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Backside laser membrane opening method and system of back passivation solar cell

A solar cell and back passivation technology, which is applied in the direction of circuits, electrical components, sustainable manufacturing/processing, etc., can solve problems such as adhesion, achieve the effects of improving failure ratio, simplifying back passivation process, and improving production efficiency

Inactive Publication Date: 2016-02-10
TRINA SOLAR CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The present invention aims at the problem of dust adhesion in the laser slotting process of the back surface of the back passivated solar energy in the prior art, and provides a back laser film opening method of the back passivated solar cell, which simplifies the flow process and improves the parallel resistance of the cell, Reduce reverse leakage and reduce component power loss

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  • Backside laser membrane opening method and system of back passivation solar cell
  • Backside laser membrane opening method and system of back passivation solar cell
  • Backside laser membrane opening method and system of back passivation solar cell

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Embodiment Construction

[0022] The structure of the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. In the present invention, the same parts as the prior art will refer to the prior art.

[0023] Such as figure 2 As shown, the back surface laser opening method of the back passivation solar cell of the present invention includes a laser slotting process and a dust removal process, and the dust removal process is performed synchronously with the laser slotting process. 2 Air purging process, N 2 The gas is pressurized gas, and its pressure range is 0.4-0.8Mpa. In this embodiment, the pressure is controlled at about 0.6Mpa; N 2 The gas outlet is located at the starting point of the laser groove. It also includes a dust extraction process synchronized with the dust removal process.

[0024] Increase N 2 After the gas purging process, the attached dust on the back surface of the silicon wafer can be completely removed. The back s...

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Abstract

The invention discloses a backside laser membrane opening method of a back passivation solar cell. The backside laser membrane opening method comprises a laser grooving process and a dust removal process and is characterized in that the dust removal process is a pressurized gas blowing process synchronously carried out with the laser grooving process. Meanwhile, the invention also discloses a backside laser membrane opening system applying the above method of the back passivation solar cell. The backside laser membrane opening system comprises a laser grooving device and a dust removal device and is characterized in that the dust removal device is a pressurized gas blowing air knife, wherein the pressurized gas blowing air knife is arranged at a starting point position of laser grooving. By the method and the system, the problem of dust attachment during back surface laser grooving of the back passivation solar cell in the prior art is solved. With the method and the system, the back passivation process is simplified, the parallel resistance of a cell piece is improved, the reverse electric leakage is reduced, and the power loss of a module is reduced.

Description

Technical field [0001] The present invention relates to a back-passivated solar cell, in particular to a back-passivated solar cell's back laser opening method. At the same time, the present invention also relates to a back-passivated solar cell using the above method. The back laser opening system. Background technique [0002] In order to improve the photoelectric conversion efficiency of solar cells, the current solar cells form a passivation film on the back by chemical deposition on the back, and remove the partial passivation film by laser grooving. The conventional process includes: texturing, diffusion , Back surface polishing, cleaning, back laminated film, laser back grooving, laser post cleaning, screen printing + sintering, such as figure 1 Shown. [0003] At present, there are mainly two types of laser equipment commonly used for back passivation and back slotting: picosecond laser and nanosecond laser. In the process of silicon wafer processing, picosecond lasers ha...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/18H01L31/0216H01L21/67
CPCY02P70/50
Inventor 李慧董建文
Owner TRINA SOLAR CO LTD
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