The invention provides a method for increasing
breakdown voltage of a
gate oxide layer of a groove-type VDMOS (Vertical Double-diffused
Metal Oxide Semiconductor) device. The method comprises the following steps of providing a
silicon substrate with an epitaxial layer, forming an initial
oxide layer on the epitaxial layer of the
silicon substrate, performing photoetching and
etching, forming an active region graph on the initial
oxide layer, performing
ion injection, forming an active region in the epitaxial layer below the active region graph, performing the photoetching, forming a
photoresist layer with a loop region graph and a gate graph, sequentially performing wet method
etching and dry method
etching, forming the loop region graph and the gate graph on the initial
oxide layer, performing the
ion injection, forming a loop region in the epitaxial layer below the loop region graph, removing the
photoresist layer, forming a
hard mask on the epitaxial layer and the initial oxide layer, performing the etching, forming a groove in the active region, removing the
hard mask, and forming a gate above the gate graph. The method can effectively remove a damaged part on the surface of the epitaxial layer of the
silicon substrate caused by operation such as the etching, so that the quality of the
gate oxide layer of the device can be ensured.