30results about How to "No subsurface damage" patented technology

The invention relates to a kindle direct publishing crystal micro-nano hygroscopic ultraprecision polishing method based on ultrasonic atomization moisture, which is characterized by first utilizing ultrasound to product water mist, enabling the water mist to be mixed with dry air to form clean water mist air, pressing a polishing head on the crystal surface, introducing the clean water mist air, conducting micro hydrolysis on the portion of the crystal surface contacted with the moist air to form a dissolution layer, then rotating the polishing head, enabling a polishing mat to remove the high point dissolution layer, enabling a vacuum source to absorb surplus moist air, enabling the polishing head to conduct small area local polishing, ensuring polishing evenness in local areas and finally enabling a polishing tool to polish under control of a computer to achieve crystal surface overall situation planarization according to a dwell time function calculated by a material removing rate function R (r, theta) and removing quantity (x, y) of each point. The method does not use traditional polishing liquid, does not need to washing the crystal surface after polishing is finished and is a real damage-free micro-nano processing method due to the fact that no mechanical processing stress exists in the processing process.

The invention discloses SiC optical material processing equipment, which comprises an inductively coupled plasma generator, a working gas supply source (8) and a reaction gas supply source (9). The reaction gas supply source (9) is equipped with a The reactive gas that chemically reacts with SiC after being excited by the inductively coupled plasma generating device, the inductively coupled plasma generating device includes a plasma torch (34) and an induction coil (35) sleeved outside the plasma torch (34) ), the working gas supply source (8) and the reaction gas supply source (9) are connected to the plasma torch (34), one end of the induction coil (35) is connected to the radio frequency power supply (4), and the induction coil The other end of (35) is grounded through the adjustable resistor R1. The invention has the advantages of simple structure, low cost, no subsurface damage and no residual stress layer during processing, and high processing efficiency.

The invention provides a hydration polishing machine, comprising a frame, a main shaft motor, a main shaft, a polishing disk, a vacuum chuck and a sucker motor. The main shaft motor is connected withthe main shaft in a transmission way. The main shaft is arranged inside the frame. The upper end of the main shaft is connected with the polishing disk in a transmission way. The vacuum chuck is located on the upper part of the polishing disk. The vacuum chuck is connected with the sucker motor in a transmission way. The hydration polishing machine also comprises a steam generator, a steam delivery pipe and a basal disk. The outlet of the steam generator is connected with the steam delivery pipe. The inside of the main shaft is provided with a through hole. The steam delivery pipe runs throughthe through holes from bottom to top. The upper end of the main shaft is fixedly connected with the center of the basal disk. The upper part of the basal disk is fixedly connected with the polishingdisk. A transition hollow cavity is arranged between the basal disk and the polishing disk. The steam delivery pipe passes through the basal disk and is communicated with the transition hollow cavity.The bottom of the transition hollow cavity is provided with a drain pipe. The polishing disk is provided with a through hole. When the hydration polishing machine is used for processing the sapphirecrystal, the process quality is excellent, the process precision and the process efficiency are high.

The invention discloses a processing method for chemically and mechanically polishing tantalum (Ta) by employing a fixed abrasive. The method is characterized by comprising the following steps: carrying out polishing on tantalum or a tantalum film by adopting a cerium oxide fixed abrasive polishing pad, controlling the polishing pressure to be 10-100kpa in the machining process, and controlling the rotating speed of a polishing disk to be 50-150rpm, wherein the polishing solution is composed of deionized water free of an abrasive, a surfactant, a complexing agent and a pH modifier; adjusting the pH value of the polishing solution to be 8 to 11; controlling the temperature of the polishing solution within a range of 20-30 DEG C, wherein the flow rate of the polishing solution is 80-150ml / min, so that the nano-precision surface roughness can be obtained, and the surface quality is excellent. According to the processing method disclosed by the invention, the processing efficiency and the surface quality of tantalum are improved; the qualified rate of the finished product is high; no environmental pollution is caused; the cleaning is easy and the cost is low.

The invention discloses a water-based magneto-rheological closed flexible polishing head based on normal force. The polishing head comprises a flexible cutting disc, a magneto-rheological fluid, flexible seal rings, a rotary table, a C-shape magnetic yoke, a shell, baffles, a magnetic coil, a motor, a magnetic shield, shaft couplings, a key, a shaft and abrasive particles. The abrasive particles are evenly distributed on the top surface of the flexible cutting disc; the flexible cutting disc, the flexible seal rings and the rotary table form a seal cavity, and the magneto-rheological fluid is placed in the seal cavity; a rotating shaft is arranged on the center of the bottom surface of the rotary table, blind holes are upwards formed in the center of the rotating shaft, the motor is connected with the shaft through the shaft couplings, and the shaft is connected with the blind holes through the key; the motor is fixed to the top surfaces of the baffles, the motor is separated from the C-shape magnetic yoke through the magnetic shield, the bottom surfaces of the baffles are in contact with the magnetic coil, and the magnetic coil surrounds the closed end of the C-shape magnetic yoke. According to the water-based magneto-rheological closed flexible polishing head based on the normal force, a polishing liquid circulating device is not needed, the size of a flow device is greatly lowered, and the production cost is lowered.

The invention discloses a method for processing soft and crisp LBO crystals based on a consolidated abrasive polishing pad, which is characterized by comprising the following steps: firstly, roughly polishing and machining LBO crystals by the polishing pad of diamond consolidated abrasive of which the granularity is less than or equal to 14 micrometers, wherein in the polishing and machining process, the polishing pressure is controlled to 50-600g / cm<2>, the revolving speed of a polisher is controlled to 10-200 rpm, the pH value of a polishing solution adopted by polishing is controlled to 2-6, and the temperature of the polishing solution is 20-30DEG C to roughly polish the LBO crystals; and then, finely polishing and machining the LBO crystals obtained from the rough machining by the polishing pad of cerium oxide consolidated abrasive of which the granularity is not more than 3 micrometers, wherein the polishing pressure is controlled to 50-600g / cm<2> in the fine polishing and machining process, the revolving speed for polishing is controlled to 10-200rpm, the pH value of a polishing solution adopted by polishing is controlled to 2-6, and the temperature of the polishing solution is 20-30DEG C until the surface quality satisfies a set requirement. The method has the advantages of high processing efficiency and high finished product rate and does not cause environmental pollution.