Packaging structure and packaging method of no-electric-connection chip

Abstract

The invention provides a packaging structure of a no-electric-connection chip. The packaging structure comprises the components of a totally closed injection molded member, an NFC coil film or board,a main chip, a cell board, a wireless charging coil film or board and a substrate, wherein the NFC coil film or board, the main chip, the cell board, the wireless charging coil film or board and the substrate are successively laminated from top to bottom and are adhered for fixation. The NFC coil film or board is welded with the main chip through a welding wire; the main chip is welded with the cell board through a welding wire; the cell board is welded with the wireless charging coil film or board through a welding wire; the wireless charging coil film or board is welded with the substrate through a welding wire; and the main chip is welded with the substrate through a welding wire. Injection molding is performed on the welded product for forming a totally closed injection molded member.Furthermore the totally closed injection molded member and the upper surface of the substrate package the NFC coil film or board, the main chip, the cell board and the wireless charging film or board,and no electric interface exists on the surface. According to the packaging structure, no outward physical electric connecting interface exists on the whole chip and the chip can operate in an adverse environment, thereby greatly improving application scene range of an Internet-of-things chip.

Description

technical field [0001] The invention relates to a chip package, in particular to a fully enclosed package method and structure of an Internet of Things chip. Background technique [0002] With the rapid development of SOC chip technology, the Internet of Things technology is becoming more and more important and the demand is increasing. However, an important problem currently restricting IoT chips is that all devices and basic chips still rely on traditional physical electrical devices, such as power sockets, debugging sockets, etc., for connection, information exchange and power charging, etc., so the devices cannot work. with harsh liquids or other harsh environments. [0003] After retrieval, most of the current research on chip packaging technology is to improve the performance of the chip, and there are few studies on the packaging technology of the chip in order to adapt to the working environment. Therefore, the present invention proposes a chip packaging design meth...

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a chip packaging structure and packaging method. The whole chip does not have any external physical and electrical connection interface, and a single chip can work independently without an external printed circuit board. Charging and charging can be completed wirelessly. Communication can make the chip work in the environment where the original electronic equipment can't work in the middle of the water and the human body, which greatly improves the scope of application scenarios of the Internet of Things chip

Images