Ultra-precision surface polishing machining device and method

Abstract

The invention discloses an ultra-precision surface polishing machining device and method. The device comprises a precision two-dimensional moving platform, a standing column precisely moving in the Zdirection, an ultrasonic atomizer, an atomizer holder, an intelligent precision micropump, an ultrasonic power supply and a data processing system. According to the device, the intelligent precision micropump is started to run under the control of the data processing system, polishing agent is conveyed to the ultrasonic atomizer through a polishing agent inputting pipe, then the ultrasonic power supply starts an ultrasonic impulse current under the control of the data processing system, a piezoelectric ceramic plate in the ultrasonic atomizer generates ultrasonic vibration by means of the ultrasonic impulse current, and the polishing agent is atomized into polishing aerosol flow to work on the surface of a workpiece. The ultra-precision surface polishing machining device and method have the advantages that the roughness of the machined surface is uniform, subsurface damage to the workpiece does not occur, and the problems of micro powder agglomeration, nozzle blockage and nozzle wear in the flow-jet polishing machining process do not occur.

Description

technical field [0001] The patent of the present invention relates to precision polishing processing technology, in particular to a "cold and soft" surface ultra-precision polishing processing technology and device. Background technique [0002] At present, the existing surface ultra-precision processing technology generally uses jet flow and magnetic flow as the carrier for processing, but its existence is such as micropowder agglomeration (when the micropowder is nano-scale, the micropowder has a tendency to agglomerate during the formation of the polishing agent water jet. ), nozzle clogging during micro-polishing processing (due to the small size of the micro-polishing water jet nozzle, it is very easy to clog during the process of jet switching), nozzle wear and tear, large impact force and strong magnetic field, etc., which affect its processing effects and scope of application. Contents of the invention [0003] Aiming at the above-mentioned deficiencies in the exi...

AI Technical Summary

Problems solved by technology

[0002] At present, the existing surface ultra-precision processing technology generally uses jet flow and magnetic flow as the carrier for processing, but its existence is such as micropowder agglomeration (when the micropowder is nano-scale, the micropowder has a tendency to agglomerate during the formation of the polishing agent water jet. ), nozzle blockage during micro-polishing processing (due to the small size of the micro-polishing water jet nozzle, it is easy to block during the jet switch process), nozzle wear and tear, large impact force and strong magnetic field, etc., which affect its processing Effect and scope of application

Images