Patents
Literature
Hiro is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
Hiro

159results about How to "Reduce the inductance value" patented technology

Method for constructing radio frequency front end of multi-mode multi-band satellite navigation receiver and module thereof

The invention discloses a configurable multi-mode multi-band satellite navigation receiving method and a radio frequency front end module constructed by the method. The front end module can receive signals of satellite navigation and positioning systems such as a global positioning system (GPS), the Big Dipper, a Galileo positioning system and a global navigation satellite system (Glonass), and comprises a configurable low-noise amplifier (LNA) with a buffer and an active balun, a folding passive mixer with a configurable frequency synthesizer, a configurable multi-mode filter, an automatic gain control (AGC) amplifier, a direct-current bias circuit, and a multi-mode multi-band program controlled and coded on-off control word from a receiving system. The radio frequency front end module can meet the requirement of multi-band multi-mode work through the control word programmed by the receiving system, has a simple and reliable structure, does not need complicated time division multiplexing control system and off-chip module, has low cost and high flexibility, and improves the noise performance of the radio frequency front end of the whole receiver and multi-mode multi-band signal processing capacity; and a one-channel signal is input into the module, and the module outputs a two-channel differential signal. The receiver can be used for receiving and processing multi-mode satellite navigation signals asynchronously, and receiving and processing satellite navigation signals with the required mode in different time intervals according to the requirement.
Owner:杭州中科微电子有限公司

Fabrication of inductors in transformer based tank circuitry

Placing inductors or resistors in parallel causes the combined value of inductance or resistance to decrease according to the parallel combination rule. This invention decreases the parasitic resistance of an inductor by placing several inductors in parallel. Furthermore, by careful placement of these inductors, the mutual inductance between these inductors can be used to increase the equivalent inductance value to a value near that of the original inductance value of a single inductor. Thus, it is possible to create an inductance with a much lower value of parasitic resistance. This invention allows the formation of high Q inductors and would be beneficial in any circuit design requiring inductances. Another aspect of this invention is that the coils can be partitioned to minimize eddy current losses. This invention can easily be implemented in a planar technology. Simulations of several tank circuits indicate that the power dissipation can be reduced 3 to 4 times when compared to conventional techniques.
Owner:INTELLECTUAL VENTURES HOLDING 81 LLC

Production method of high-power precision alloy SMD (surface mount device) resistor

The invention provides a production method of a high-power precision alloy SMD (surface mount device) resistor. The production method comprises the steps: respectively combining two oxygen-free copper strips with two sides of a resistor alloy strip to form an integrated strip-shaped resistor strip, and wrapping a high-heat-conductivity substrate with the integrated strip-shaped resistor strip; etching a basic resistor structure on a wrapping body; precisely adjusting the resistance value of the basic resistance structure; coating, terminal electroplating and printing a resistor body to form a high-power precision alloy SMD resistor. The material with high heat radiation capability and high heat conductivity such as a metal substrate, a high-heat-conductivity ceramic substrate is used as the substrate, so that the actual load capacity of the resistor is greatly increased; the oxygen-free copper strip is partially arranged on the side surface and below the substrate and used as an electrode lead, so that the contact area is increased, and the heat conductivity of the resistor body is also increased on the other hand.
Owner:SHENZHEN YEZHAN ELECTRONICS

Printed circuit board package structure and manufacturing method thereof

A printed circuit board package structure includes a substrate having a first surface and a second surface, a ring-shaped magnetic element, an adhesive layer, conductive portions and conductive channels. The first and second surfaces respectively have first and second metal portions. A ring-shaped concave portion is formed on a position not covered by the first metal portions of the first surface. The ring-shaped magnetic element is placed in the ring-shaped concave portion. The adhesive layer covers the first metal portions and the ring-shaped magnetic element. The conductive portions are formed on the adhesive layer. The conductive channels penetrate the conductive portions, the adhesive layer, and the substrate, and are respectively located in an inner wall and outside an outer wall of the ring-shaped concave portion. Each of the conductive channels includes a conductive film electrically connects to the aligned conductive portion and second metal portion.
Owner:TRIPOD TECHNOLOGY CORPORATION

Conductive terminal and electrical connector applying the conductive terminal

A conductive terminal is positioned in an insulative housing to constitute an electrical connector. The insulative housing is formed with a first face and a second face opposite to each other, and has a plurality of terminal receiving cavities extending through the first face and the second face. The conductive terminal includes a base for abutting against the corresponding terminal receiving cavity to achieve positioning. The base has two spaced-apart opposite sidewalls. Each sidewall is formed with a first edge and a second edge opposite to each other in a direction of extension of the terminal receiving cavity. A plurality of resilient arms extend outwardly from certain of the edges of the sidewalls such that the first and second contact portions of the resilient arms are respectively and electrically connected to an electronic component and a circuit board to transmit signals between the electronic component and the circuit board through the conductive terminal.
Owner:MOLEX INC

Tunable micro electromechanical inductor

The present invention provides a monolithic inductor developed using radio frequency micro electromechanical (RF MEMS) techniques. In a particular embodiment of the present invention, a tunable radio frequency microelectromechanical inductor includes a coplanar waveguide and a direct current actuatable contact switch positioned to vary the effective width of a narrow inductive section of the center conductor of the CPW line upon actuation the DC contact switch. In a specific embodiment of the present invention, the direct current actuatable contact switch is a diamond air-bridge integrated on an alumina substrate to realize an RF switch in the CPW and microstrip topology.
Owner:UNIV OF SOUTH FLORIDA

Array-type flexible electric eddy sensor

An array-type flexible electric eddy sensor is composed of sensing coil array on the film substrate, leading-out signal line, grounding line, multi-channel gating switch and clapp oscillator. Its advantages include not deformation and high temp performance and consistancy.
Owner:TSINGHUA UNIV

Metal plate forming device

InactiveCN102451869AReduce lateral restraintHigh aspect ratioEngineeringThinning
The invention discloses a metal plate forming device which comprises a mold and an electromagnetic production device, wherein a forming mask of the mold has a pattern structure, and the pattern structure comprises at least one high part and at least one low part; a plate-shaped electromagnetic coil of the electromagnetic production device has a forming region, and a feature structure corresponding to the pattern structure is arranged in the forming region; and a metal plate can be driven by a mutually-repelled electromagnetic force generated between the plate-shaped electromagnetic coil and the metal plate to abut on the pattern structure, thereby forming the preset pattern. Thus, the metal plate forming device has the following advantages: the lateral binding force of the blank (metal plate) in the forming process can be reduced; the formed pattern has a higher depth-width ratio; the forming performance of the blank is improved; the thinning rate and warpage problem of the blank can be reduced; the structure is simple; a higher primary current value can be produced; and the arcing discharge problem can be completely avoided.
Owner:METAL INDS RES & DEV CENT

Brush DC motors and AC commutator motor structures with concentrated windings

Structures of direct current motors or ac commutator (Universal) motors which use a concentrated winding on the rotor with coils wound around the teeth. The number of commutator segments is higher than the number of rotor teeth. Several coils are wound around the same tooth. The terminals of the coils are connected to different segments of the commutator. The parallel paths of the armature winding are perfectly balanced. An equal current distribution through the parallel circuits of the armature is maintained and there is no circulation current between these parallel circuits. The problems related to commutation are reduced because the value of the coil inductances is low. The copper volume of the end-windings, the Joule losses and the axial length of the motor armature are lower than a lap or a wave winding with interlocked coils. Two kinds of structures with a concentrated winding are presented: some with rotor teeth with identical dimensions and some with rotor teeth with different dimensions.
Owner:QUEBEC METAL POWDERS

Brush DC motors and AC commutator motor structures with concentrated windings

Structures of direct current motors or ac commutator (Universal) motors which use a concentrated winding on the rotor with coils wound around the teeth. The number of commutator segments is higher than the number of rotor teeth. Several coils are wound around the same tooth. The terminals of the coils are connected to different segments of the commutator. The parallel paths of the armature winding are perfectly balanced. An equal current distribution through the parallel circuits of the armature is maintained and there is no circulation current between these parallel circuits. The problems related to commutation are reduced because the value of the coil inductances is low. The copper volume of the end-windings, the Joule losses and the axial length of the motor armature are lower than a lap or a wave winding with interlocked coils. Two kinds of structures with a concentrated winding are presented: some with rotor teeth with identical dimensions and some with rotor teeth with different dimensions.
Owner:QUEBEC METAL POWDERS

Defrosting apparatus with lumped inductive matching network and methods of operation thereof

The invention provides a defrosting system which includes an RF signal source, an electrode proximate to a cavity within which a load to be defrosted is positioned, a transmission path between the RFsignal source and the electrode, and an impedance matching network electrically coupled along the transmission path between the output of the RF signal source and the electrode. The system also includes power detection circuitry coupled to the transmission path and configured to detect reflected signal power along the transmission path. A system controller is configured to modify, based on the reflected signal power, an inductance value of the impedance matching network to reduce a ratio of the reflected signal power to the forward signal power. The impedance matching network includes a plurality of fixed-value, lumped inductors positioned within a fixed inductor area.
Owner:NXP USA INC

Open magnetic circuit stacked coil component and process for producing the open magnetic circuit stacked coil component

ActiveCN101911221AReduced variance in sintering shrinkageSuppress defects such as cracksInorganic material magnetismTransformers/inductances detailsSuperimpositionEngineering
Disclosed is an open magnetic circuit stacked coil component that is less likely to cause defects between a nonmagnetic layer and a magnetic layer, causes no significant deterioration in temperature characteristics of inductance, even when the thickness of the nonmagnetic layer is reduced, and has excellent direct-current superimposition characteristics. An open magnetic circuit stacked coil component (1) comprises a laminate (11), formed of magnetic layers (2) stacked on top of each other, a coil (L) provided within the laminate (11), and a nonmagnetic layer (4) provided within the laminate (11) so as to cross a magnetic path formed by energization of the coil (L). The nonmagnetic layer is formed of a nonmagnetic material of a Zn-Cu-based ferrite. The magnetic layer is formed of a magnetic material. The magnetic material comprises 100 parts by weight of an Ni-Zn-Cu-based magnetic ferrite material and 0.1 to 2.0 parts by weight, in terms of Co3O4, of Co added to the Ni-Zn-Cu-based magnetic ferrite material. According to the above constitution, the difference in firing shrinkage between the magnetic layer and the nonmagnetic layer can be reduced to suppress the occurrence of cracks and the like, and, even when Ni is diffused from the magnetic layer to thenonmagnetic layer upon firing, the temperature characteristics of the inductance are rendered flat.
Owner:MURATA MFG CO LTD

Laminated inductor and method of manufacture of same

A laminated inductor, in which there is extremely little tendency for cracking to occur between adjacent conductor patterns in portions of a laminate in the lamination direction even when the conductor pattern thickness is large, as well as a method of manufacturing such a laminated inductor, are provided.A laminated inductor includes: a laminate; a pair of external electrodes arranged on the outer surfaces of the laminate respectively; and a coil, arranged within the laminate and formed by electrically connecting a plurality of strip-like conductor patterns. The conductor patterns have: a pair of broad faces, intersecting the lamination direction and mutually opposing; and peripheral side faces adjacent to the pair of broad faces and extending in the lamination direction. The peripheral side faces are concavo-convex faces, in which concave portions and convex portions are arranged in alternation in the lamination direction. The laminate enters into the concave portions of the peripheral side faces.
Owner:TDK CORPARATION

Single-phase single-stage current type photovoltaic grid inverter and control method thereof

The invention discloses a single-phase single-stage current type photovoltaic grid inverter and a control method thereof, the single-phase single-stage current type photovoltaic grid inverter is composed of a direct current (DC) side capacitor C, a current transforming module and an output filter; the DC side capacitor C is connected to a photovoltaic battery; the current transforming module is composed of a direct current inductance L and five reverse blocking power switches, namely SWL(Safe Working Load), SWP1, SWp(Safe Working Pressure)2, SWn(Switching Network)1and SWn2, respectively, the output filter is formed by connecting a capacitor Cf (Cross fire) and an inductance Lf (Low frequency), the capacitor Cf is connected to two output ends of the current transforming module. According to the invention, the single-phase single-stage current type photovoltaic grid inverter is free of a transformer, with a boosting function, through the least power inversion stage and the smallest passive element parameter.
Owner:CENT SOUTH UNIV

Semiconductor package and method for making the same

The present invention relates to a semiconductor package and a method for making the same. The semiconductor package includes a substrate, a first passivation layer, a first metal layer, a second passivation layer, a second metal layer and a third metal layer. The substrate has a surface having at least one first pad and at least one second pad. The first passivation layer covers the surface of the substrate and exposes the first pad and the second pad. The first metal layer is formed on the first passivation layer and is electrically connected to the second pad. The second passivation layer is formed on the first metal layer and exposes the first pad and part of the first metal layer. The second metal layer is formed on the second passivation layer and is electrically connected to the first pad. The third metal layer is formed on the second passivation layer and is electrically connected to the first metal layer.
Owner:ADVANCED SEMICON ENG INC

Step-up converter for high speed solenoid valve driving

The invention discloses a step-up converter for high speed solenoid valve driving, which belongs to the field of high actuator driving. The step-up converter aims to overcome the shortcomings of a single-inductor step-up circuit and a flyback transformer, combines the advantages of a single-inductor step-up way and a flyback transformer step-up way, adopts a centre-tapped transformer as a step-up inductor, achieves improvements in step-up ratio, working frequency, inductor volume and working efficiency, and can reduce system cost and improve the level of integration; and a centre-tapped transformer step-up way combines the advantages of transformer step-up and inductor step-up, is particularly suitable for high voltage production for the high speed solenoid valve driving, and ensures an output voltage range of 80 to 150V.
Owner:BEIHANG UNIV

Multi-phase interleaved parallel DC converter

The invention discloses a multi-phase interleaved parallel DC converter. The multi-phase interleaved parallel DC converter comprises: a coupling inductor, a bridge-type circuit and an output filter capacitor, wherein the coupling inductor is provided with an input end and k output ends, and the input end of the coupling inductor is used for being connected with a positive electrode of a power supply; the bridge-type circuit comprises: k phases of bridge arms; a midpoint of each phase of bridge arm serves as an input end of the bridge-type circuit; k input ends of the bridge-type circuit are connected with the k output ends of the coupling inductor respectively; the first output end of the bridge-type circuit is connected with a first input end of the output filter capacitor, and the second output end of the bridge-type circuit is connected with a second input end of the output filter capacitor. According to the multi-phase interleaved parallel DC converter, an interleaved parallel manner is adopted, the current phase mutual difference between all phases of bridge arms is 360 DEG / k, and the equivalent switching frequency of the total current of the overlapped phases of bridge arms is improved to be k times the original equivalent switching frequency; under the condition of filtering the same current ripple, the needed inductance value is smaller as the current frequency is higher, so the ring current can be inhibited in the interleaved parallel manner, and the needed inductance value can be decreased.
Owner:HUAZHONG UNIV OF SCI & TECH

Voltage-regulating variable-frequency hierarchical control ultrasonic plastic welding power supply

The invention discloses a voltage-regulating variable-frequency hierarchical control ultrasonic plastic welding power supply, which comprises a sampling control unit, a rectifying and DC voltage-regulating unit, a fixed phase-shift angle inversion unit, a matching boosting isolating unit and an ultrasonic transducer. The sampling control unit comprises a microprocessor, a first signal conditioning circuit, a second signal conditioning circuit, a driving circuit, an effective value detection circuit and a phase detection circuit, wherein the first signal conditioning circuit and the driving circuit are connected with the microprocessor; the second signal conditioning circuit is respectively connected with the effective value detection circuit and the phase detection circuit; and the effective value detection circuit and the phase detection circuit are both connected with an AD sampling port of the microprocessor. The voltage-regulating variable-frequency hierarchical control ultrasonic plastic welding power supply has the advantages that output voltage and current waveform THD is small, the voltage-regulating range is wide, large-power ultrasonic welding can be realized, the voltage-regulating or power-regulating response is quick, the voltage ripple is small, the transducer has a small vibration amplitude fluctuation, the frequency tracking precision and the accuracy are high, the electric conversion efficiency is high and the like.
Owner:ZHEJIANG UNIV +1

Mutual inductance in transformer based tank circuitry

Placing inductors or resistors in parallel causes the combined value of inductance or resistance to decrease according to the parallel combination rule. This invention decreases the parasitic resistance of an inductor by placing several inductors in parallel. Furthermore, by careful placement of these inductors, the mutual inductance between these inductors can be used to increase the equivalent inductance value to a value near that of the original inductance value of a single inductor. Thus, it is possible to create an inductance with a much lower value of parasitic resistance. This invention allows the formation of high Q inductors and would be beneficial in any circuit design requiring inductances. Another aspect of this invention is that the coils can be partitioned to minimize eddy current losses. This invention can easily be implemented in a planar technology. Simulations of several tank circuits indicate that the power dissipation can be reduced 3 to 4 times when compared to conventional techniques.
Owner:INTELLECTUAL VENTURES HOLDING 81 LLC

Control method of topology variable grid-connected inverter

The invention discloses a control method of a topology variable grid-connected inverter, belongs to the field of electric energy conversion, and solves the problem of low working efficiency in the conventional grid-connected inverter control method. According to the topology variable grid-connected inverter disclosed by the invention, by adding a bidirectional switch, a cascade type inverter can be switched into a two-level inverter according to demands. Voltage and current of a direct current power supply on an input side are acquired, a set point of grid-connected current amplitude is obtained through a maximum power point track control algorithm, and a phase angle of the grid is obtained through a phase-locked loop module, a sine of the grid is obtained, is multiplied with the grid-connected current amplitude, and is input into a grid-connected current regulator together with a practical value of the grid-connected current, a reference modulating wave of the inverter is obtained, the reference modulating wave and the direct current power supply voltage on the input side are input into a pulse width modulating module together, so as to obtain control signals of a working mode and power switches of the topology variable grid-connected inverter. The control method is mainly used for controlling the topology variable grid-connected inverter.
Owner:HARBIN INST OF TECH

Single-phase inverter for motor train unit

The invention relates to a single-phase inverter for a motor train unit. The single-phase inverter comprises a DC / DC boost unit and an inverter unit that are connected successively. The input terminal of the DC / DC boost unit is connected with a DC 110-V voltage input. The DC / DC boost unit consists of a phase-shift full-bridge soft switching circuit, a transformer T1 and a rectifier filter circuit that are connected successively; and the phase-shift full-bridge soft switching circuit includes a first IGBT module Q01 and a second IGBT module Q2 that are connected in parallel and each IGBT module includes two IGBTs connected in series and two diodes connected with the IGBTs in parallel. One end of a primary side of the transformer T1 is connected between the first IGBT and the second IGBT and the other end is connected between the third IGBT and the fourth IGBT; each IGBT is connected in parallel with a capacitor; and a primary-side equivalent inductor of the transformer T1, a first capacitor C31, a second capacitor C32, a third capacitor C33, and a fourth capacitor C34 form a resonance circuit. According to the invention, the provided single-phase inverter based on a control strategy of first boosting and second inversion has characteristics of small size, light weight, and low cost.
Owner:CRRC QINGDAO SIFANG ROLLING STOCK RES INST

Antenna Amplifier, in particular for a magnetic resonance antenna

An antenna amplifier, in particular for a magnetic resonance antenna, has a sheath wave barrier integrated into the signal path of the antenna amplifier in the form of a component designed exclusively for transfer of a differential signal.
Owner:SIEMENS HEALTHCARE GMBH

Tunable micro electromechanical inductor

The present invention provides a monolithic inductor developed using radio frequency micro electromechanical (RF MEMS) techniques. In a particular embodiment of the present invention, a tunable radio frequency microelectromechanical inductor includes a coplanar waveguide and at least one direct current actuatable contact switch positioned to vary the effective width of a narrow inductive section of the center conductor of the CPW line upon actuation the DC contact switch.
Owner:UNIV OF SOUTH FLORIDA

Capacitor voltage transformer applied to harmonic measurement

Along with mass application of huge-capacity nonlinear power equipment, particularly a power electronic device, in departments such as transportation, chemical industry, metallurgy, iron and steel, and coal, a lot of users hope to carry out continuous non-stop online test on the power equipment, and thus the invention provides an improved novel capacitor voltage transformer in which a capacitive voltage divider is additionally arranged to serve as a harmonic measurement element on the basis of the traditional capacitor voltage transformer. The improved capacitor voltage transformer not only has functions of a conventional capacitor voltage transformer, such as voltage metering, relay protection and carrier communication, but can also be used for measuring high-voltage and ultrahigh-voltage harmonic and observing grid voltage waveforms in real time. In addition, the capacitor voltage transformer can be directly used as secondary-side measurement equipment at the initial planning and mounting stage of a huge grid or a substation to be mounted onto a grid bus, and real-time observation can be realized when the system operates normally. Mounting and operation economy can be improved to a large degree.
Owner:NORTH CHINA ELECTRIC POWER UNIV (BAODING)

Novel grid-connected interface filter and passive damping method therefor

The invention relates to the field of power electronics. A novel grid-connected interface filter includes an inverter-side filter inductor, a network-side filter inductor, filter capacitors and a filter inductor. The left end of the inverter-side filter inductor is connected to a grid-connected inverter output port while the right end of the inverter-side filter inductor is connected to a filter node. The left end of the network-side filter inductor is connected to the filter node and the right end of the network-side filter inductor is connected to a filter output port. The filter inductor and one filter capacitor are connected in parallel and then connected in series with another capacitor filter. The upper end of the branch circuit is connected to the filter node, and the lower end of the branch circuit is connected to a common node of the filter with the inverter and the grid. In a passive damping method for the novel grid-connected interface filter, the above novel grid-connected interface filter circuit is used, and two ends of the filter capacitor connected in parallel with the filter inductor are connected in parallel with a damping resistor. The novel grid-connected interface filter has the advantages of excellent high-frequency filter property and low power consumption, thus enabling the whole grid-connected interface filter to be good in system performance, small in size, low in cost and high in efficiency.
Owner:竑光新能源科技有限公司

Energy feedback type power unit cascaded high voltage frequency converter

The invention discloses an energy feedback type power unit cascaded high voltage frequency converter, which comprises a main transformer, reactors, power units, a master controller and the like, wherein the main transformer is a three-phase transformer with a plurality of secondary windings; the numbers of the secondary windings of each group are the same; each group of secondary windings comprises three identical paths of which each comprises three windings with the same number of turns; the three windings correspond to the three phases of the main transformer respectively; each winding is connected with the corresponding power unit by the corresponding reactor; the power units are equally divided into three groups corresponding to the three output phases of the high voltage frequency converter; the AC sides of inverter bridges of the power units of the same output phase are sequentially connected in series to obtain high voltage phase voltage; and one end of each of output links of the power units corresponding to each output phase of the high voltage frequency converter is connected, and the other ends of the output links of the power units corresponding to each output phase of the high voltage frequency converter serve as the output ends of each phase of the high voltage frequency converter respectively. The structure of the energy feedback type unit cascaded high voltage frequency converter can be simplified, the performance of the frequency converter can be improved, and the cost of the frequency converter can be reduced.
Owner:李永盼

Monolithic metal oxide semiconductor field effect transistor-Schottky diode device

A monolithic metal oxide semiconductor field effect transistor (MOSFET)-Schottky diode device including a chip, a MOSFET, a Schottky diode and a termination structure is provided. The chip is divided into a transistor region, a diode region and a termination region. The MOSFET is disposed on the transistor region. The Schottky diode is disposed on the diode region. The termination structure is disposed on the termination region. The transistor region and the diode region are divided by the termination region. The MOSFET and Schottky diode share the termination structure.
Owner:BEYOND INNOVATION TECH

Novel rapid mechanical-type high-voltage direct current breaker

The present invention relates to a novel rapid mechanical-type high-voltage direct current breaker. The breaker comprises a main fracture branch, a commutation branch, an energy-absorbing branch and acommutation charging branch. The commutation branch, the energy-absorbing branch and the main fracture branch are connected in parallel, two ends of the parallel circuit are connected in series in adirect current transmission circuit, the commutation branch comprises a power trigger electronic switch and a pre-charging capacitor, the power trigger electronic switch is connected in series in thepre-charging capacitor and then is connected in the direct current transmission circuit, the commutation charging branch is connected in parallel with the pre-charging capacitor in the commutation branch to charge the pre-charging capacitor, the main fracture branch comprises a mechanical switch and a saturation resistor, and the mechanical switch and the saturation resistor are connected in series and are connected in the direct current circuit. A transient current flowing through the saturation resistor is small prior to open-circuit fault current zero crossing to allow the saturation resistor to be worked in an unsaturated area, and inductance value is large, a rate of descent of a fault current prior to zero crossing is reduced, the reliability of an opening circuit is increased, and the cost of a device is reduced.
Owner:CHINA SOUTH POWER GRID ELECTRIC POWER RES INST +1
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products