Hierarchical manifold micro-channel heat dissipation device

Abstract

The invention discloses a graded manifold micro-channel heat dissipation device. The graded manifold micro-channel heat dissipation device mainly comprises a first-stage micro-channel, a second-stage micro-channel, a third-stage micro-channel and a bottom plate part. The four layers of channels are packaged through the bonding technology, working medium inlets and working medium outlets are located in the top, and the number of the micro-channels and the number of the manifold channels can be increased according to the heat exchange area. A heat exchange working medium flows into the third-stage micro-channel through the first-stage micro-channel and the second-stage micro-channel, is split into the last eight inlets from the first two inlets and flows to the surface of the analog chip, and the temperature distribution uniformity of the surface of the analog chip is improved through uniform distribution of the working medium. And the working medium after heat exchange is converged into the first-stage micro-channels through the third-stage micro-channels and the second-stage micro-channels, and finally is converged to an outlet in the middle through the two first-stage micro-channels to flow out. The flow channel is segmented into a plurality of micro-channel units, the flow length is shortened, so that the pressure drop is reduced, a thermal boundary layer is difficult to develop in the micro-channel, and the heat exchange coefficient is increased and the total thermal resistance is reduced. The device has the advantages of being small in occupied area, low in power consumption and high in heat dissipation capacity, and can be used for meeting the heat dissipation requirement exceeding the heat flux density.

Description

technical field [0001] The invention relates to the field of cooling and heat dissipation in tiny spaces, and is suitable for ultra-high heat flux heat dissipation technology, in particular to a hierarchical manifold microchannel heat dissipation device. Background technique [0002] In recent decades, with the vigorous development of micro-nano processing technology, the development technology of micro-electro-mechanical systems, large-scale integrated circuits and high-power light-emitting diodes has also made great strides forward. Energy and power, aerospace, biochemical, nuclear energy technology, mobile communications, electric vehicles and other advanced engineering fields are increasingly focusing on the miniaturization and integration of electronic equipment, and the increasing market demand has intensified the development of high-precision hardware equipment research and development technology. requirements. The development trend of power improvement and miniaturi...

AI Technical Summary

Problems solved by technology

However, the traditional indirect cooling heat dissipation separates the chip from the heat sink, and fills the thermal interface material in the middle. Due to the contact thermal resistance, this will cause a huge temperature gradient in the entire heat sink

In addition, localized heating may also cause uneven temperature distribution of the chip surface temperature

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