152results about How to "Easy to fail" patented technology

[Subject] The present invention is directed to realize failure detection without directly detecting a failed positioning system.[Solving Means] A terminal positioning system includes positioning systems 101 and 102 and a failure detector 104. When a failure occurs in one of the positioning systems 101 and 102, by monitoring a use state of the other positioning system, the failure in one of the positioning systems is detected. Priorities of positioning process on the positioning systems 101 and 102 may be determined so that the priority of positioning process on one of the positioning systems is higher than that on the other positioning system. The one of the positioning systems can perform positioning at higher precision than the other positioning system.

A composite oxygen ion transport element that has a layered structure formed by a dense layer to transport oxygen ions and electrons and a porous support layer to provide mechanical support. The dense layer can be formed of a mixture of a mixed conductor, an ionic conductor, and a metal. The porous support layer can be fabricated from an oxide dispersion strengthened metal, a metal-reinforced intermetallic alloy, a boron-doped Mo5Si3-based intermetallic alloy or combinations thereof. The support layer can be provided with a network of non-interconnected pores and each of said pores communicates between opposite surfaces of said support layer. Such a support layer can be advantageously employed to reduce diffusion resistance in any type of element, including those using a different material makeup than that outlined above.

An improved hole opener assembly for horizontal drilling is disclosed that is less prone to failure as a result of cone arm break out or pocket side wall fracture. The interface between the cone arm and the pocket employs a key and slot configuration with a tighter fit than between the arm and the pocket to reduce the stress on the pocket side wall during drilling.

A method for mounting a semiconductor device, which can decrease the occurrence rate of failures, a method for repairing a semiconductor device, which can easily repair defective solder joints, and a semiconductor device which makes those methods feasible. A substrate 1 has formed therein through-holes 7 lined on the internal walls with a wiring layer 9, and solder balls 6 are fusion-bonded to the substrate 1 in such a manner as to cover the through-holes 7. In the mounting process or in the repair process, heating probes 41 are passed through the through-holes 7 and thrust into the solder balls 6 to thereby melt the solder balls, and the heating probes are pulled out of the solder balls to let the solder balls cool down. In those processes, only the solder balls 6 can be heated, thereby averting adverse effects on the IC chip 3. In the repair process, the solder balls 6 can be restored to an initial condition free of intermetallic compounds.

The invention provides a large-scale parallel system-based distributed communication system and a control method of the large-scale parallel system-based distributed communication system. According to the control method, at a time of the triangle-carrier wave peak of a PWM (pulse-width modulation) module, sub-controllers pack collected analog signals and digital signals of a corresponding converter cabinets into a user-defined one-frame data format, and transmit the packet to a main controller, and trigger start signals are generated after all the sub-controllers transmit the collected data to the main controller; the main controller is responsible for the control algorithm and the treatment of fault signals, reads the data transmitted by the sub-controllers after receiving the trigger signals, and transmits control command information to each sub-controller after the computing treatment; the sub-controllers control the corresponding PWM converter cabinets after receiving the control information. Namely, one transmitting and receiving process can be completed by the distributed communication control. By the system and the control method, the modularization and the parallel control of the wind power converter can be easily realized, the faults of the system can be easily positioned, and the circulation flow and the uneven flow of the parallel system can be effectively restrained.

A lighted heat dissipating panel made of sustainable renewable materials such as recycled aluminum and soy-based urethane, for use in architectural or shelving applications. The panel may be flat, rectangular, curvilinear, or of varying cross section so as to include any three-dimensional shape as desired. Lightweight materials such as carbon fiber, fiberglass, resin, soy-based urethane, and similar materials are used in combination with thermally conductive structural materials, such as expanded aluminum honeycomb, preferably fabricated from recycled aluminum, to provide a stiff, lightweight, machinable, moldable, and thermally conductive panel for use with lighting elements. Lighting elements are housed within the panel, providing illumination as desired. Heat is transferred from the lighting elements through the panel to the supporting structure and radiated from the panel itself, providing cooling effect for the lighting elements, reducing the temperature in the immediate vicinity of the lighting elements and providing for longer lighting element life.

A lens drive device may include a movable body having a lens and a coil, a support body movably supporting the movable body, a magnetic drive mechanism having a magnet for driving the movable body together with the coil, a restricting member for restricting movement of the movable body due to an electromagnetic force generated when an electric current is supplied to the coil, a magnetic member disposed in the movable body to be magnetically attracted by the magnet. In a non-energized state where the coil is not energized, following relationships are satisfied:W>F1, W>F2, and W<F1+F2. wherein a force with which the restricting member urges the movable body toward a non-energized position is “F1”; a force in the optical axis direction with which the magnetic member is attracted by the magnet is “F2”; and a weight of the entire movable body is “W”.

In a method of manufacturing a hollow stabilizer, a pipe compressing step of compressing an electroseamed pipe in a temperature range of a hot state or a warm state so as to make a rate of a thickness with respect to an outer diameter between 18 and 35% is performed, and a forming step of forming the compressed electroseamed pipe in a stabilizer shape in a cold state is executed. Next, a step of applying a heat treatment to a half-finished stabilizer is performed, a shot peening step of impacting a shot on the half-finished stabilizer is performed, and a step of coating the half-finished stabilizer is performed.

It is an object to provide a method for manufacturing a coil-embedded dust core with a small variation in inductance value with efficiency and the like. A step (a) of charging soft magnetic metal powder including an insulating material, composing a green body 10, so as to cover a coil 1, and a step (b) of compacting the soft magnetic metal powder covering the coil 1 in an axial direction of the coil 1 are included, and in the step (b), the soft magnetic metal powder is compacted while an amount of the soft metal powder charged into the part corresponding to the winding section is kept smaller than an amount of the soft magnetic metal powder charged into the other part that are not corresponding to the winding section, with an upper surface or a lower surface of the winding section as a reference. Thereby, a coil-embedded dust core with entirely uniform density can be obtained, and according to the coil-embedded dust core with entirely uniform density, a variation in inductance value is reduced and it becomes possible to obtain a predetermined inductance value with stability.

[Problem] There are provided a semiconductor device which is operable with a small occupied area, high reliability, and low power consumption, a nonvolatile semiconductor storage apparatus using the device and a manufacture method of the device. [Solution Means] A semiconductor device of the present invention comprises a first gate insulating film 22, floating gate, second gate insulating film 4, and control gate 5 on a semiconductor substrate 1, and a source area 6 and a drain area 7 formed in the semiconductor substrate 1 on opposite sides of the floating gate, the floating gate comprises a first floating gate 23 and a second floating gate 28 disposed to cover the first floating gate 23, and an isolating gate 25 is formed on the second floating gate 28 on the side of the semiconductor substrate 1, and parallel to the first floating gate 23 via an isolating insulating film 26.

In a method for determining a failure in a service or parking brake having an electromotive and a hydraulic brake device for generating a clamping force, an error is detected in the hydraulic brake device if an electromotive characteristic of the electric brake motor is outside an admissible value range.

A showerhead combination and a method for controlling water flowing. A non handheld first showerhead, a handheld second showerhead and a control device are included in the showerhead combination. The control device is installed in the first showerhead to control the water flowing out of the first showerhead. The second showerhead is cooperated with the first showerhead in two different statuses. In one status, the second showerhead is connected to the first showerhead and drives the motion of the control device to make water flowing out of the first showerhead. In the other status, the second showerhead is separated from the first showerhead, and the control device controls the first showerhead to stop water flowing.

The invention discloses a small direct-driven type all-metal sealing piezoelectric proportional valve. A piezoelectric direct-driven mode is adopted, an amplified structure does not need to be adopted, and accordingly the advantages, of a piezoelectric actuator, of large output force and high positioning precision are guaranteed; the positioning precision of the piezoelectric actuator can reach an nm order, and compared with other valves, the proportional valve designed in this way can be used for performing high-precision and high-resolution proportional flow control within a wide pressure range; and in addition, since the direct-driven mode is adopted, the seal passing diameter can also be increased, accordingly the required opening height is decreased so as to further decrease the length of the piezoelectric actuator, and miniaturization of the valve is achieved.