30results about How to "Constant impedance" patented technology

A connector or first plug is provided for receiving a mating plug or second plug, forming a constant impedance connection. The center conductor of the first plug is supported for enhanced structural integrity with a cap attached over a portion of the center conductor that extends beyond the outer conductor portion of the same plug. The constant impedance connection consists of the two plugs partially or fully engaged. The mating plug has an outer conductor that projects beyond the inner conductor, and is made to receive the connector or first plug portions. Once engaged, the connector and mating plug have mating dimensions that satisfy an impedance equality expression for a relationship between the inner conductor cap's outer diameter, the outer conductor's inner diameter, and the dielectric constant.

In an I / O circuit unit located in the periphery of a semiconductor chip, a plurality of ESD protection transistors are provided in each I / O cell. An electrode pad cell has a two-layer structure including a lower electrode pad and an upper electrode pad. The electrode pad cell is arranged so as to be present over a connection line of ESD protection transistors of an associated I / O cell. With part of the first pad portion of an adjacent electrode pad located in an end portion of the second pad portion of the electrode pad, the second pad portion can not extend further onward but the third pad portion having a smaller width than that of the second pad portion is arranged onward. Thus, destruction of the ESD protection transistors is not caused, so that an internal circuit is protected from an electrostatic discharge which comes into electrode pads.

A non-contact power transmission device equipped with a ground-side device and a vehicle-side device. The ground-side device has a primary-side coil to which alternating-current power is input. The vehicle-side device includes a secondary-side coil, a battery, a secondary-side matching device, and a charging device. The secondary-side coil receives alternating-current power from the primary-side coil in a non-contact manner. The secondary-side matching device is provided between the secondary-side coil and the battery, and has a predetermined fixed inductance and fixed capacitance. The charging device has a switching element that performs a switching operation with a prescribed cycle. The charging device adjusts the duty ratio of the switching operation in accordance with the impedance of a load.

A switching combiner unit (SCU) may combine coherent RF or microwave outputs from multiple power amplifier units (PAUs). Each SCU may be able to be switched between an on-line mode (on-line PAU), during which the PAU amplifies a coherent instance of the same RF or microwave input signal and delivers that amplified input signal to an output, and a standby or off-line mode (standby / off-line PAU), during which the PAU does not amplify an instance of the same RF or microwave input signal or deliver an amplified input signal to the output. The SCU may include an input port that connects to each of the PAU outputs; a control signal input that receives one or more control signals that indicate whether each PAU is in the on-line or standby / off-line mode; signal combining circuitry that coherently sums the outputs from all of the on-line PAUs, while simultaneously isolating the standby / off-line PAUs from the output of the SCU and the outputs of the on-line PAUs; and an SCU output port that delivers the coherently summed outputs from all of the on-line PAUs.

A high power RF or microwave amplifier may amplify an RF or microwave input signal. The high power RF or microwave amplifier may include an input signal divider (DIV) that has an input port that receives the RF or microwave input signal and that divides this input signal into multiple sub-input signals; multiple power amplifier units (PAUs), each having an input port that receives an RF or microwave signal, an output port that delivers an amplified version of the received RF or microwave signal, and an interface port; an interface control unit (ICU) that communicates with each PAU through its interface port; and an output signal switching combiner unit (SCU) that coherently sums the outputs of the on-line PAUs and delivers this to an output port. The ICU may set one or more of the PAUs to amplify one of the multiple sub-input signals (hereinafter referred to as on-line PAU in on-line mode); monitor each on-line PAU to verify that it is operating within one or more pre-determined PAU specifications; and upon detecting that one of the on-line PAUs is no longer operating within the one or more pre-determined PAU specifications (malfunctioning PAU), set the malfunctioning PAU not to amplify one of the multiple sub-input signals and not to be available to be switched to the on-line mode by the ICU (hereinafter referred to as off-line PAU in off-line mode).

Operational transconductance amplifiers have a natural signal capacity format in which signal performance can be expressed in terms of fixed percentages. Input signal can be applied to Operational transconductance amplifiers in this natural signal capacity format in order to optimize performance. A signal which drives a given Operational transconductance amplifier architecture to produce an output current which is at 50% of it's maximum available output current can be thought of as applying an input voltage which is at 50% of an Operational transconductance amplifier's maximum input voltage capacity. In this input / output channel capacity format, dc offset, distortion, and noise all are temperature independent. By translating input signal between a voltage format to a channel capacity format using the methods of this invention, output signal performance attributes such as gain, frequency response, dc offset, temperature drift, distortion, and noise, can all be optimize over the full temperature range for all types of Operational transconductance amplifier architectures and applications.