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Impact tool and method of controlling impact tool

ActiveUS20150336249A1High rotational speedReduce sizeDerricks/mastsSpannersSemiconductorDuty cycle
An impact tool includes: a motor; a trigger; a controller configured to control driving power supplied to the motor using a semiconductor switching element according to an operation of the trigger; a striking mechanism configured to drive a tip tool continuously or intermittently by rotation force of the motor, the striking mechanism including a hammer and an anvil. The controller drives the semiconductor switching element at a high duty ratio when the trigger is manipulated. The motor is driven so that the duty ratio is lowered before a first striking of the hammer on the anvil is performed and the first striking is performed at a low duty ratio lower than the high duty ratio.
Owner:HITACHI KOKI CO LTD

Semiconductor device and control method therefor

The present invention provides a semiconductor device and a method for controlling a semiconductor device having a memory cell array having a plurality of nonvolatile memory cells, the method including detecting the number of bits to be written as division data that is divided from data to be programmed into the memory cell array, comparing the number of bits with a predetermined number of bits, inverting or not inverting the division data to produce inversion data in accordance with a result of comparing the number of bits with the predetermined number of bits, and programming the inversion data into the memory cell array. The method further includes detecting the number of bits to be written as next division data and comparing the number of bits of next division data with the predetermined number of bits, while concurrently programming the inversion data into the memory cell array.
Owner:INFINEON TECH LLC

Etch method using a dielectric etch chamber with expanded process window

A method for etching a dielectric in a thermally controlled plasma etch chamber with an expanded processing window. The method is adapted to incorporate benefits of a the thermal control and high evacuation capability of the chamber. Etchent gases include hydrocarbons, oxygen and inert gas. Explanation is provided for enablling the use of hexafluoro-1,3-butadiene in a capacitively coupled etch plasma. The method is very useful for creating via, self aligned contacts, dual damascene, and other dielectric etch.
Owner:APPLIED MATERIALS INC

Microwave garment for heating and/or monitoring tissue

A flexible microwave applicator and method of use thereof. The applicator includes a flexible, dielectric-containing compartment (e.g. temperature regulated water or oil) having a variable contour, tissue-engaging surface and an opposite non-tissue-engaging surface and an antenna array adjacent to a non-tissue-engaging surface. The antenna array includes at least one flexible printed circuit board having a front metal surface, a dielectric substrate, a back metal surface, a connection structure for connecting the antenna array to at least one external microwave device, at least one dual concentric conductor aperture on the front surface, and at least one microstrip feedline in communication with the dual concentric conductor aperture and the connection structure. The microwave applicator also includes flexible attachment material for placement over the antenna array and dielectric compartment to allow the microwave applicator to be attached to a subject like a garment which closely conforms to the anatomy portion to be heated. The flexible attachment material may be configured such that the microwave applicator is configured as an appropriately-shaped type of garment, for example, a vest, jacket, cap, hood, blanket, custom shaped conformal wrap, sleeve, or as a pair of shorts.
Owner:RGT UNIV OF CALIFORNIA
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