603results about "Printed circuits repair/correcting" patented technology

A multi-chip, module (MCM) having one or more high value chips such as ASICs, CPUs, DSPs or the like attached to the MCM substrate via a direct attach technology (such as flip chip) and one or more memory chips attached to the MCM substrate via a reworkable technology such as connector and receptacle-based package, wirebond package, chip scale package (CSP), leaded package, ball grid array package, or fine pitch ball grid array package. The MCM substrate may, in turn, be attached to a motherboard via solder balls (ball grid array); leads and / or connector interconnect technologies (such as compression sockets).

A laser decal transfer is used to generate thin film features by directing laser pulses of very low energy at the back of a target substrate illuminating an area of a thin layer of a high viscosity rheological fluid coating the front surface of the target. The illuminated area is shaped and defined by an aperture centered about the laser beam. The decal transfer process allows for the release and transfer from the target substrate to the receiving substrate a uniform and continuous layer identical in shape and size of the laser irradiated area. The released layer is transferred across the gap with almost no changes to its initial size and shape. The resulting patterns transferred onto the receiving substrate are highly uniform in thickness and morphology, have sharp edge features and exhibit high adhesion, independent of the surface energy, wetting or phobicity of the receiving substrate.

A method of electrochemical deposition uses microdroplets of electrolytic solution over a targeted small circuit element. Only the targeted circuit element is electrically biased so that deposition occurs on the surface of that element, underneath the microdroplet, and nowhere else unless it is under other microdroplet(s). The invented method achieves extremely accurate and selective electrochemical deposition with a tiny amount of electrolytic solution, compared to conventional submersive and / or immersive methods, and eliminates the need for masking or etching, reducing the costs of manufacture and amount of waste electrolytic solution produced.

This invention combines the precision spray process with in-flight laser treatment in order to produce direct write electronic components. In addition to these components, the process can lay down lines of conductive, inductive, and resistive materials. This development has the potential to change the approach to electronics packaging. This process is revolutionary in that components can be directly produced on small structures, thus removing the need for printed circuit boards.

A method for mounting a semiconductor device, which can decrease the occurrence rate of failures, a method for repairing a semiconductor device, which can easily repair defective solder joints, and a semiconductor device which makes those methods feasible. A substrate 1 has formed therein through-holes 7 lined on the internal walls with a wiring layer 9, and solder balls 6 are fusion-bonded to the substrate 1 in such a manner as to cover the through-holes 7. In the mounting process or in the repair process, heating probes 41 are passed through the through-holes 7 and thrust into the solder balls 6 to thereby melt the solder balls, and the heating probes are pulled out of the solder balls to let the solder balls cool down. In those processes, only the solder balls 6 can be heated, thereby averting adverse effects on the IC chip 3. In the repair process, the solder balls 6 can be restored to an initial condition free of intermetallic compounds.

A multi-LED component comprises a component substrate comprising a common electrode, a first electrode, a second electrode, a plurality of first LEDs, and a plurality of second LEDs all disposed on the component substrate. Each first LED and each second LED comprises first and second LED contacts for providing power to each corresponding LED to cause the LED to emit light. The first LED contact of each first LED and each second LED is electrically connected to the common electrode. The second LED contacts of the first LEDs are electrically connected to the first electrode. The second LED contacts of the second LEDs are electrically connected to the second electrode so that the first LEDs are electrically connected in parallel and the second LEDs are electrically connected in parallel.

A wired-circuit-board assembly sheet is provided having removable portions that are easily removable without any generation of metal powder. The wired-circuit-board assembly sheet comprises a plurality of suspension boards with circuits, distinguishing marks for distinguishing defectiveness of the suspension boards with circuits, and a supporting sheet for supporting the suspension boards with circuits and the distinguishing marks, wherein openings are formed in the supporting sheet, and removable portions which are to be removed when the suspension boards with circuits are judged defective are located in the openings and also supported by the supporting sheet via joint portions formed of resin.

Methods and reworked intermediate and resultant electronic modules made thereby, whereby a component in need of rework is located and removed from the module to reveal encapsulated solder connections residing within an underfill matrix. Heights of both the solder connections and underfill matrix are reduced, followed by etching the solder out of the solder connections to form openings within the underfill matrix. The underfill material is then removed to expose metallurgy of the substrate. A blank having a release layer with an array of solder connections is aligned with the exposed metallurgy, and this solder array is transferred from the blank onto the metallurgy. The transferred solder connections are then flattened using heat and pressure, followed by attaching solder connections of a new component to the flattened solder connections and underfilling these reworked solder connections residing between the new chip and substrate.

A combination stencil printer and dispenser includes a frame, a movable stencil coupled to the frame, a substrate support coupled to the frame to support a substrate in a print position, and a print head coupled to the frame to deposit and print viscous material over the stencil. The combination stencil printer and dispenser further includes a dispenser mounted on the movable stencil to dispense viscous material on the substrate when the substrate is in the print position. In other embodiments, the dispenser can be mounted on a stencil wiper or on an independent gantry provided within the combination stencil printer and dispenser.

An RF shield formed of RF opaque material that permits access to components on a printed circuit board is described. The RF shield can include a first portion attached to the PCB and a removable top portion attached to the first portion at an interface. The top portion is removed from the first portion to expose the components on the PCB. In one aspect of the described embodiment, the top portion is peeled away from the first portion. The components are enclosed within the RF shield after the removal of the top portion by attaching and sealing another top portion to the first portion at the interface by, for example, laser attaching the first portion and the other top portion at the interface.

A multi-LED component comprises a component substrate comprising a common electrode, a first electrode, a second electrode, a plurality of first LEDs, and a plurality of second LEDs all disposed on the component substrate. Each first LED and each second LED comprises first and second LED contacts for providing power to each corresponding LED to cause the LED to emit light. The first LED contact of each first LED and each second LED is electrically connected to the common electrode. The second LED contacts of the first LEDs are electrically connected to the first electrode. The second LED contacts of the second LEDs are electrically connected to the second electrode so that the first LEDs are electrically connected in parallel and the second LEDs are electrically connected in parallel.

A primary electrical fuse is attached to a printed circuit board. The primary electrical fuse comprises a first and second terminal, a fusible element disposed between the first and second terminals electrically linking the first terminal and the second terminal, and receiving tip sections located on the first and second terminals that receive a replacement electrical fuse to electrically connect the first and second terminals with a replacement fusible element.

A method of self-healing cracks in a cured epoxy base underfill material between an I / C chip and a substrate is provided. A plurality of capsules is dispersed in the epoxy base. Each capsule has a curable thermosetting adhesive encapsulated in a rupturable shell to disperse the thermosetting adhesive in a crack in the epoxy base when the shell ruptures. Each capsule is less than 25 microns in diameter. A curing agent that will cause a reaction of the thermosetting adhesive on contact is dispersed in the epoxy to form a cured adhesive in a crack in said epoxy base. The shell will rupture when encountering a crack being propagated in the underfill material, which will at least partially fill the crack with the adhesive, and cure the adhesive with the curing agent to bond the edges of the crack together. The invention also includes the structure for crack self-healing.

An electrically conductive adhesive (ECA) for repairing electrically conductive pad and trace interconnects and a method of repairing interconnect locations. The method of repairing at least one defect within the area of electrically conductive circuitized substrate traces and pads outside of a pristine center area incorporates an ECA and a forming gas plasma. The ECA contains a mixture of components that allow the adhesive to be adapted to specific requirements. Curing the adhesive results in effective electrical connections being formed between the adhesive and the base pad so that the metallurgies of the conductors and of the ECA are effectively combined to engage and repair the conductor defect.

A method of repairing wiring shorts on a surface of an organic layer. The organic layer, which is preferably a SLC / ASM layer, may be a surface layer of a Printed Circuit (PC) board. The absorption spectrum of the organic layer is examined. Based on that absorption spectrum, a laser is selected with a wavelength such that the surface layer slightly absorbs, 1-10%, laser energy striking it. Thus, the laser removes metal on the surface, while slightly etching the surface layer and without effect on any metal buried in or beneath the surface layer. Preferably, the laser is an Nd:YAG laser having a wavelength in a range where the ASM layer absorption is between 2-5%, and the copper ablation rate is high.

A semiconductor device or a radiographic imaging apparatus includes a substrate and a supporting member, the substrate having a semiconductor element or a conversion element and being bonded to the supporting member with a laminating member. The semiconductor device or the radiographic imaging apparatus further includes at least one cushioning member in at least one space between the substrate and the supporting member at least in a region including an electrical connection portion connected to at least one electrical component. Thus, when a malfunction or a defect is found in the at least one electrical component, such as TCP, on the periphery of the substrate, the defective electrical component can easily be replaced.

The invention provides a burning-free non-cyaniding method for treating a waste printed circuit board. The method comprises the following steps of: sealing-off, lead and tin separation, crushing and electrostatic separation, and respective extraction of antimony, aluminum, copper, nickel, silver, gold, platinum and palladium. By the method disclosed by the invention, the maximization of valued metal resource recycling is realized, metallic lead and tin can be thoroughly separated and recovered, and at the same time the recovery rate of metallic palladium is improved.

In a method of attaching a solder ball, a first material is coated on a solder ball. A second material is coated on a pad of a substrate where the solder ball is to be attached to exothermically react with the first material. The solder ball makes contact with the pad such that the first material and the second material exothermically react with each other to release heat to adhere the solder ball to the pad using the heat.

A solder ball is loaded on a bump having a small height (FIG. 5(B)) and the height of the bump is intensified by melting the solder ball by heating with laser (FIG. 5(C)). Thus, the heights of the bumps are adjusted within a requested allowable range. Because the bump is not removed by heating when the height of the low bump is intensified, the printed wiring board is not subjected to local heat history thereby intensifying reliability of the bump of a printed wiring board.

In one implementation, a multilayered printed circuit board is configured to redirect current distribution. The current may be distributed by steering, blocking, or otherwise manipulating current flows. The multilayered printed circuit board includes at least one power plane layer. The power plane layer does not distribute current evenly. Instead, the power plane layer includes multiple patterns with different resistances. The patterns may include a hatching pattern, a grid pattern, a directional pattern, a slot, a void, or a continuous pattern. The pattern is a predetermined spatial variation such that current flows in a first area differently than current flows in a second area.

A method for reworking a ball grid array (BGA) of solder balls is provided including one or more defective solder balls on an electronic component workpiece using a single-ball extractor / placer apparatus having a heatable capillary tube pickup head optionally augmented with vacuum suction. A defective solder ball is identified, extracted by the pickup head and disposed of. A nondefective solder ball is picked up by the pickup head, positioned on the vacated attachment site, and thermally softened for attachment to the workpiece. Flux may be first applied to the replacement solder ball or to the vacated attachment site. The extractor / placer apparatus may be automated to locate, extract and replace defective balls for completion of a fully operable BGA.

Circuit board reworking techniques involve removing original solder from the metallic pad, removing an outer portion of the metallic pad to expose an inner portion of the metallic pad, and applying new solder to the metallic pad. Removal of the original solder and the outer portion of the metallic pad exposes the inner portion which has non-corroded and non-contaminated metal. The application of new solder to this inner portion of the pad enables wettability of the pad as well as provides a protective coating to prevent corrosion of the inner portion (e.g., oxidation, reaction with contaminants, etc.). Accordingly, circuit board abnormalities such as “Black Pad” defects can be cured.

In a solder printing inspection machine, an identification code and an inspection time of an inspection target board are accumulated in a memory. The accumulated data, whose identification code is matched with that of the current inspection target board, is searched while the accumulated data is traced back one by one. When the corresponding board is found, it is recognized that the board is extracted because of the defective board and the inspection target board is the reintroduced board that was previously extracted. A graph, in which pieces of information expressing the pieces of quality of the boards are arrayed in time series, is produced based on each time of inspection result and the graph is displayed on a monitor. In the pieces of data included in the graph, the data corresponding to the board that is recognized as the reintroduction is explicitly shown by a letter “R”.

A miniature PWB with features that incorporate the required circuitry changes and component footprints, which has been enhanced with micro-castellations such as those found on ceramic surface mount packages. The miniature PWB is mounted on the circuit board using techniques well known in the art. This combination of technologies provides an adaptable, durable interconnect methodology, which allows for circuit and part changes without changing the layout of the base printed wiring board.

The invention discloses a method for repairing a fine circuit. The method comprises the following steps: the step A, filling nano-copper particles in a circuit defect position of a circuit board; thestep B, performing laser irradiation or direct heating on the nano-copper particles at the line defect position to enable the nano-copper particles to be metallurgically bonded with the original lineat the line defect position; and the step C, cleaning the surface of the circuit board, and removing residual nano-copper particles at an unsintered part to complete line repair. According to the invention, a fine line can be repaired, and the method has the advantage of low operation difficulty.

Solvent-free UV-curable polymer materials derived from miscible blends of reactive organic monomeric, oligomeric and low molecular polymeric systems and organic and inorganic fillers such as polytetrafluoroethylene and talc are provided to form polymer-filler composite compositions for use in the fabrication and repair of electronic components and microelectronic assembly processes. The composition contains a preformed thermoplastic or elastomeric polymer / oligomer with reactive end groups, a monofunctional and / or bifunctional acrylate monomer, a multifunctional (more than two reactive groups) acrylated / methacrylated monomer, a photoinitiator and a fluorocarbon polymer powder as an organic filler which is preferably PTFE and an inorganic filler such as talc. A nano-filler may also be used as the inorganic filler alone or in combination with another inorganic filler such as talc A method is also provided for repairing defects on ceramic substrates using the composition of the invention or other curable polymeric compositions.

An apparatus for inspecting and repairing a circuit defect is disclosed, which has a base; a substrate-supporting platform mounted on the base; a contact inspection module having at least one contact probe and a first driving-system that drives at least one contact probe to contact the circuits formed on the glass substrate and thereby inspect a circuit defect; a non-contact inspection module having at least one non-contact sensor and a second driving-system that drives at least one non-contact sensor to inspect the circuit defect in a non-contact manner; and a laser repair module having a laser head and a third driving-system that drives the laser head to go to the circuit defect and repair the circuit defect. A method for inspecting and repairing a circuit defect is also disclosed therewith.