Cooling augmentation using microchannels with rotatable separating plates

Abstract

A DL-microchannel cooling device with rotatable separating plate is disclosed. The separating plate is supported via anti-leaking flexible seals. The only allowable motion for that plate is the rotational motion about a pivot rod. The rod is taken to be aligned along the microchannel center line normal to its sides boundaries. The device can be configured as a flexible microheat exchanger and a heated DL-flexible microchannel device. The theory of linear elasticity applied to flexible seals supporting the separating plate is used to relate the moment of the pressure forces on that plate to its rotational angle. The energy equations for both fluids flows are solved numerically and analytically under special conditions. As such, the effectiveness of the flexible microheat exchanger and other performance indicators for flexible microheat exchanger and heated DL-flexible microchannel devices are calculated. The advantages of the proposed device in cooling attributes over the performance of the DL-rigid microchannel device is examined.

Description

CROSS-REFERENCE TO PROVISIONAL APPLICATION[0001]This nonprovisional patent application claims the benefit under 35 U.S.C. §119(e) of U.S. Provisional Patent Application Ser. No. 61 / 429,831. filed on Jan. 5, 2011, entitled “Cooling Augmentation Using Microchannels With Rotatable Separating Plates,” which is hereby incorporated by reference in its entirety.TECHNICAL FIELD[0002]Embodiments are generally related to microchannel cooling devices. Embodiments also relate to MEMS (Microelectromechanical systems) and nano-scale devices and nanofabrication techniques. Embodiments also relate to cooling augmentation techniques that utilize double layered (DL) microchannels separated by rotatable plates.BACKGROUND OF THE INVENTION[0003]Many electronic devices incorporate a highly integrated density of chips in a small or minimal area. VLSI components are an example of such devices, which consume a great deal of electrical energy, which is dissipated as heat. The amount of dissipated heat is usu...

AI Technical Summary

Benefits of technology

[0016]It is a further aspect of the disclosed embodiments to provide for a technique in which the effectiveness and the heat transfer rate per unit pumping power for the flexible microheat exchanger are always higher than that of the rigid one.

Problems solved by technology

VLSI components are an example of such devices, which consume a great deal of electrical energy, which is dissipated as heat.

Conventional cooling technologies are not sufficient for handling this dissipation of heat.

One of the main disadvantages of conventional microchannel cooling devices is the increased coolant temperature because very large heating loads are dissipated by relatively small coolant flow rates.

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