A
printed circuit board and manufacturing method thereof are disclosed. By use of a method of manufacturing a
printed circuit board, which uses a
metal substrate as a core member and has an
electronic component embedded in the
metal substrate, mainly comprising: (a)
anodizing at least one surface of the
metal substrate to form at least one
insulation layer, (b) forming an inner layer circuit on the at least one
insulation layer, (d) placing
chip bond
adhesive in correspondence with a position where the
electronic component is to be embedded and mounting the
electronic component, and (e) forming an outer layer circuit in correspondence with a position where the inner layer circuit is formed and with positions of the electrodes of the electronic component, and which may further comprise an operation (c) of
etching the
metal substrate to form a cavity in correspondence with a position where the electronic component is to be embedded between the operations (b) and (d), a
metal substrate, such as that of aluminum, etc., is rendered electrically insulating by applying an
anodizing process and is used as a core member in a
printed circuit board, so that
bending stiffness and heat-releasing property are improved; wet
etching can be applied, so that manufacturing costs are reduced; and a
chip bond
adhesive, die attach film, or nonconductive paste, etc., that is high in
thixotropy is used in embedding the electronic component, so that the
degree of precision may be increased for the position and height of the electronic component when embedding the electronic component.