510results about How to "Reduce the amount of variation" patented technology

As a display device has higher definition, the number of pixels is increased and thus, the number of gate lines and signal lines is increased. When the number of gate lines and signal lines is increased, it is difficult to mount IC chips including driver circuits for driving the gate lines and the signal lines by bonding or the like, whereby manufacturing cost is increased. A pixel portion and a driver circuit for driving the pixel portion are provided on the same substrate, and at least part of the driver circuit comprises a thin film transistor including an oxide semiconductor sandwiched between gate electrodes. A channel protective layer is provided between the oxide semiconductor and a gate electrode provided over the oxide semiconductor. The pixel portion and the driver circuit are provided on the same substrate, which leads to reduction of manufacturing cost.

The present invention relates to back light unit light guide plate composing picture on surface in laser picture composition mode, the picture composition mode can control the picture composition curved deep profile line. The invention concretely relates to a light guide plate of picture formed with the picture composition mode, according to the picture composition mode, deepness of the picture varies with distance to the light source when composing picture on the light guide plate, such that the reflection of light of light-in section is minimized in range of standard value, therefore the light source is transmitted to the back light section with minimized loss.

A supply part for supplying resin, a smoothing part for smoothing the resin, and an objective lens for exposing the smoothed resin to light are provided in separate positions within substantially the same horizontal plane, and a modeling part is movable by a horizontal drive mechanism under the three above-mentioned components. For processing in the three above-mentioned components, the modeling part is moved to positions immediately under the three above-mentioned components in order by the horizontal drive mechanism. Thus, the modeling part is brought as close to the three above-mentioned components as possible for processing. The exposure is performed, with the objective lens fixed to a base body. Exposure light is focused onto a resin layer on a modeling base, and the light reflected from the resin layer is received by the objective lens, directed by a beam splitter toward an image surface optical system and received as an image by a CCD camera. During the exposure, the directed exposure light serves as illumination light which enables an operator to check whether current focus is achieved on the surface of the resin layer. During a time interval between the completion of the exposure of the resin layer to light and the execution of the exposure of the next resin layer to light, the fine adjustment of the vertical position of a stage is made, whereby the fine adjustment of the focus position is made in accordance with the result of observation using a monitor. This prevents the decrease in modeling accuracy for the subsequent resin layers, thereby to hold the modeling accuracy for the entire model higher, thereby improving the yield and productivity of models. These provide a stereolithography apparatus which attains a resin layer thickness of 10 μm and an exposure resolution of 2 μm and is preferred for micromachining.

An optical scanning device includes a plurality of scanning optical systems configured to scan different scanning surfaces. Each of the scanning optical systems includes a light source configured to emit a light flux, a deflector configured to scan the light flux emitted from the light source, wherein the deflector is commonly used in the plurality of scanning optical systems. Each of the scanning optical systems further includes a scanning lens configured to condense the scanned light flux to the scanning surface, an optical path inflection mirror configured to inflect the scanned light flux, and an imaging lens configured to lead the light flux emitted from the light source to the deflector. The plurality of scanning optical systems are provided at both sides of the deflector having the deflector therebetween such that one each of the scanning optical systems at both sides of the deflector include a set of the optical scanning system and respective light fluxes scanned by the deflector in the set of the optical scanning system become approximately parallel in a main scanning direction, and an expression, |N−M|=2k+1 is satisfied when the number of optical path inflection mirrors provided in each of the set of scanning optical systems is represented by “N” (i.e., N≧2) and “M” (i.e., M≧1), and “k” is an integer equal to zero or larger.

A surface acoustic wave device includes a piezoelectric substrate made of LiTaO3 or LiNbO3 having an electromechanical coefficient of about 15% or more, at least one electrode which is disposed on the piezoelectric substrate and which is a laminate film having a metal layer defining a primary metal layer primarily composed of a metal having a density higher than that of Al or an alloy of the metal and a metal layer which is laminated on the primary metal layer and which is composed of another metal, and a first SiO2 layer which is disposed in a remaining area other than that at which the at least one electrode is located and which has a thickness approximately equivalent to that of the electrode. In the surface acoustic wave device described above, the density of the electrode is at least about 1.5 times that of the first SiO2 layer. In addition, a second SiO2 layer disposed so as to cover the electrode and the first SiO2 layer and a silicon nitride compound layer disposed on the second SiO2 layer are further provided.