A packaging structure and method for a non-electrically connected chip

Abstract

The invention provides a packaging structure for chips without electrical connection, including a fully enclosed injection molded body, an NFC coil film or board, a main chip, a battery board, a wireless charging coil film or board, and a substrate that are stacked and fixed sequentially from top to bottom between the NFC coil film or plate and the main chip, between the main chip and the battery plate, between the battery plate and the wireless charging coil film or plate, between the wireless charging coil film or plate and the substrate, and The main chip and the substrate are respectively welded by welding wires; the welded product is injection molded to form the fully enclosed injection molding body, and the upper surface of the fully enclosed injection molding body and the substrate is connected to the NFC coil film or board, the main chip, the battery, etc. The board, wireless charging coil film or board is wrapped inside, leaving no electrical interface on the surface. The whole chip of the present invention does not have any external physical electrical connection interface, which can make the chip work in a harsh environment and greatly improve the scope of application scenarios of the Internet of Things chip.

Description

technical field [0001] The invention relates to a chip package, in particular to a fully enclosed package method and structure of an Internet of Things chip. Background technique [0002] With the rapid development of SOC chip technology, the Internet of Things technology is becoming more and more important and the demand is increasing. However, an important problem currently restricting IoT chips is that all devices and basic chips still rely on traditional physical electrical devices, such as power sockets, debugging sockets, etc., for connection, information exchange and power charging, etc., so the devices cannot work. with harsh liquids or other harsh environments. [0003] After retrieval, most of the current research on chip packaging technology is to improve the performance of the chip, and there are few studies on the packaging technology of the chip in order to adapt to the working environment. Therefore, the present invention proposes a chip packaging design meth...

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a chip packaging structure and packaging method. The whole chip does not have any external physical and electrical connection interface, and a single chip can work independently without an external printed circuit board. Charging and charging can be completed wirelessly. Communication can make the chip work in the environment where the original electronic equipment can't work in the middle of the water and the human body, which greatly improves the scope of application scenarios of the Internet of Things chip

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