Thermal superconducting fin radiator with phase change heat storage function

Abstract

The invention provides a thermal superconducting fin radiator with a phase change heat storage function. The thermal superconducting fin radiator comprises a substrate, a cover plate, a phase change heat storage structure and thermal superconducting plate fins, wherein the substrate comprises a main body part; the main body part is provided with opposite first surface and second surface; a grooveis formed in the first surface of the main body part; the cover plate covers the groove and seals the groove; the groove is filled with the phase change heat storage structure; and one end of each thermal superconducting plate fin is inserted into the substrate at the bottom of the groove and the other end passes through the cover plate and extends to the upper part of the cover plate. The phase change heat storage structure is capable of absorbing and storing a large amount of transient heat caused by short-term overload or fluctuations of power devices and keeping the temperature of the radiator and the power devices stable. The thermal superconducting plate fins have the advantages of high cooling efficiency and small thermal resistance, and are not limited by low temperature.

Description

technical field [0001] The invention belongs to the technical field of heat transfer, in particular to a thermal superconducting fin radiator with phase change heat storage function. Background technique [0002] With the rapid development of power electronics technology, the requirements for modularization, integration, lightweight, low cost and high reliability are getting higher and higher. Therefore, in solar inverters, uninterruptible power supplies (UPS), charging piles, power MosFET (metal oxide semiconductor field effect transistor), Diode (diode), IGBT ( Insulated Gate Bipolar Transistors) and other power devices. As the integration of these power components is getting higher and higher, the power density is also increasing, and the heat generated by themselves during work is also increasing. If the heat generated by the power devices cannot be dissipated in time and quickly, it will lead to power failure. The temperature of the chip in the device rises, which wil...

AI Technical Summary

Problems solved by technology

With the improvement of the performance of high-power devices, the increase of the heat flux density of a single device, and the improvement of the requirements for small size and light weight, the conventional aluminum heat sink can no longer meet the heat dissipation requirements of high-heat-flux high-power modules.

[0005] However, when the above-mentioned heat sink is used for heat dissipation of power devices, due to the poor heat dissipation effect, when the power device is short-term overloaded or fluctuates to generate a large amount of instantaneous heat, the heat cannot be dissipated in time, causing the temperature of the heat sink and power device to rise rapidly, thereby affecting Performance of Power Devices

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