The invention relates to jet dispensing equipment for
chip packaging. The equipment comprises a
machine base, a driving mechanism, a dispensing mechanism driven by the driving mechanism and a positioning clamp arranged below the dispensing mechanism, wherein the dispensing mechanism comprises a glue
barrel and a glue outlet
pipe arranged at the bottom of the glue
barrel, the glue outlet
pipe comprises a glue supply section and a glue outlet section, a glue pushing
assembly is arranged between the glue supply section and the glue outlet section, a guiding
assembly cooperating with the glue pushing
assembly is arranged above the positioning clamp accordingly, the glue pushing assembly is used for
cutting off communication between the glue supply section and the glue outlet section before glue dispensing operation, and a glue pushing
piston arranged in the glue pushing assembly is pushed downwards to extrude glue along an inner wall of the glue outlet section by means of
pneumatic pressure under the action of the guiding assembly during the glue dispensing operation. The equipment solves the problems that when glue spraying equipment extrudes the glue, the amount of the glue extruded each time has large deviation,
extrusion is uneven, when a translation driving force fault occurs, glue spraying cannot be stopped in time, so that a whole circuit board is easily scrapped. And when a translation driving force fault occurs, glue spraying cannot be stopped in time, so that the whole circuit board is easily scrapped.