32results about How to "Overcome warping" patented technology

The invention provides a printing device. The printing device comprises a printer, a transmission mechanism and a page turning mechanism, wherein the printer comprises an inlet and an outlet for books or certificates to enter and export respectively; the transmission mechanism is configured to freely move in multiple directions in a controlled mode so as to transmit the books or the certificates to the inlet or take the books or the certificates out of the outlet; the page turning mechanism is configured to turn pages of the books or the certificates; and the transmission mechanism is further configured to transmit the books or the certificates from the outlet to the page turning mechanism and transmit the books or the certificates from the page turning mechanism to the inlet. The printing device has full-automatic page turning and printing functions aiming at the books or the certificates.

The invention relates to a method for processing a blind buried hole on a multilayer circuit board, which belongs to the technical field of laser drilling. The technical key point of the invention comprises the following steps of: (1) confirming a position needing hole opening of the traditional mechanical blind buried hole circuit board; (2) processing a buried hole on an inner-layer plate of the position needing hole opening and electroplating again after filling resin into the buried hole for grinding to form a butting joint pad; and (3) drilling a laser blind hole on an upper-layer circuit board at at least one side of the processing buried hole and butting the laser blind hole with the pad formed electroplating on the mechanical buried hole to form a blind buried hole. Compared with the prior art, the invention has the advantages of shortening the process flow, thoroughly overcoming the phenomenon of board bending generated by asymmetric laminating structure design due to asymmetric hole layer distribution, solving the problem that a copper layer is relatively thicker and is adverse to the manufacture of a thin circuit because the traditional mechanical blind buried hole process outer layer is electroplated for many times, reducing the pressing frequency of board layers and the manufacture difficulty and improving the product quality.

The invention discloses an integral dynamic rail weighbridge, comprising a weighing body and a weighing bottom framework, wherein bottom ends of the weighing body are provided with a sensor respectively; the top surface of the weighing body is provided with two bearing rails which are arranged in parallel; joints between the bearing rail and a left approach rail and between the bearing rail and a right approach rail are connected with a transition device respectively; the top surfaces of the transition devices are consistent with those of the bearing rails, the left approach rail and the right approach rail; and one end of each transition device is arranged on one base of the approach rails, and the other end of each transition device extends to the weighing body. The integral structure is strong in matching performance, the sensors are used for detecting the weight, data channels and other advanced equipment are used for realizing transmission, treatment and other operations of data, electronic degree is high and operations are quick; the weighing bottom framework of the integral structure is configured and is integrally combined with a pit, the integral structure is simple and the bearing intensity is enough; a horizontal limited rod, a universal joint and other components in the weighing bottom framework performs self-limitation on four directions and eight positions of the weighing body directly, thus the integral design is reasonable; and the transition devices are configured, thus force points of wheels close to the inside of a weighing platform, thereby ensuring smooth transition and steady running.

The invention discloses a method for preparing a multilayer composite structure material of a NiFeBMo-based opening and closing locker. Using NiFeBMo matrix alloy, anti-wear agent, heat conduction agent, reinforcing agent and curing agent as raw materials, the raw material powder of each layer is passed through each layer Structural design and composition calculation, proportioning preparation, vibration mixing, dry hot pressing, curing heat treatment, superimposed sintering and each layer of machining process are made of NiFeBMo-based multilayer composite structure material for opening and closing locker, which has various The layer has the advantages of different composition, different thickness, and large component difference, and presents a gradient distribution trend, which not only saves the relative amount of materials, but also significantly enhances its friction and wear properties. At the same time, the preparation method of the present invention is simple, the preparation process is easy to control, the efficiency is high, the process parameters are stable, the operation is easy to control, and the structure of each layer of the obtained opening and closing locker can be freely divided and repaired, the mechanical performance is stable, and the service life is long.

The invention discloses adhesive used for a semiconductor component organic film. The adhesive comprises polyalkoxysilane with a coupling function and solvent, polyalkoxysilane has a silicon hydroxyl group, and the solvent is composed of 1-methoxy-2-propyl alcohol, 3-aminopropyl silanetriol and 2-methoxy-1-propyl alcohol; according to the adhesive used for the semiconductor component organic film, polyalkoxysilane having the adhesion function is fully hydrolyzed, little low polymer is generated during hydrolysis, the adhesive is good in adhesion effect when used for adhering to an organic base material and an inorganic base material, and a coating layer on the surface of the inorganic base material is prevented from warping or falling; the adhesive is particularly suitable for small-size electronic components with intensive and complex surface graphs.