59results about How to "Uniform position" patented technology

A readily-strippable cable is herein described having at least two wires encapsulated by a continuous electrically insulating layer, the insulating layer having at least one relatively weak portion that extends along the length of the cable and is substantially uniform in position and strength along the length of the cable; and wherein the weak portion is configured to allow the insulating layer to split along the relatively weak portion and down the length of the cable upon separation of the encapsulated wires by application of force against the relatively weaker portion of insulating layer in a direction substantially perpendicular to the length of the cable, thereby exposing the wires without the use of a secondary operation.

A semiconductor structure comprises a semiconductor substrate and multiple layers of superfine silicon lines. Interface shapes of the multiple layers of superfine silicon lines are doubly controlled by a crystal orientation of the substrate and axial crystal orientations of the lines. A forming method of the semiconductor structure includes: forming a fin-shaped silicon island Fin and source drain areas at two ends of the silicon island via an etching technology; preparing a corrosion masking layer for silicon; forming multiple layers of superfine silicone lines. The semiconductor structure and the forming method there of have the advantages that the finally formed multiple layers of superfine silicon lines are uniform and controllable in positions and section shapes; self-stopping of aeolotropism corrosion, large technical windows and the silicon lines in different diameters on a same silicon slice are achieved; ICPECVD (inductively coupled plasma enhance chemical vapor deposition) is strong in narrow groove filling power, and no cavity is left when materials of a sacrificial layer and the corrosion masking layer are deposited; the lines smaller than 10nm in size can be prepared by combining an oxidization technology, requirements on key technologies for small-size devices are met; a processing method is implemented from top to bottom and compatible with a bulk silicon planar transistor technology, and technical cost is low.

The invention relates to a spiral type leaf throwing roller for a wind separating warehouse. The spiral type leaf throwing roller comprises a plurality of blades, a roller cylinder and a shaft; the multiple blades are arranged on the outer circumferential surface of the roller cylinder, and the shaft is arranged at the position of the central axis of the roller cylinder in a penetrating mode; themultiple blades are arranged in the direction of spiral lines of the roller cylinder in sequence, the spiral lines, treating the midpoint of the roller cylinder as a boundary, rotate leftward from oneend of the roller cylinder and rotate right ward in the opposite direction from the other end of the roller cylinder, and the spiral lines intersect to one point at the midpoint of the roller cylinder; and the multiple blades rotate leftward along the spiral lines at the end of the roller cylinder, and rotate rightward along the spiral lines at the other end of the roller cylinder. According to the spiral type leaf throwing roller for the wind separating warehouse, the leaf throwing roller is of a hollow structure and has low weight, and the load of a driving motor is reduced; and in addition, the positions of thrown materials can be more uniform, the wind separating effect is improved, and the leaf containing rate in stalks is reduced.

An ink jet recording apparatus (1) is arranged in which the loading and unloading of ink cartridges (16) as well as the supply and removal of a recording medium is carried out at the upstream side in a conveying direction. The ink tubes (10) for connecting ink dispensing outlets (9a1 to 9f1) and ink dispensing inlets (6a1 to 6f1) are positioned so that they are substantially uniform in the length thus to have no difference in the resistance to flows.