Product
Patsnap Eureka
For R&D, Patsnap Eureka makes reading and utilizing patents & technical documents easy.
Patsnap Eureka AIR
Designed for self-driven R&D workflows. Generate viable solutions, solve complex R&D challenges, empower your innovation with AI.
Patsnap Eureka Materials
Designed for material experts only. Revolutionize your material R&D, from search, analyze, to developing new materials.
Feature
TechResearch
Generate reliable direction feasibility study reports for your R&D in just a few steps.
TechSeek
Discover and master advanced knowledge NOW. Basics, ideas, possibilities, all at once.
TechMind
As an expert in R&D Theories, TechMind can generates customized viable solutions instantly.
TechRisk
Analyze your overall solution with one click, know your potential R&D risks in advance.
TechMonitor
Get weekly tech updates, stay abreast of the latest tech innovations and key insights.
Patents
Literature
Hiro is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
94results about How to "Low cost method" patented technology
Efficacy Topic
Property
Owner
Technical Advancement
Application Domain
Technology Topic
Technology Field Word
Patent Country/Region
Patent Type
Patent Status
Application Year
Inventor
Methods to fabricate thin film transistors and circuits
InactiveUS6225149B1Low costLow thermal budgetTransistorLight-sensitive devicesOptoelectronicsField-effect transistor
A method for fabricating a thin film field effect transistor is described in this invention. The active layer of the thin film transistor (TFT) is formed by a low cost chemical bath deposition method. The fabrication procedure includes deposition of a metal layer on an insulating substrate, patterning of the metal layer to form a metal gate, formation of the di-electric layer, deposition of the active layer and formation of source and drain contacts.
Owner:MCGILL UNIV OFFICE OF TECH TRANSFER
Semiconductor flip-chip package and method for the fabrication thereof
InactiveUS20020031868A1Simple chip placementLow cost methodSemiconductor/solid-state device detailsSolid-state devicesElastic modulusSemiconductor
A flip-chip device and process for fabricating the device employs a multilayer encapsulant that includes a first portion encapsulant having a coefficient of thermal expansion of at most 30 ppm / .degree. C. and an elastic modulus of 2-20 GPa and a second portion comprising a polymer flux having a coefficient of thermal expansion that may exceed 30 ppm / .degree. C.
Owner:INVENSAS CORP
Semiconducting nanowire arrays for photovoltaic applications
InactiveUS20100193768A1Novel design attributeEasy to produceSolid-state devicesSemiconductor/solid-state device manufacturingDopantSilicon nanowires
This invention relates to the fabrication of nanowires for electrical and electronic applications. A method of growing silicon nanowires using an alumina template is disclosed whereby the aluminum forming the alumina is also used as the catalyst for growing the silicon nanowires in a VLS (CVD) process and as the semiconductor dopant. In addition, various techniques for masking off parts of the aluminum and alumina in order to maintain electrical isolation between device layers is disclosed.
Owner:ILLUMINEX CORP
Eyewear with an image projected off of an unassisted eyewear lens to the user
Owner:GRAND IDEA STUDO
Method and apparatus for displaying images on reflective surfaces
InactiveUS20060250574A1Simple designLow costLens assembliesOptical elementsComputer graphics (images)Display device
Owner:GRAND IDEA STUDO
Inkjet media, recording method, recording apparatus, ink-media set, and ink recorded matter
To provide an ideal inkjet recording method capable of full-color printing and of inexpensively providing prints that have a texture similar to those of commercial prints and that offer excellent print quality, image density, image fidelity and smear resistance, by combining a specific recording media and a specific pigment-based inkjet ink. The inkjet recording method uses an ink containing particulate coloring material for printing on a media that includes a substrate composed primarily of cellulose pulp and one or more coated layers formed on at least one surface of the substrate, wherein the media has an air permeability of 0.1 ml / min to 30 ml / min as measured using a Parker Print-Surf.
Owner:RICOH KK
Controlling Flip-Chip Techniques for Concurrent Ball Bonds in Semiconductor Devices
ActiveUS20070228543A1Improve electrical performanceImprove mechanical stabilitySemiconductor/solid-state device detailsSolid-state devicesContact padSemiconductor chip
A device has a first semiconductor chip (101) with contact pads in an interior first set (102) and a peripheral second set (103). A deformed sphere (104) of non-reflow metal such as gold is placed on each contact pad of the first and second sets. At least one additional deformed sphere (105) is placed on the first set pads, forming column-shaped spacers. The first chip is attached to a substrate (110) with a chip attachment location and a third set of contact pads (112) near the location. Low profile bond wires (130) span between the pads of the third set and the second set. A second semiconductor chip (140) of a size has a fourth set of contact pads (141) at locations matching the first set pads. The second chip is placed over the first chip so that the fourth set pads are aligned with the spacers on the matching first set pads, and at least one edge of the second chip overhangs the sphere on at least one pad of the second set. A reflow metal (142) bonds the spacers to the second chip, while the spacers space the first and second chips by a gap (105a) wide enough for placing the wire spans to the second set pads.
Owner:TEXAS INSTR INC
Large-scale photo-bioreactor using flexible materials, large bubble generator, and unfurling site set up method
InactiveUS20080286851A1Reduce manufacturing costLow costBioreactor/fermenter combinationsBiological substance pretreatmentsPhotobioreactorMechanical engineering
A closed photo-bioreactor, which in at least one example comprises a plurality of flexible, repeating, substantially enclosed, parallel chambers flexibly connected along their lengths, where a liquid growth media is substantially still without the need for turbulent mixing of the bulk liquid. In many examples, each is connected into integrated, flexible pipelines that serve to supply gas to the chambers, to vent gas from the chambers, and to fill and drain the individual photo-bioreactor chambers of their liquid contents. In some installations, a bioreactor will be rolled up using, for example, a long rod as a spool, for storage and transportation. Some examples will be manually unfurled and positioned on an angled site including, for example, an earthen berm. In many embodiments, a photo-bioreactor will be manufactured from thin plastics using low cost manufacturing techniques. In at least one example, a photo bioreactor is described in which bubbles with a substantially non-convex shape are introduced to mix the liquid contents.
Owner:SUNRISE RIDGE HLDG
Tool holder assembly and method for modulation-assisted machining
ActiveUS20060251480A1Accurately and repeatably obtainedLarge deformationTransportation and packagingAuxillary equipmentMachining processTool holder
A tool holder assembly and method for intentionally inducing modulation in a machining process. The tool holder assembly is configured for mounting in a tool block on a machining apparatus and includes a tool holder body configured to be secured to the tool block of the machining apparatus, a tool holder mounted on the tool holder body and configured for securing a cutting tool thereto, and a device for imposing a superimposed modulation on the tool holder so as to move the cutting tool relative to the tool holder body and thereby relative to the tool. The tool holder assembly is useful in a process for producing chips having a desired shape and size, and particularly to a method of controllably producing nanocrystalline chips.
Owner:PURDUE RES FOUND INC
Treatment of fly ash
InactiveUS20090314185A1Effectively surface oxidationEnhance ionized air effectElectrolysis componentsSolid waste managementUltraviolet radiationUltraviolet
Treated carbon-containing fly ash with reduced surfactant-adsorbing capacity is prepared by processing involving contacting the fly ash with ionized gas prepared from a humid gas feed, such as humid air. Treated fly ash with reduced ammonia content is prepared by processing involving contacting the fly ash with ionized gas prepared from a humid gas feed, such as humid air, or exposing the fly ash to microwave radiation or ultraviolet radiation.
Owner:MATRIX INC
Data processing apparatus and method, and network system
ActiveUS20100149308A1Quality improvementLow cost methodSpecial service provision for substationTelevision conference systemsNetworked systemComputer terminal
In a network system for sending data to a plurality of terminals, a data processing apparatus has a plurality of coding units that code outgoing data including at least video or voice data for transmission to terminals over a network. The data processing apparatus obtains information about the terminals, groups the terminals according to the information, and transmits the coded outgoing data obtained from each coding unit to a different group of terminals. Appropriate grouping of the terminals conserves both network and coding resources and enables the quality of the data transmitted to the terminals to be improved at a low cost.
Owner:OKI ELECTRIC IND CO LTD
Low-cost substrates having high-resistivity properties and methods for their manufacture
ActiveUS20090321873A1Reduce thicknessHigh resistivity propertySolid-state devicesSemiconductor/solid-state device manufacturingHigh resistivityEngineering
In one embodiment, the invention provides substrates that are structured so that devices fabricated in a top layer thereof have properties similar to the same devices fabricated in a standard high resistivity substrate. Substrates of the invention include a support having a standard resistivity, a semiconductor layer arranged on the support substrate having a high-resistivity, preferably greater than about 1000 Ohms-cm, an insulating layer arranged on the high-resistivity layer, and a top layer arranged on the insulating layer. The invention also provides methods for manufacturing such substrates.
Owner:SOITEC
Charged particle beam detection system
InactiveUS20050274888A1Improve the level ofEasy to useSpectrometer detectorsMaterial analysis by electric/magnetic meansIntegratorDetector array
A charged particle beam detection system that includes a Faraday cup detector array (FCDA) for position-sensitive charged particle beam detection is described. The FCDA is combined with an electronic multiplexing unit (MUX) that allows collecting and integrating the charge deposited in the array, and simultaneously reading out the same. The duty cycle for collecting the ions is greater than 98%. This multiplexing is achieved by collecting the charge with a large number of small and electronically decoupled Faraday cups. Because Faraday cups collect the charge independent of their charge state, each cup is both a collector and an integrator. The ability of the Faraday cup to integrate the charge, in combination with the electronic multiplexing unit, which reads out and empties the cups quickly compared to the charge integration time, provides the almost perfect duty cycle for this position-sensitive charged particle detector. The device measures further absolute ion currents, has a wide dynamic range from 1.7 pA to 1.2 μA with a crosstalk of less than 750:1. The integration of the electronic multiplexing unit with the FCDA further allows reducing the number of feedthroughs that are needed to operate the detector.
Owner:UNIV OF WASHINGTON
Tool holder assembly and method for modulation-assisted machining
ActiveUS7587965B2Accurately and repeatably obtainedLarge deformationTransportation and packagingAuxillary equipmentMachining processTool holder
Owner:PURDUE RES FOUND INC
Method for generating identification code of semiconductor device, method for identifying semiconductor device and semiconductor device
InactiveUS20060050580A1Low cost methodAccurate identificationDigital data processing detailsRead-only memoriesDevice materialEngineering
A semiconductor device including memory cells such as flip-flops, RAMs or SRAMs is powered on, and first logic signals of Hi or Lo output from the respective memory cells are obtained. A combination of the logic signals is used as a unique identification code for identifying a semiconductor device.
Owner:PANASONIC CORP
Sealing and protecting integrated circuit bonding pads
InactiveUS20050073048A1Firmly assembledLow cost methodSemiconductor/solid-state device detailsSolid-state devicesOhmic contactMetal
A metal structure (600) for a bonding pad on integrated circuit wafers, which have interconnecting metallization (101) protected by an insulating layer (102) and selectively exposed by windows in the insulating layer. The structure comprises a patterned seed metal layer (104) positioned on the interconnecting metallization exposed by the window so that the seed metal establishes ohmic contact to the metallization as well as a practically impenetrable seal of the interface between the seed metal and the insulating layer. Further, a metal stud (301) is formed on the seed metal and aligned with the window. The metal stud is conformally covered by a barrier metal layer (501) and an outermost bondable metal layer (502).
Owner:TEXAS INSTR INC
Rapid triglyceride assay for use in pulp pitch control
Enzymatic methods are provided for determining the surface triglycerides content in a sample of wood pulp. The methods preferably comprise reacting triglycerides which are present on the surface of the wood pulp fibers in the sample in the presence of a lipase to form glycerol and fatty acids, and then determining the difference between the amount of free glycerol present in the sample and the amount of glycerol formed from said triglycerides. The method is useful as a quick, portable, accurate, and low cost assay for assessing the amount of triglycerides present at various sample points in pulp and paper mills, which advantageously serves as a diagnostic tool for use in controlling the undesirable deposition of pitch during the papermaking process.
Owner:ENZYMATIC DEINKING TECH LLC
Light source unit and object reader
InactiveUS20090027915A1Low cost methodLittle lossPhotographic printingPictoral communicationLight sourceOptoelectronics
A light source unit and reader can include a line light source that is attached to a radiator and a rod lens that is attached above the line light source. The radiator with the line light source and the rod lens attached thereto, and a linear strip-shaped reflector arranged in front of the rod lens, are housed in a carriage. The carriage is supported beneath contact glass and movable in a direction normal to a longitudinal axis of the line light source. The lens has a section in a plane normal to a longitudinal axis of the lens, in which a surface of the lens facing the light source has a curved line that expands or is convexly facing toward the light source. The opposite surface of the lens from the light source has composite curves including a plurality of continuous curves with different radii of curvature. The composite curves are located on both sides of a plane containing the optical axis of the LED and expand or are convex in an opposite direction from the light source.
Owner:STANLEY ELECTRIC CO LTD
User positioning
InactiveUS7715849B2Low cost methodSpecial service for subscribersWireless commuication servicesPropagation delayReal-time computing
The invention proposes a method for locating a network element, comprising the steps of obtaining (S1) the coordinates (xS, yS) of a second network element (BTS) to which the first network element (MS) is connected or attached; detecting (S2) a serving area (S), which is served by the second network element (BTS); detecting (S3) a propagation delay of the first network element with respect to the second network element (BTS); determining (S4) a propagation delay depending area (C), which is an area having a distance to the second network element (BTS) based on the propagation delay and a width based on the propagation delay; and forming (S5) an intersection area (I) of the serving area (S) and the propagation delay depending area (C); wherein a location estimate of the first network element (MS) is determined (S6) from the intersection area (I). Thus, an uncertainty area where a first network element is located can be reduced and the location accuracy can be improved.
Owner:WSOU INVESTMENTS LLC
Pet food and processes of producing the same
InactiveCN101442912ALow densityReduce heatAnimal feeding stuffAccessory food factorsBiotechnologyEngineering
The present invention provides methods and products made thereby, wherein a reactive starch constituent, including an edible constituent, is thermally treated to react it, preferably in a dynamic process environment, to produce products ranging from high to quite low densities and from very strong to soft to apparently dry textures. The wide range of textures enables the provision of food products such as low calorie, digestible and safe, long duration pet food chews. Cooking is preferably carried in an extruder, preferably at low moisture or in the total absence of added water. The methods of dynamic cooking reduce cost in a number of ways including but not limited to decreased process steps, increased throughput, decreased capital expenses and decreased raw product cost. The present invention provides an edible composition that is produced using pre-activated particles, mixing them with solvents providing bonds, inputting energy into the mixture via an extrusion process, which results in a firm cohesive material.
Owner:NESTEC SA
Diffuse reflecting optical construction
ActiveUS20130271840A1Low costLow cost methodDiffusing elementsCoatingsDiffuse reflectionSolar mirror
A transparent multi-layer optical construction that reflects light in a diffuse manner and transmits light in an undistorted manner. The optical construction can be made as a sunglass lens or as a thin film to be used as window film. The multi-layer optical construction is, in part, a combination of surface form and surface texture combined with a reflective medium and a scratch resistant hard coating.
Owner:DILLON STEPHEN M
Charged particle beam detection system
InactiveUS7282709B2Improve the level ofEasy to useThermometer detailsStability-of-path spectrometersIntegratorDetector array
Owner:UNIV OF WASHINGTON
Sealing and protecting integrated circuit bonding pads
InactiveUS6927493B2Firmly assembledLow cost methodSemiconductor/solid-state device detailsSolid-state devicesOhmic contactEngineering
Owner:TEXAS INSTR INC
Method and structure to enhance temperature/humidity/bias performance of semiconductor devices by surface modification
InactiveUS20050116357A1Good semiconductor performanceLow cost methodSemiconductor/solid-state device detailsSolid-state devicesSemiconductor chipApplication specific
A method is disclosed of repairing wirebond damage on semiconductor chips such as high speed semiconductor microprocessors, application specific integrated circuits (ASICs), and other high speed integrated circuit devices, particularly devices using low-k dielectric materials. The method involves surface modification using reactive liquids. In a preferred embodiment, the method comprises applying a silicon-containing liquid reagent precursor such as TEOS to the surface of the chip and allowing the liquid reagent to react with moisture to form a solid dielectric plug or film (50) to produce a barrier against moisture ingress, thereby enhancing the temperature / humidity / bias (THB) performance of such semiconductor devices.
Owner:GLOBALFOUNDRIES INC
Production Method of Multilayer Electronic Device
InactiveUS20080053593A1Improve stacking effectReduce defective rateStacked capacitorsOptoelectronicsElectrode
A production method of a multilayer electronic device, comprising the steps of forming a green sheet 10a; forming an electrode layer 12a on a surface of the green sheet 10a; stacking the green sheets 10a, each having the electrode layer 12a thereon, to form a green chip; and firing the green chip: wherein before stacking the green sheet 10a having the electrode layer 12a formed thereon, an adhesive layer 28 is formed on a surface on the electrode layer side of the green sheet 10a having the electrode layer 12a formed thereon; and the green sheet 10a having the electrode layer 12a formed thereon is stacked via the adhesive layer 28.
Owner:TDK CORPARATION
Method for characterizing integrated circuits for identification or security purposes
ActiveUS20080111561A1Low costLow cost methodResistance/reactance/impedenceMaterial analysis using microwave meansIntegrated circuitMicrowave scattering
A method of detecting small changes to a complex integrated circuit measuring RF / microwave scattering parameters between every pin over a wide frequency range. The data from a characterization of a known good integrated circuit is stored and compared to each subsequent integrated circuit of unknown background.
Owner:THE BOEING CO
Copper-metallized integrated circuits having electroless thick copper bond pads
ActiveUS20070031697A1Low cost methodImprove reliabilitySolid-state devicesSemiconductor/solid-state device manufacturingContact padDevice material
A metal structure (100) for a contact pad of a semiconductor device, which has interconnecting traces of a first copper layer (102). The substrate is protected by an insulating overcoat (104). In the structure, the first copper layer of first thickness and first crystallite size is selectively exposed by a window (110) in the insulating overcoat. A layer of second copper (105) of second thickness covers conformally the exposed first copper layer. The second layer is deposited by an electroless process and consists of a transition zone, adjoining the first layer and having copper crystallites of a second size, and a main zone having crystallites of the first size. The second thickness is selected so that the distance a void from the second layer can migrate during the life expectancy of the structure is smaller than the combined thicknesses of the first and second layers. A layer of nickel (106) is on the second copper layer, and a layer of noble metal (107) is on the nickel layer.
Owner:TEXAS INSTR INC
Method for determining the rotational velocity of an axle and detecting a locked axle condition
InactiveUS7917257B2Reliably determinedLow cost methodMultiple dynamo-motor startersDigital data processing detailsRotation velocityEngineering
A method for detecting a rotational velocity of a traction motor in a vehicle comprising: obtaining a traction motor signal having at least one phase, wherein the traction motor signal is responsive to an operating condition of the traction motor in an electrically unexcited state. The method also includes processing the traction motor signal to create an indication result based on a frequency of the traction motor signal and determining rotational velocity of the traction motor based on the indication result.
Owner:GE GLOBAL SOURCING LLC
Structure and method for contact pads having an overcoat-protected bondable metal plug over copper-metallized integrated circuits
InactiveUS20050215048A1Reduce riskImprove assembly yieldSemiconductor/solid-state device testing/measurementSemiconductor/solid-state device detailsCopper interconnectContact pad
A metal structure for a contact pad of an integrated circuit (IC), which has copper interconnecting metallization (311). A portion (301) of this metallization is exposed to provide a contact pad to the IC. A conductive barrier layer (330) is positioned on the exposed portion of the copper metallization. A plug (350) of bondable metal, preferably aluminum between about 0.4 and 1.4 μm thick, is positioned on the barrier layer. A protective overcoat layer (320) surrounds the plug and has a thickness (320b) so that the exposed surface (322) of the plug lies at or below the exposed surface (320a) of the overcoat layer. Optionally, a portion (321) of the overcoat layer between about 0.1 and 0.3 μm wide may overlap the perimeter of the plug.
Owner:TEXAS INSTR INC
Through-Silicon Vias and Interposers Formed by Metal-Catalyzed Wet Etching
ActiveUS20140264937A1Low costReduce thermal resistanceSemiconductor/solid-state device detailsSolid-state devicesEtchingInterposer
Provided are methods for making a through-silicon via feature in a silicon substrate and related systems, such as by forming a noble metal structure on a silicon substrate support surface to generate silicon substrate contact regions that are in contact with or proximate to the noble metal structure; exposing at least a portion of the silicon substrate support surface and noble metal structure to an etchant to preferentially etch the silicon substrate contact regions compared to silicon substrate non-contact regions until the etch front reaches the silicon substrate bottom surface.
Owner:X DISPLAY CO TECH LTD
Who we serve
- R&D Engineer
- R&D Manager
- IP Professional
Why Patsnap Eureka
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com