4448results about "Gas flame welding apparatus" patented technology

The present invention provides an electronic component mounting apparatus, wherein a high speed operation can be provided by simplifying the structure of a mounting head and wherein the working efficiency can be improved by eliminating the use of the mounting head for a coating process. In the electronic component mounting apparatus, a flux is coated on chips supplied to an electronic component feeding unit while bump formation faces are directed upward. The chips are mounted on a substrate. A holding head receives the chips extracted from an adhesive sheet by a mounting head and is inverted relative to a stage on which a flux is spread. As a result, the bumps of the chips are covered with the flux and are flattened, and after the holding head is returned to the original stage, the chips on the stage are extracted and mounted on the substrate by the mounting head.

A welding apparatus that includes a first member having a first suture-contacting surface, a second member having a second suture-contacting surface, and a device for moving the first member relative to the second member to define a gap between the respective suture-contacting surfaces. The first member is capable of vibrating and delivering mechanical energy at ultrasonic frequencies. The second member is stationary relative to the first member. A fixture element is adapted to receive and maintain two or more segments of a material to be welded in a predetermined alignment in the gap between the first and second surfaces of the first and second members during a welding operation. According to another aspect of the invention, an ultrasonic welding apparatus includes first and second members with patterned first and second suture-contacting surfaces. The patterned surfaces can be complementary or non-complementary and the surface patterns on each member may vary in either a periodic or a non-periodic manner.

In a first aspect, a programmable transfer device is provided for transferring conductive pieces to electrode pads of a target substrate. The programmable transfer device includes (1) a transfer substrate; and (2) a plurality of individually addressable electrodes formed on the transfer substrate. Each electrode is adapted to selectively attract and hold a conductive piece during transfer of the conductive piece to an electrode pad of a target substrate. Numerous other aspects are provided.

The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed ion the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.

A cable management system for a welding-type system includes a support column extending in a first direction from a first end supported by a welding-type device to a second end arranged above the welding-type device. The cable management system also includes a cable support arranged on the second end of the support column that extends in a second direction substantially transverse to the first direction. Accordingly, a portion of the cable support extends away from the welding-type device to allow a cable supported thereon to extend below the cable support and proximate to the welding-type device.

Systems and methods for fabricating multi-functional articles comprised of additively formed gradient materials are provided. The fabrication of multi-functional articles using the additive deposition of gradient alloys represents a paradigm shift from the traditional way that metal alloys and metal / metal alloy parts are fabricated. Since a gradient alloy that transitions from one metal to a different metal cannot be fabricated through any conventional metallurgy techniques, the technique presents many applications. Moreover, the embodiments described identify a broad range of properties and applications.

A friction-stir welding probe tip is disclosed which has right-handed threads on one portion of the probe and left-handed threads on another portion of the probe such that weld material is drawn to the middle of the weld as the friction-stir welding probe is rotated and passed along the joint region of the pieces to be joined. This probe tip is also fitted with a shoulder region for gripping by a rotation means.

An apparatus used in a process for supporting a printed circuit board during a wave soldering operation including a frame with a frame opening in which a surface of the frame supports the board and also serves as a reference surface for vertically positioning the board above the solder pool. The board is secured against the reference surface with spring loaded clamps. Stiffeners preferably being an aluminum extrusion having a Tee or angle cross section is mounted along the outside edge of the reference surface of the frame and has a second reference surface facing in a direction opposite the reference surface of the frame. The second reference surface on the extrusion is accessible for support by a slide rail so that the height of the reference surface of the frame above the surface of the pool is independent of the thickness of the board or frame. A board support bar for minimizing warpage of the board from heat is disclosed as well as a hold down bar that secures components on the board so that they do not float away when contacted by the solder wave.

An automatic soldering machine for soldering wires, each exposing at least one core wire and electronic components with at least one soldering portion respectively is disclosed. The automatic soldering machine comprises an equipment, a delivery mechanism, a plurality of clamps, a feeding mechanism, an insulation removing mechanism, a soldering mechanism, an unloading mechanism and a programmable control system. The delivery mechanism delivers the wires. The clamps locate the wires. The feeding mechanism conveys the electronic components. The insulation removing mechanism cuts the core wires and strips insulations at tops of the core wires. The soldering mechanism solders the core wires and the soldering portions of the electronic components. The unloading mechanism separates the soldered electronic components and core wires off from the clamps. The programmable control system is connect to the aforesaid mechanisms and controls thereof with high production efficacy and stable production quality.

The invention discloses apparatus and methods for the formation of bond wires in integrated circuit assemblies by attaching two separate wires using a dual capillary bond head. The separate wires are preferably non-identical, for example, being of different gauges and / or material composition. According to a preferred embodiment of the invention, dual capillary bond head apparatus includes a rotatable ultrasonic horn with a pair of capillaries for selectably dispensing separate strands of bond wire and for forming bonds on bond targets. According to another aspect of the invention, a method is provided for dual capillary IC wirebonding including steps for using two dual capillary bond heads for contemporaneously attaching non-identical bond wires to selected bond targets on one or more IC package assemblies.

An additive manufacturing system includes an additive manufacturing tool configured to receive a plurality of metallic anchoring materials and to supply a plurality of droplets to a part, and a controller configured to independently control the composition, formation, and application of each droplet to the plurality of droplets to the part. The plurality of droplets is configured to build up the part. Each droplet of the plurality of droplets includes at least one metallic anchoring material of the plurality of metallic anchoring materials.

After detection of contact between respective solder bumps of an electronic component, sucked and held by a suction nozzle of a head tool, and respective solder portions of a circuit board, the solder bumps and the solder portions are melted by heating. Releasing of the electronic component from suction and holding by the suction nozzle of the head tool is performed, not at a time during solder melting, but at a time after the solder is melted, cooled and solidified. Thus, an electronic component mounting method and apparatus capable of mounting high-end electronic components having narrow-pitched bumps are provided.

Tooling systems including a mandrel for receiving, and providing shape to, a metallic deposit applied using a high temperature additive manufacturing device; a metallic cladding applied to the mandrel for reducing contamination of the metallic deposit; and at least one cooling channel associated with the mandrel for removing heat from the system.

A method and apparatus for forming solder bumps by molten solder deposition into cavity arrays in a substrate immediately followed by solidification of molten solder such that precise replication of cavity volumes is consistently achieved in formed solder bump arrays. Various solder filling problems, such as those caused by surface tension and oxidation effects, are overcome by a combination of narrow molten Solder dispense slots and solidification of dispensed molten solder.

A manufacturing machine and a method for producing a cartridge for an electronic cigarette comprising a supporting base, a pair of power electrodes fitted to the supporting base, and a heating member folded into a ‘U’ around the power electrodes are disclosed: a conveyor comprising a pocket for feeding the supporting base fitted with the power electrodes along a conveying path; a connecting unit which connects the heating member to the power electrodes while the supporting base, fitted with the power electrodes, is housed inside the pocket on the conveyor; a welding device located along the conveyor to weld a pair of terminals of a heat resistor of the heating member to the corresponding power electrodes; and a folding device, which cooperates with the connecting unit and folds the heating member into a ‘U’ before the heating member is connected to the power electrodes.

The apparatus includes a track mounted in the inlet of a compressor. A manipulator is mounted for movement about the track and carries three modules, the last of which mounts a tool head for movement in a Cartesian coordinate system and about the track. A measuring head measures the location of the airfoil surface. An abrading tool mounted on the third module removes surface material from the airfoil. Subsequently, a shot-peening device, either a flapper with embedded shot or free shot is impacted against the abraded surface to strengthen the surface. Final inspection is performed by a light and camera head mounted on the third module.

The present application provides a latent ink-jet ink formulation suitable as solder mask. The composition generally comprises: (a) at least one compound capable of self cross-linking (USM); (b) at least one phenolic resin; (c) at least one solvent; (d) at least one mineral filler; (e) at least one polyol; and (f) at least one photoinitiator.

An automatic soldering system includes a conveyance mechanism, a vehicle, a first part assembling mechanism, a first soldering mechanism, a turn-over mechanism, a second part assembling mechanism, a second soldering mechanism, and a control system. The vehicle is conveyed by the conveyor mechanism for carrying a workpiece. The first part assembling mechanism and the first soldering mechanism assemble and solder a first part to the primary workpiece carried by the vehicle. The turn-over mechanism turns the vehicle that is conveyed by the conveyor mechanism and carries the primary workpiece having the first part assembled thereto by a predetermined angle. The second part assembling mechanism and the second soldering mechanism assemble and solder and position a second part to the primary workpiece. The control system is electrically connected to and thus controls the first part and second part assembling mechanisms, the first and second soldering mechanisms, and the turn-over mechanism.

System and method for formation of a hermetic seal with an significantly greater melting temperature than the melting temperature of the solder employed. The hermetic seal is formed from a solder with a low melting point and a metal having a predetermined thickness that corresponds to the solder. The solder and metal combination undergoes reflow for a period of time relative to the solder thickness. The resultant seal has a melting point at a temperature significantly greater than the melting temperature of the solder.

The invention relates to the technical field of automated cutting and welding, and discloses a multifunctional single-cantilever cutting and welding integrated machine. The integrated machine comprises a machine frame base, a machine frame stand column, a stand column rotary device, a vertical lifting device, a machine frame transverse arm, a left-right translation device, a telescopic arm, a front-rear transverse moving device and a multi-joint machine head, wherein the machine frame stand column is mounted on the machine frame base through the stand column rotary device, and the machine frame transverse arm is mounted at the upper part of the machine frame stand column through the vertical lifting device. The integrated machine is reasonable and compact in structure and convenient to use; the welding of longitudinal, circumferential and fillet weld seams, cutting of an intersecting line hole and automatic welding of a saddle-shaped weld seam between a barrel body and a connecting pipe can be finished in a relatively fixed station through the stand column rotary device, the vertical lifting device, the left-right translation device, the front-rear transverse moving device and the multi-joint machine head, the frequent motion of a workpiece can be avoided, the clamping and positioning frequency of the workpiece is greatly reduced, the welding efficiency and quality are remarkably improved, and the labor intensity of welding workers is reduced.

A DBA-based power device includes a DBA (Direct Bonded Aluminum) substrate. An amount of silver nanoparticle paste of a desired shape and size is deposited (for example by micro-jet deposition) onto a metal plate of the DBA. The paste is then sintered, thereby forming a sintered silver feature that is in electrical contact with an aluminum plate of the DBA. The DBA is bonded (for example, is ultrasonically welded) to a lead of a leadframe. Silver is deposited onto the wafer back side and the wafer is singulated into dice. In a solderless silver-to-silver die attach process, the silvered back side of a die is pressed down onto the sintered silver feature on the top side of the DBA. At an appropriate temperature and pressure, the silver of the die fuses to the sintered silver of the DBA. After wirebonding, encapsulation and lead trimming, the DBA-based power device is completed.

A solder joint comprising a solder capture pad on a substrate having a circuit; and a lead free solder selected from the group comprising Sn—Ag—Cu solder and Sn—Ag solder adhered to the solder capture pad; the solder selected from the group comprising between 0.1 to 2.0% by weight Sb or Bi, and 0.5 to 3.0% Ag. Formation of voids at an interface between the solder and the solder capture pad is suppressed, by including Zn. Interlayer dielectric delamination is suppressed, and electromigration characteristics are greatly improved. Methods for forming solder joints using the solders.

A ball is formed at the tip of a wire projecting from a capillary. The capillary is positioned above an interconnection, and ball bonding forms a bump on the interconnection. The capillary is then moved next to the bump and wedge bonding is carried out. Next, the capillary is moved upward and another ball is formed at the tip of the wire, and the wire is primary bonded to a bonding pad of a semiconductor chip. The wire is then looped and the capillary is positioned above the bump, and secondary bonding is carried out. As a result, the formation of tails on the bump is prevented.