142 results about "Distance minimization" patented technology

A system that employs transmission-based detection techniques to determine the presence or concentration of an analyte within a test sample is provided. Specifically, the optical detection system contains a chromatographic-based assay device that is positioned in the electromagnetic radiation path defined between an illumination source and detector. To enhance the sensitivity and signal-to-noise ratio of the system without significantly increasing costs, the distance between the illumination source and / or detector and the assay device is minimized. The illumination source and / or detector may also be positioned directly adjacent to the assay device. In addition, the system may be selectively controlled to reduce reliance on external optical components, such as optical filters or diffusers.

A turbine blade with a generally hollow airfoil having an outer wall that defines a chamber for receiving cooling air, the airfoil comprising a leading edge that resides in an upstream direction, a trailing edge that resides in a downstream direction, a convex suction side, a concave pressure side, and an insert disposed within the chamber that is configured to initially receive at least a portion of the cooling air entering the chamber and direct the cooling air through a plurality of insert apertures to cool the inner surface of the outer wall, the insert further comprising a configuration that generally conforms to the contour of the outer wall of the chamber but in spaced relation thereto, wherein the chamber and insert narrow as they extend toward the trailing edge, the insert eventually terminating and the chamber eventually terminating at a pin array section, wherein a first distance exists that comprises the generally axial distance between the position of downstream termination point of the insert and the position of an upstream beginning point of the pin array section, wherein the pin array section, at a downstream end, comprises a plurality of openings that define an inlet to a plurality of trailing edge cooling apertures, and wherein the chamber, the insert, and the pin array section are configured such that the first distance is approximately minimized.

Certain embodiments of the present invention provide a method and system for improved calibration of an image acquisition device. Certain embodiments of the system include an image acquisition device for obtaining at least one image of an object and a calibration fixture positioned in relation to the image acquisition device. The calibration fixture includes a radiotranslucent material providing low frequency content for characterizing the image acquisition device. In an embodiment, the calibration fixture includes a plurality of peaks and valleys to create a low frequency signal for characterizing the image acquisition device. The calibration fixture may be positioned between the image acquisition device and an energy source such that a distance between the image acquisition device and the calibration fixture is minimized. In certain embodiments, a grating or other calibration fixture may be used to generate a moiré pattern to calibrate the image acquisition device.

A semiconductor integrated circuit comprises contact pads located over active components, which are positioned to minimize the distance for power delivery between a selected pad and one or more corresponding active components, to which the power is to be delivered. This minimum distance further enhances dissipation of thermal energy released by the active components.More specifically, a semiconductor integrated circuit comprises a laterally organized power transistor, an array of power supply contact pads distributed over the transistor, means for providing a distributed, predominantly vertical current flow from the contact pads to the transistor, and means for connecting a power source to each of the contact pads. Positioning the power supply contact pads directly over the active power transistor further saves precious silicon real estate area. The means for vertical current flow include contact pads made of a stack of metal layers comprising refractory metals for adhesion, copper and nickel as stress-absorbing metals, and gold or palladium as bondable and solderable outermost metals. The means for connecting a power source include wire bonding and solder ball interconnection.

The invention notably relates to a computer-implemented method for designing a 3D modeled object representing a real object. The method comprises the steps of providing a 3D representation of the real object, identifying occurrences of a geometric feature at 3D positions of the 3D representation, providing at least one 2D view of the real object, identifying occurrences of a graphic feature at 2D positions of the 2D view, the geometric feature corresponding to the graphic feature, computing camera parameters that minimize a distance between a set of projections of the 3D positions on the 2D view and a set of 2D positions. This provides an improved solution for designing a 3D modeled object representing a real object.

A fixation device and method for the subcutaneous fixation of bone fragments. A fixation mesh is formed by the intersection of a plurality of linear legs that are interconnected in sagittal planes to form linear sagittal lines and a plurality of crimped legs that are interconnected in transverse planes to form transverse lines. The mesh resists expansive forces that are created in the linear sagittal lines and a compressive stress is created in the transverse lines when tensile loads are applied to the linear sagittal lines resulting in a device that minimizes the gap distance between bone fragments.

A method for producing a high resolution detector array so as to provide very high packing fraction, i.e., the distance between scintillator elements is minimized so the detector efficiency will be higher than is currently achievable. In the preferred embodiment of the present invention, the fabrication methodology is enhanced by handling LSO bars rather than single crystals when gluing on the Lumirror® as well as etching the LSO. Namely, an LSO boule is cut into wide bars of a selected dimension, for example 30 mm, which are then acid etched or mechanically polished. A selected number, N, of these LSO bars can then be glued together with Lumirror® sheets between each bar (coating the LSO disks and Lumirror® sheets with Epotek 301-2). The glued bar block is then cut again into bars in a perpendicular direction, and these new LSO-Lumirror® bars are etched. Finally, a selected number, M, of these LSO-Lumirror® bars are glued together with Lumirror® sheets between each bar; thus creating an etched N×M LSO-Lumirror® array, (where M may or may not be equal to N), without having to handle individual LSO crystals or small Lumirror® pieces.