The invention provides a product cleaning process for digitally cleaning
chip wafers. The product cleaning process for digitally cleaning the
chip wafers comprises the following steps that: S1, equipment is started, a
system is automatically vacuumized, so that the
chip wafer is made to be in a vacuum environment in the product cleaning process for digitally cleaning the chip
wafer, and the systemcarries out automatic chemical liquid proportioning according to the cleaning requirement of the chip
wafer; S2, a
manipulator automatically grabs an iron sheet attached to the wafer and moves the iron sheet a
cleaning station, the
cleaning station rotates, and the wafer is brushed while a chemical proportioned liquid is sprayed to the wafer; S3, the spraying the chemical proportioned liquid is stopped, a two-fluid flow is introduced to wash the wafer; S4, the supply of the two-fluid flow is
cut off, the wafer is dried and baked by utilizing the supply of hot
nitrogen; S5, the wafer dried andbaked in the step S4 is transferred to a
visual inspection station so as to be subjected to
visual inspection, and whether the wafer is a qualified product or not is determined; and S6, if the waferis a qualified product, the cleaning process is terminated, and the material is conveyed out through a material conveying-out mechanism until the cleaning process is ended. With the product cleaning process adopted, automatic cleaning can be conducted, and a cleaning effect is improved.