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42results about How to "Satisfactory workability" patented technology

Alkali development type photocurable composition and calcined pattern obtained by use of the same

An alkali development type photocurable composition comprises (A) an alkali-soluble macromolecular binder having a weight-average molecular weight in the range of 5,000 to 100,000 and an acid value in the range of 50 to 150 mg KOH / g and obtained by causing (d) a compound possessing one glycidyl group in its molecule to react with a carboxyl group of (A-1) a copolymer of (a) an ethylenically unsaturated bond-containing compound possessing one carboxyl group in its molecule with (b) an ethylenically unsaturated bond-containing compound possessing neither hydroxyl group nor acidic group in its molecule, or a carboxyl group of (A-2) a copolymer of the compounds (a) and (b) mentioned above and (c) an ethylenically unsaturated bond-containing compound possessing a hydroxyl group and then causing (e) a polybasic acid anhydride to react with a hydroxyl group caused by the above reaction, (B) an inorganic powder, (C) a photopolymerizable monomer, (D) a photopolymerization initiator, and (E) an organic solvent. By using this composition, such calcined patterns as a conductor pattern and a dielectric pattern of high fineness may be formed by the photolithographic technique.
Owner:TAIYO INK MFG

Method for producing hot-dip galvanized steel sheet having high strength and also being excellent in formability and galvanizing property

A hot-dip galvanized high-strength steel sheet having superior workability and galvanizability containing:0.01% to 0.20% by weight of C;1.0% by weight or less of Si;more than 1.5% to 3.0% by weight of Mn;0.10% by weight or less of P;0.05% by weight or less of S;0.10% by weight or less of Al;0.010% by weight or less of N;0.010% to 1.0% by weight in total of at least one element selected from the group consisting of Ti, Nb, and V; andthe balance being Fe and incidental impurities;in which the steel sheet has the metal structure in which the areal rate of the ferrite phase is 50% or more, the ferrite phase has an average grain diameter of 10 mum or less, and the thickness of a band-like structure composed of the second phase satisfies the relationship Tb/T<=0.005, where Tb is the average thickness in the sheet thickness direction of the band-like structure and T is the thickness of the steel sheet, and a method for producing the same. To provide a method for producing a hot-dip galvanized high-strength steel sheet in which superior workability and high strength are obtained and moreover satisfactory galvanizability is obtained when galvanizing is performed using facilities such as a continuous galvanizing line.
Owner:KAWASAKI STEEL CORP

Alkali-developing type photocurable composition and calcined pattern obtained by use thereof

Disclosed are a photocurable composition which is developable with an aqueous alkaline solution and such calcined patterns as a conductor pattern, a vitreous dielectric pattern, and a fluorescent pattern which are obtained by the use of the photocurable composition. The photocurable composition comprises (A) an alkali-soluble macromolecular binder having a weight-average molecular weight in the range of 5,000 to 100,000 and an acid value in the range of 50 to 150 mg KOH / g and obtained by causing (c) an organic acid possessing one carboxyl group and no ethylenically unsaturated bond in its molecule to react with the glycidyl group of a copolymer of (a) a compound possessing an ethylenically unsaturated bond and possessing neither hydroxyl group nor acidic group and (b) glycidyl (meth)acrylate and then causing (d) a polybasic acid anhydride to react with the resultant secondary hydroxyl group, (B) an inorganic powder, (C) a photopolymerizable monomer, (D) a photopolymerization initiator, and (E) an organic solvent. The composition may be in the form of paste or in the form of a dry film. When the photocurable composition is in the form of paste, the paste is applied to a substrate and then dried to form a film. When the photocurable composition is in the form of a dry film, the film is laminated on the substrate. A calcined pattern of high fineness is obtained by patterning the superposed layer of the composition by selective exposure to light and development, and thereafter calcining the patterned film.
Owner:TAIYO INK MFG CO LTD

Inverter-integrated electric compressor and assembly method therefor

Heat of a heat-generating electrical component mounted on a control circuit board of an inverter is effectively dissipated, a lead terminal that connects the electrical component to the control circuit board is prevented from breaking due to vibration, and the workability for assembling the inverter and its surrounding area is improved. An IGBT serving as a heat-generating electrical component mounted on the lower surface of a lower board serving as a control circuit board of an inverter is disposed in abutment with a heat-dissipating flat section provided on an inner wall of an inverter box provided on the outer periphery of a housing so that the heat of the IGBT is dissipated toward the housing. Moreover, a spacer member is interposed between the lower board and the IGBT so as to fill a space between the lower board and the IGBT, and the spacer member is rigid enough that the lower board and the IGBT are prevented from being displaced toward and away from each other.
Owner:MITSUBISHI HEAVY IND LTD

Steel wire rod for high-strength spring excellent in wire drawability, manufacturing method therefor, and high-strength spring

ActiveUS20130127100A1Deformation resistance increaseSatisfactory wire drawability and sv workabilityFurnace typesWire springsPearliteChemical composition
Provided are: a steel wire rod material for a high-strength spring, which does not undergo the increase in deformation resistance arising from the increase in hardness and can exhibit good wire-drawing processability and the like even when a heat treatment, which deteriorates productivity, is eliminated or a simplified and rapid heat treatment is employed instead; a useful method for producing the steel wire rod material for a high-strength spring; a high-strength spring produced using the steel wire rod material for a high-strength spring as a material; and others. This steel wire rod material for a high-strength spring is a steel wire rod material that has been hot-rolled already, and has a texture having a specified chemical composition and mainly composed of pearlite, wherein the average value (Pave) of the pearlite nodule size numbers and the standard deviation (Pσ) of the pearlite nodule size numbers fulfill the following formulae (1) and (2), respectively:9.5≦Pave≦12.0;  (1)and0.2≦Pσ≦0.7  (2).
Owner:KOBE STEEL LTD

Electromagnetic-wave absorber

An electromagnetic wave absorber characterized by comprising from 50 to 85% by weight of inorganic hollow material, from 0.01 to 35% by weight of conductive material, from 5 to 47.5% by weight of binder, and from 0.1 to 47.5% by weight of filler. It has a reduced angle dependence of electromagnetic wave absorption and has the property of absorbing electromagnetic waves over a wide range of angles. It further has satisfactory processability and workability.
Owner:NITTO BOSEIKI CO LTD

Method of grinding back side of semiconductor wafer and adhesive sheet for use in the method of grinding back side of semiconductor wafer

The present invention provides a method of grinding a back side of a semiconductor wafer, which includes applying an adhesive sheet including a substrate and an adhesive layer formed on one side of the substrate to a front side of a semiconductor wafer to provisionally fix the semiconductor wafer to the adhesive sheet, followed by grinding the back side of the semiconductor wafer, in which the adhesive layer contains 100 parts by weight of a base polymer for radiation-curable adhesives, 0.02 to 10 parts by weight of a phosphoric ester compound having an alkyl group having 10 or more carbon atoms, and more than 10 parts by weight but 200 parts by weight or less of at least one polyfunctional acrylate oligomer and / or monomer having one or more carbon-carbon double bonds, the polyfunctional acrylate oligomer and / or monomer having a weight-average molecular weight per carbon-carbon double bond of 250 to 6,500.
Owner:NITTO DENKO CORP

Epoxy resin composition, cured object obtained therefrom, and light-emitting diode

Provided are an epoxy resin composition including acid anhydrides (A) and epoxy resins (B), in which: (a) cyclohexane-1,2,4-tricarboxylic acid-1,2-anhydride accounts for 50 to 90 mass % of the acid anhydrides (A); (b) an alicyclic epoxy resin compound accounts for 30 to 90 mass % of the epoxy resins (B) and an epoxy resin compound represented by the following general formula (1) accounts for 10 to 50 mass % of the epoxy resins (B); and (c) contents of the acid anhydrides (A) and the epoxy resins (B) are such that a blending equivalent ratio between the acid anhydrides and the epoxy resins ranges from 0.4 to 0.7, a cured product of the composition, and a light-emitting diode. The epoxy resin composition has the following characteristics. That is, (1) the composition has a low viscosity after the mixing, a low degree of viscosity increase in standing at room temperature, and excellent workability, (2) the composition has satisfactory curability even when no curing accelerator is added, and (3) a cured product is colorless and transparent, has crack resistance, and changes its color to a small extent with long-term light irradiation and heating. The composition is suitable for an encapsulant for a photoelectric conversion element such as a blue LED or white LED. (In the formula, R's each independently represent a hydrogen atom or a methyl group, m represents an integer of 1 to 3, and n represents an integer of 2 to 8.)
Owner:MITSUBISHI GAS CHEM CO INC

Curable Composition

The present invention provides a curable composition comprising a reactive silicon group-containing polyoxyalkylene polymer which is obtained by reacting a polyoxyalkylene polymer (A) having a molecular weight distribution of 1.6 or less, a number average molecular weight of 15,000 to 50,000, and 0.8 or more reactive groups, on average, per molecule thereof with an organic compound (B) having in the molecule thereof a reactive silicon group and a functional group capable of reacting with the reactive groups of the polymer (A) in a proportion of 0.8 to 1.5 molecules of the organic compound (B), on average, per molecule of the component (A), a filler (C) and a curing catalyst (D); further in which, in the liquid components contained in the curable composition, the ratio y/x of the content y (wt %) of a component having no reactive silicon group and the content x (wt %) of a component having at least one reactive silicon group is 0.4 or less; and further in which the composition comprises a plasticizer in an amount of 10 parts by weight or less in relation to 100 parts by weight of the reactive silicon group-containing polyoxyalkylene polymer. The curable composition of the present invention improves the staining property of the cured product thereof, ensures favorable mechanical properties favorable for a sealant such as low stress and high elongation, and is also satisfactory in workability.
Owner:KANEKA CORP

Composite material for electric/electronic part, production method thereof, and electric/electronic part

A composite material for an electric / electronic part, having a metal base, a resin film on at least a part of the metal base, and a layer of Sn or a Sn alloy on at least a part of the metal base at a site where the resin film is not provided, the layer of Sn or a Sn alloy including a solidified structure, and the resin film having a residual solvent quantity adjusted to 5% to 25% by mass.
Owner:FURUKAWA ELECTRIC CO LTD
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