The invention relates to film stress measuring equipment and a film stress measuring method. In a cuboid equipment case, a laser LED, an optical reflector, a linear sliding rail, a detector and another linear sliding rail all are connected with the top face of the equipment case; the linear sliding rail is arranged below and vertically connected with another sliding rail; a tray and an analog / digital (A / D) data acquisition card are arranged on the internal bottom face of the equipment case; and the tray, the A / D data acquisition card, the linear sliding rail, the detector and the other linear sliding rail are all connected with a computer outside the equipment case through a circuit. In the equipment, a light sensitive electrical detector is used for automatically tracking light path deflection and acquiring a light path deflection displacement signal, a micro step motor is used to control and rotate the tray to quickly generate a silicon chip accurate region curvature and stress change color drawing that helps to get the condition of a thin film on the surface of an entire silicon chip, two-dimensional and three-dimensional images of the surface of the thin film can be obtained, a friendly interface can be written in VC++ language, and it is possible to further expand program functions.