The invention provides a multilayered
printed circuit board plated-through hole stress-strain model establishing method based on girder construction. The multilayered
printed circuit board type plated-through-hole stress-strain model establishing method based on the girder construction comprises the following steps: 1, simplifying a multilayered
printed circuit board plated-through-hole to be the girder construction in
axial symmetry, and establishing assumed conditions based on the girder construction; 2, regarding a bonding plate structure as an annular round plate to be uniformly loaded, and setting boundary conditions of inner-
diameter simply support and external-
diameter free of a bonding plate; 3, writing mechanical ordinary differential equations of the bonding plate based on assumption that the bonding plate is uniformly loaded, and solving a general solution expression of a deflection; 4, determining four coefficients to be determined in the general solution expression by using the boundary conditions, and listing relationship of the load, and the deflection, a bearing force and a
thermal strain by combining displacement continuous conditions; 5, determining radial, annular and axial stresses at the position with the maximum stress by combining the boundary conditions and calculating an
equivalent stress by using a Mises
equivalent stress computational formula; 6, giving a strain analysis expression within a range of elasticity and
plasticity of a multilayered printed circuit board plated-through hole according to
linear elasticity and linear
plasticity stress-strain relationship of a
coating material.