50results about How to "Expand the scope of application scenarios" patented technology

The invention belongs to the technical field of two-dimensional codes, and provides a method for demonstrating multi-dimensional multi-industry information of two-dimensional codes. The method includes steps of acquiring information and dividing permission of the information; configuring normal information demonstration pages and special information demonstration pages; acquiring code account information of code scanning parties with special permission, issuing special permission identification to the code scanning parties with the special permission and issuing normal permission identification to other code scanning parties; acquiring code scanning requests with permission identification; recognizing the permission identification and transmitting the corresponding information demonstration pages to the code scanning parties. The permission of the information includes normal permission and the special permission. The normal information demonstration pages correspond to the normal permission, the special information demonstration pages correspond to the special permission, and each normal information demonstration page and the corresponding special information demonstration page arelinked with the same corresponding two-dimensional code. The invention further provides a platform for demonstrating the multi-dimensional multi-industry information of the two-dimensional codes. Themethod and the platform have the advantages that the method and the platform are smart in conception, and the technical problems of single information of existing two-dimensional codes, leakage of privacy information of enterprises, individuals and the like and inconvenience in use in the prior art can be solved by the aid of the method and the platform.

The invention belongs to the field of two-dimensional code technology, and proposes a two-dimensional code multi-dimensional and multi-industry information display method, which includes the following steps: obtaining information and dividing its authority, wherein the authority includes ordinary authority and special authority; configuration and ordinary authority The corresponding general information display page, the special information display page corresponding to the special authority, the general information display page and the special information display page are all linked to the same QR code; obtain the account information of the scanning party with special authority, and issue a special Authorization ID, issue common authorization IDs to other code-scanners; obtain code-scanning requests, which carry authorization IDs; identify authorization IDs, and send corresponding information display pages to the code-scanners. A two-dimensional code multi-dimensional multi-industry information display platform is also proposed. The invention is cleverly conceived, and solves the technical problems in the prior art that the two-dimensional code information is single, private information of enterprises and individuals is leaked, and it is often inconvenient to use.

The invention provides a packaging structure of an Internet-of-things chip. The packaging structure comprises a totally closed injection molded body, an NFC coil film or board, a main chip, a cell board, a wireless charging coil film or board and a substrate. The NFC coil film or board, the main chip, the cell board and the wireless charging coil film or board are flatly distributed on the front surface of the substrate and are adhered and fixed through insulating glue and are welded with a substrate through welding wires, thereby forming electric connection. Injection molding is performed ona welded product for forming the totally closed injection molded body. Furthermore the totally closed injection molded body and the front surface of the substrate package the NFC coil film or board, the main chip, the cell board and the wireless charging coil film or board. After closing, no electrical interface exists on the integral surface. According to the packaging structure, no outward physical electrical connection interface exists, and the chip can operate in water or an environment in which an original electronic device cannot operate in human body, thereby greatly improving application scene range of the Internet-of-things chip.

The invention provides a packaging structure for chips without electrical connection, including a fully enclosed injection molded body, an NFC coil film or board, a main chip, a battery board, a wireless charging coil film or board, and a substrate that are stacked and fixed sequentially from top to bottom between the NFC coil film or plate and the main chip, between the main chip and the battery plate, between the battery plate and the wireless charging coil film or plate, between the wireless charging coil film or plate and the substrate, and The main chip and the substrate are respectively welded by welding wires; the welded product is injection molded to form the fully enclosed injection molding body, and the upper surface of the fully enclosed injection molding body and the substrate is connected to the NFC coil film or board, the main chip, the battery, etc. The board, wireless charging coil film or board is wrapped inside, leaving no electrical interface on the surface. The whole chip of the present invention does not have any external physical electrical connection interface, which can make the chip work in a harsh environment and greatly improve the scope of application scenarios of the Internet of Things chip.