A packaging structure and packaging method for an Internet of Things chip

Abstract

The invention provides a packaging structure of an Internet-of-things chip. The packaging structure comprises a totally closed injection molded body, an NFC coil film or board, a main chip, a cell board, a wireless charging coil film or board and a substrate. The NFC coil film or board, the main chip, the cell board and the wireless charging coil film or board are flatly distributed on the front surface of the substrate and are adhered and fixed through insulating glue and are welded with a substrate through welding wires, thereby forming electric connection. Injection molding is performed ona welded product for forming the totally closed injection molded body. Furthermore the totally closed injection molded body and the front surface of the substrate package the NFC coil film or board, the main chip, the cell board and the wireless charging coil film or board. After closing, no electrical interface exists on the integral surface. According to the packaging structure, no outward physical electrical connection interface exists, and the chip can operate in water or an environment in which an original electronic device cannot operate in human body, thereby greatly improving application scene range of the Internet-of-things chip.

Description

Technical field [0001] The invention relates to a chip packaging, in particular to a fully enclosed packaging method and structure of an Internet of Things chip. Background technique [0002] With the rapid development of SOC chip technology, the Internet of Things technology is becoming more and more important and the demand is increasing. However, an important issue that currently restricts IoT chips is that all devices and basic chips still rely on traditional physical electrical, such as power sockets, debugging sockets, etc., for connection for information exchange and power charging applications, so the equipment cannot work In harsh liquids or other harsh environments, such as in biomedicine for swallowing by patients, to detect internal organs in patients, or for implantation under the skin to detect physiological data. If there is a physical electrical interface on the outside of the chip, it is obviously not suitable for working in the environment of gastric juice or i...

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a chip packaging structure and packaging method. The whole chip does not have any external physical and electrical connection interface, and a single chip can work independently without an external printed circuit board. Charging and charging can be completed wirelessly. Communication can make the chip work in the environment where the original electronic equipment can't work in the middle of the water and the human body, which greatly improves the scope of application scenarios of the Internet of Things chip

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