The invention discloses an
LDMOS which comprises a P-type substrate, an N-type epitaxial layer, a P trap, a first N-type
doping region, a groove, a first
metal layer and a source-
electrode metal layer. The P trap is located in the N-type
doping region, the first N-type
doping region is arranged in the P trap, and the groove penetrates through the first N-type doping region, the P trap and the N-type epitaxial layer until the P-type substrate. A first oxidation layer is arranged on the side wall of the groove. The groove is filled with first
polycrystalline silicon of P-type doping. The upper surface of the first
polycrystalline silicon is located inside the P trap and is lower than the first N-type doping region. The first
metal layer covers the upper surface of the first
polycrystalline silicon and covers the first N-type doping region. The source-
electrode metal layer is located on the back face of the P-type substrate. The invention further discloses a manufacturing method of the
LDMOS. A source
electrode is led out from the back face of the substrate instead of being originally led out from the front face of the substrate, the design area of the original source electrode region on the front face is effectively reduced, the design width of a channel in a gate region is increased, and the
on resistance is reduced.