969 results about "Size parameter" patented technology

A cardiac rhythm management (CRM) system provides for post-myocardial infarction (MI) therapy with closed-loop control using one or more ultrasound transducers sensing one or more ultrasound signals indicative of cardiac dimensions. Cardiac size parameters are produced using the one or more ultrasound signals to represent, for example, cardiac chamber diameter, cardiac chamber volume, cardiac wall thickness, infarct size, and degree of change in any of these parameters over time or between measurements. In various embodiments, such cardiac size parameters provide for titration, safety check, and acute optimization of the post-MI therapy.

A method of controlling a receiver and a transmitter to handle a transmission window size change procedure is disclosed. The method includes driving the receiver to deliver a control message having a window size parameter to the transmitter for adjusting a transmission window size of the transmitter, and driving the transmitter to output an acknowledgement message to the re- ceiver and adjust the transmission window size according to the window size parameter when the transmitter receives the control message.

The present application provides various devices, systems, and methods for removing stenotic lesions from vessels. In at least one embodiment of an exemplary device, the device comprises at least one sizing portion and at least one treatment portion. Such a device may be useful to, for example, remove a stenotic lesion from a vessel by positioning the device within a vessel lumen, operating the sizing portion to obtain luminal size parameter data, operating the treatment portion at a location within the vessel lumen at or near a stenotic lesion, and ceasing operation of the treatment portion when the luminal size parameter data indicates a preferred luminal size parameter.

The invention belongs to the technical field of optical imaging and detecting and relates to a bilateral dislocation differential confocal element parameter measuring method. The method includes the steps that dislocation differential subtracting processing is conducted on the two sides of a confocal axial characteristic data set measured by the starting points and the ending points of all various size parameters including the curvature radius, the lens thickness, the refractive rate, the focal distance and the interval, and therefore the positioning precision of the starting points and the ending points of the size parameters is improved, and the measuring precision of optical elements of the curvature radius, the lens thickness, the refractive rate, the focal distance, the interval and the like is improved. According to the bilateral dislocation differential confocal element parameter measuring method, due to the fact that two sections of data, close to the position of the full width at half maximum and very sensitive to axial displacement, of a confocal characteristic curve are used for conducting the dislocation differential subtracting processing, the position, calculated by the data sections, of the extreme point of the confocal characteristic curve is more sensitive and more accurate than the position, calculated through an existing confocal characteristic curve top fitting method, of the extreme point of the confocal characteristic curve, according to the result of the bilateral dislocation differential confocal element parameter measuring method, under the condition that the confocal element parameter system structure is not changed, the axial focusing capability, the signal-to-noise ratio and the like of the system can be obviously improved.

A highly accurate technique for inspecting semiconductor devices is described. The technique involves utilizing multiple sets of measurement data obtained by a scanning electron microscope (SEM) to determine the dimensional parameters of a semiconductor device. The SEM collects each set of data from a different angular orientation with respect to the device. The dimensional parameters of the semiconductor device are determined by analyzing the relationship between the SEM inspection angle and the collected data sets. Various configurations of an SEM can be used to implement this invention. For instance an electron beam inspection system of the present invention can have at least two sets of deflectors for guiding the electron beam, a swiveling specimen stage, and / or a set of detectors set about the specimen at different angular orientations.