Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method for repairing fine line

A repair method and fine circuit technology, applied in printed circuit repair/correction, printed circuit, printed circuit, etc., can solve problems such as easy deformation and difficult circuit defects

Active Publication Date: 2020-04-07
GUANGDONG UNIV OF TECH
View PDF10 Cites 17 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the texture of the bonding wire is relatively soft, and it is easy to deform under laser irradiation or during the transmission of the bonding wire, which causes certain difficulties in the operation of repairing circuit defects.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for repairing fine line
  • Method for repairing fine line
  • Method for repairing fine line

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051] Add polyvinylpyrrolidone-coated nano-copper particles 1 with a particle size of 50nm to ethylene glycol to form a copper paste with a solid content of 80%, and drop it to a defect position 21 of a 8x8mm rewiring layer through a nozzle. The nano-copper on the line defect position 21 is irradiated by the laser 3 of appropriate wavelength and energy, and the nano-copper particle 1 melts at a relatively low temperature and fills up the line defect. After the laser 3 is removed, a conductive path is formed at the defect position, and after cleaning, the repair of the circuit defect is completed.

Embodiment 2

[0053] The imidazole-coated nano-copper particles 1 with a particle size of 100nm were added to ethylene glycol to form a copper paste with a solid content of 85%, which was dropped onto the circuit defect position 21 of the PCB board through a nozzle. The nano-copper on the line defect position 21 is irradiated by the laser 3 of appropriate wavelength and energy, and the nano-copper particle 1 melts at a relatively low temperature and fills up the line defect. After the laser 3 is removed, a conductive path is formed at the defect position, and after cleaning, the repair of the circuit defect is completed.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle sizeaaaaaaaaaa
Login to View More

Abstract

The invention discloses a method for repairing a fine circuit. The method comprises the following steps: the step A, filling nano-copper particles in a circuit defect position of a circuit board; thestep B, performing laser irradiation or direct heating on the nano-copper particles at the line defect position to enable the nano-copper particles to be metallurgically bonded with the original lineat the line defect position; and the step C, cleaning the surface of the circuit board, and removing residual nano-copper particles at an unsintered part to complete line repair. According to the invention, a fine line can be repaired, and the method has the advantage of low operation difficulty.

Description

technical field [0001] The invention relates to the technical field of integrated circuits, in particular to a repair method for fine circuits. Background technique [0002] Printed circuit board is the support body of electronic components and the carrier of electrical connection. After electronic equipment adopts printed boards, the same type of printed boards have consistency, which can reduce manual wiring errors and realize automatic insertion or installation of electronic components. Mounting, automatic soldering, and automatic detection ensure the quality of electronic equipment, improve labor productivity, reduce costs, and facilitate maintenance. With the development of miniaturization and digitalization of electronic products, printed circuit boards are also developing in the direction of high density, high precision, fine aperture, thin wire, fine pitch, high reliability, multi-layer, high-speed transmission, light weight, and thin , put forward higher requiremen...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/22H05K3/26
CPCH05K3/225H05K3/26H05K2203/107H05K2203/0278H05K2203/0789H05K2203/0796H05K1/097H05K2201/0272H05K3/0055H05K1/09Y10T29/49165H05K3/288H05K2203/0126H05K2203/025H05K2203/0104H05K2203/013
Inventor 崔成强杨冠南徐广东张昱陈新
Owner GUANGDONG UNIV OF TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com