The present invention relates to a
wafer defect searching method. The
wafer defect searching method comprises the following steps: a detection
machine detects defect information of a
wafer and transmits the defect information to an electronic scanning
microscope; and the electronic scanning
microscope photographs the wafer according to the defect information. The invention can quickly and accurately detect defects on the upper, lower and side surfaces of the wafer by using the detection
machine, determine the defect information of the detected wafer, and transmit the defect information to theelectronic scanning
microscope; and the electronic scanning microscope can quickly and accurately find the position of the defect on the wafer according to the defect information, and automatically take a photo of the defect on the wafer. The invention solves the problem that the manual photographing speed of the wafer is slow and the position of the defect is inaccurate, can improve the production efficiency, can provide a powerful help for finding the cause of the defects on the wafer, and has great significance for improving the yield of the products.