efficiency is improved, and a good heat dissipation effect is ensured.

The invention discloses a double-layer micro-channel heat dissipation device based on gas-liquid separation. The double-layer micro-channel heat dissipation device mainly comprises a liquid path micro-channel radiator on the lower layer, a nano-porous film and a gas path micro-channel radiator on the upper layer. The liquid path micro-channel radiator and the gas path micro-channel radiator are connected into a whole through the sintering technology, then the nano-porous film is packaged between the gas and liquid micro-channels, working fluid in the liquid path micro-channel is heated and evaporated, steam enters the gas path micro-channel through the nano-porous film, film evaporation is formed to take away an extremely large amount of heat, and meanwhile, gas-liquid separation is achieved, the two-phase flow instability is reduced, due to the existence of the porous structure in the liquid path micro-channel, the liquid film drying phenomenon is effectively relieved, the critical phenomenon is delayed, and the critical heat flux density is greatly improved. The device has the advantages of being small in occupied area, low in power consumption and high in heat dissipation capacity, and can be used for meeting the heat dissipation requirement exceeding the heat flux density.

The invention provides an air guide device and an air guide method for realizing uniform distribution of air flow in a case, which are used for solving the technical problem of guiding the direction of air flow in the case, so as to achieve the technical effect of good heat dissipation in the case. An air guide device for realizing uniform distribution of air flow in a case comprises an air guidepartition plate, wherein the air guide partition plate partitions the air flow in the case into upper and lower parts; a plurality of ribs are arranged at the lower end of the air guide partition plate, and the ribs partition the lower part of the air guide partition plate to form a CPU heat dissipation channel and a DIMM heat dissipation channel.

An embodiment of the invention discloses a radio frequency transceiving front-end packaging structure and system. The structure comprises a housing, wherein the bottom part of which is provided with a metal heat sink; a heat dissipation gasket and a substrate which are arranged on the metal heat sink, wherein the orthographic projection of the heat dissipation gasket on the metal heat sink is not overlapped with the orthographic projection of the substrate on the metal heat sink; a first chip arranged on the heat dissipation gasket, wherein the heat dissipation gasket is used for dissipating heat of the first chip; a second chip arranged on the substrate, wherein the substrate is used for realizing electric connection among the shell, the first chip and the second chip; and a cover plate opposite to the shell, wherein a closed cavity is formed by the shell and the cover plate.

The embodiment of the invention relates to the field of efficient heat exchange, and provides an ultrasonic enhanced heat transfer tank type cooling device utilizing microbubble emission boiling. Thedevice adopts a tank type heat sink design; a flowing loop of the cooling liquid is separated from a channel for carrying out microbubble emission boiling on a cooling working medium; then, a staggered chamfering through hole is used for sinking the heating surface, and an ultrasonic transducer is combined to introduce an ultrasonic cavitation effect and an ultrasonic sound flow effect; the supercooling degree of the cooling working medium close to the heating surface is stabilized on the basis that the reliability of the microbubble emission boiling cooling device is improved, and the stableoccurrence of microbubble emission boiling is maintained so as to meet the cooling requirement, which cannot be met by a conventional heat dissipation mode, of ultra-high heat load heating equipment.

The embodiment of the invention relates to the field of efficient heat exchange, and provides an ultrasonic enhanced heat transfer tank type cooling device utilizing microbubble emission boiling. Thedevice adopts a tank type heat sink design; a flowing loop of the cooling liquid is separated from a channel for carrying out microbubble emission boiling on a cooling working medium; then, a staggered chamfering through hole is used for sinking the heating surface, and an ultrasonic transducer is combined to introduce an ultrasonic cavitation effect and an ultrasonic sound flow effect; the supercooling degree of the cooling working medium close to the heating surface is stabilized on the basis that the reliability of the microbubble emission boiling cooling device is improved, and the stableoccurrence of microbubble emission boiling is maintained so as to meet the cooling requirement, which cannot be met by a conventional heat dissipation mode, of ultra-high heat load heating equipment.

A solar energy, ground source heat pump and boiler combined heating and cooling system comprises a solar heat collection system, a plate heat exchanger, a boiler, a soil heat exchanger and a heat pump unit, wherein the solar heat collection system comprises a solar thermal collector, a water tank and a heat collection box; the heat pump unit comprises an evaporator side and a condenser side; the evaporator side comprises a first evaporator side connector and a second first evaporator side connector; the condenser side comprises a first condenser side connector and a second condenser side connector; one side of the plate heat exchanger is communicated with the heat collection box; a plate heat exchanger outlet and a plate heat exchanger inlet are formed in the other side of the plate heat exchanger; the plate heat exchanger outlet is communicated with the inlet of a user water utilization system through a fifth valve; and the outlet of the user water utilization system is communicated with the plate heat exchanger inlet through a second water pump. By adopting the system, the investment cost of a ground source heat pump is reduced, the running cost is reduced, centralized heating and cooling demands of large-area buildings of different functions and types are met and the problem that cooling and heating loads are not balance in the whole year is solved.

The invention discloses a fuel gas and EGR mixed direct injection system. A low-pressure EGR pipe is connected with an exhaust pipe and a high-pressure EGR pipe, a low-pressure EGR valve is installed on the low-pressure EGR pipe, and a high-pressure EGR valve is installed on the high-pressure EGR pipe; an inlet of an EGR pump is connected with an exhaust manifold through the high-pressure EGR pipe, and an outlet of the EGR pump is connected with an inlet in one end of a mixer through an air outlet pipe of the EGR pump; an outlet of a liquidation fuel gas vessel is connected with an inlet of a fuel gas pump through an air inlet pipe of the fuel gas pump, an outlet of the fuel gas pump is connected with an inlet in the other end of the mixer through an air outlet pipe of the fuel gas pump, an outlet of the mixer is connected with an inlet of a mixed gas track through a mixed gas track connecting pipe, an outlet of the mixed gas track is connected with a mixed gas nozzle through a mixed gas supply pipe, and the mixed gas nozzle is installed on a cylinder or in an air inlet channel close to the cylinder.

The invention discloses a safety protection system of a logging-while-drilling apparatus. The safety protection system comprises an upper chuck, a lower chuck, an upper stopping disk, a lower stopping disk, telescopic arms, a power supply, a switch, balls and anti-collision cushions. The safety protection system is characterized in that the upper chuck is fixed at an upper opening of the upper stopping disk; the lower chuck is fixed at a lower opening of the lower stopping disk; longitudinal notches are formed in the same positions of one side of the upper chuck, the lower chuck, the upper stopping disk and the lower stopping disk; the anti-collision cushions for protecting parameter short sections are stuck on inner walls of the two notches; a mounting groove is formed in an upper surface of the upper stopping disk; a power supply is fixed inside the mounting groove. According to the safety protection system of the logging-while-drilling apparatus, the upper and lower stopping disks can be moved without the need of manpower and the automation degree is high; heat dissipation requirements can be met and seawater cannot enter a cabinet body, so that a machine body is effectively protected; the anti-collision cushions are mounted on the notches and the parameter short sections are effectively protected from damages; when connecting plugs cannot be in butt joint, the parameter short sections can be rotatably adjusted, so that angles of the connecting plugs are changed and the safety protection system is convenient to mount.

The invention discloses a fuel gas and EGR mixed direct injection system. A low-pressure EGR pipe is connected with an exhaust pipe and a high-pressure EGR pipe, a low-pressure EGR valve is installed on the low-pressure EGR pipe, and a high-pressure EGR valve is installed on the high-pressure EGR pipe; an inlet of an EGR pump is connected with an exhaust manifold through the high-pressure EGR pipe, and an outlet of the EGR pump is connected with an inlet in one end of a mixer through an air outlet pipe of the EGR pump; an outlet of a liquidation fuel gas vessel is connected with an inlet of a fuel gas pump through an air inlet pipe of the fuel gas pump, an outlet of the fuel gas pump is connected with an inlet in the other end of the mixer through an air outlet pipe of the fuel gas pump, an outlet of the mixer is connected with an inlet of a mixed gas track through a mixed gas track connecting pipe, an outlet of the mixed gas track is connected with a mixed gas nozzle through a mixed gas supply pipe, and the mixed gas nozzle is installed on a cylinder or in an air inlet channel close to the cylinder.

A server common air guide cover structure is disclosed, belonging to the technical field of server cooling auxiliary equipment. The structure includes a common air deflector and extension, the commonair guide cover is arranged inside the chassis base of the server, the common air guide cover is detachably connected with the chassis base, the extension part is the box body with the upper end faceopen, the extension part is connected with the air inlet end of the common air guide cover through the connecting part, the connecting part is arranged at the upper end of the extending part close tothe side wall of the common air guide cover, and the connecting part is connected with the extending part. The invention can not only avoid the hot air returning from the air outlet end of the heat dissipation equipment, meet the heat dissipation and air conduction requirements of the server, but also solve the problem that the newly-opened mold air guide cover occupies more cost.

The invention discloses a liquid cooling heat dissipation device of an orthogonal architecture subrack. The liquid cooling heat dissipation device comprises a line card with an orthogonal architecture, an exchange plate and a keel, and further comprises a liquid cooling heat dissipation device, wherein the liquid cooling heat dissipation device uses the keel as a carrier of a liquid-cooling fluidchannel and further used as a mounting carrier of the blind-mating liquid-cooling connector; a closed channel is arranged in the keel and serves as a liquid cooling fluid channel; a first cold plate is arranged on the exchange plate where the heating device is located, a closed channel is further arranged in the first cold plate to serve as a liquid cooling fluid channel, and the blind insertion liquid cooling connector is used for being connected with a port of the liquid cooling fluid channel located in the first cold plate and a port of the liquid cooling fluid channel located at the corresponding position of the keel. According to the liquid cooling heat dissipation device, the heat dissipation problem of a high-power-consumption device is solved, and safe, stable and efficient work ofelectronic equipment can be guaranteed.

The invention discloses a plum-blossom-shaped microchannel heat sink cold plate and a heat dissipation device thereof, which belong to the technical field of micro-channel heat exchange. Microchannel heat sink, the microchannel heat sink is provided with four mutually symmetrical plum blossom petal-shaped microchannels, and the plum blossom petal-shaped microchannels are provided with a number of imitation plum blossom-shaped flow channels from the outside to the inside, and the four plum blossom petal-shaped After the microchannels are put together, the corresponding imitation quincunx-shaped flow channels are connected, and four protrusions and four depressions are formed on the outer edge, and a central confluence is formed at the center. There is a perfusion channel connected to the quincunx-shaped flow channel, and the perfusion channel is reduced from the outside to the inside; one of the depressions is provided with a nozzle connecting the flow channel of the nearest depression and the flow channels of the two adjacent protrusions. In the liquid port, the recess on the opposite side of the liquid injection port is provided with a liquid outlet that communicates with the flow channel in the nearest recess and the flow channels in two adjacent protrusions.

The invention provides a heat superconductive panel fin radiator with fins on the surface thereof. The radiator herein includes: a radiator substrate; a plurality of heat superconductive heating panels which are parallelly disposed at intervals on the surface of the radiator substrate; each heat superconductive heating panel is provided with a heat superconductive pipeline which is formed therein, and the heat superconductive pipeline is a closed pipeline which is filled with a heat conductive working medium; a radiating fin structure which is disposed on at least one surface of each heat superconductive heating panel; the radiating fin structure includes at least one radiating fin which extends in wave form along the direction in parallel to the surface of the heat superconductive heating panel. According to the invention, the heat superconductive panel fin radiator herein has the characteristics of high fin efficiency, large heat exchange area per unit volume, strong radiating capability, small size, light weight, flexible and various appearance and structure, low cost and small radiator substrate. The heat superconductive panel fin radiator herein can deploy devices with large power, is suitable to lower temperature environment of alpine regions in winter, and addresses the anti-freezing problem of heat pipes and water-cooled radiators.