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77results about How to "Simple chemical structure" patented technology

Polypeptide probe and application of polypeptide probe to identification of post-translational modification binding protein

The invention provides a polypeptide probe based on photo-crosslinking and nano-metal particle self-assembly technologies. The polypeptide probe is modified with protein-post-translational modified polypeptide. According to the polypeptide probe, affinity recognition and enrichment capture processes are integrated, so that the convenient and efficient recognition and identification of a protein-post-translational modified binding protein or a compound of the binding protein. According to the polypeptide probe of the invention, a photo-crosslinking group is introduced into nano metal particles,so that a weak acting force between the polypeptide and the binding protein is converted into a strong covalent bond effect formed by the photo-crosslinking group, and therefore, the polypeptide probe can bear strong elution conditions and can capture proteins with low abundance and transient interaction; the influence of the modification of the photo-crosslinking group on a polypeptide frameworkis avoided, and therefore, the original structure and recognition characteristic of the polypeptide framework are well maintained, and influence on the binding specificity of the corresponding binding protein is greatly reduced. The invention further provides a preparation method of the polypeptide probe, and the application of the polypeptide probe to the identification of post-translational-modified binding proteins, the identification of interaction between protein modifications and the discovery of new protein-modified binding proteins.
Owner:TIANJIN MEDICAL UNIV

Method for fabricating semiconductor device and semiconductor device

A method for fabricating a semiconductor device includes the steps of forming a nitrogen-containing layer in an exposed portion of a copper interconnect formed in an insulating film provided on a substrate; and forming an interlayer insulating film on the nitrogen-containing layer through plasma CVD performed by using, as a material, an organic silicon compound having a siloxane (Si—O—Si) bond.
Owner:PANASONIC CORP
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