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Product cleaning process for digitally cleaning chip wafers

A cleaning station, wafer technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of chip wafer cleaning quality, efficiency, yield, labor, time-consuming resources, and high costs. Improve the risk of secondary pollution, increase the utilization rate of liquid medicine, and reduce the effect of energy waste

Pending Publication Date: 2020-04-21
厦门英惟达智能科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The invention provides a product cleaning process for digital cleaning of chip wafers to solve the technical problems of chip wafer cleaning quality, efficiency, yield rate, labor time-consuming, high resources and costs in traditional cleaning processes

Method used

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Embodiment Construction

[0032] It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present invention will be described in detail below by way of examples.

[0033] It should be noted that the terminology used here is only for describing specific implementations, and is not intended to limit the exemplary implementations according to the present application. As used herein, unless the context clearly dictates otherwise, the singular is intended to include the plural, and it should also be understood that when the terms "comprising" and / or "comprising" are used in this specification, they mean There are features, steps, operations, means, components and / or combinations thereof.

[0034] It should be noted that the terms "first" and "second" in the specification and claims of the present application are used to distinguish similar objects, but not necessarily used to describe a specific ...

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PUM

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Abstract

The invention provides a product cleaning process for digitally cleaning chip wafers. The product cleaning process for digitally cleaning the chip wafers comprises the following steps that: S1, equipment is started, a system is automatically vacuumized, so that the chip wafer is made to be in a vacuum environment in the product cleaning process for digitally cleaning the chip wafer, and the systemcarries out automatic chemical liquid proportioning according to the cleaning requirement of the chip wafer; S2, a manipulator automatically grabs an iron sheet attached to the wafer and moves the iron sheet a cleaning station, the cleaning station rotates, and the wafer is brushed while a chemical proportioned liquid is sprayed to the wafer; S3, the spraying the chemical proportioned liquid is stopped, a two-fluid flow is introduced to wash the wafer; S4, the supply of the two-fluid flow is cut off, the wafer is dried and baked by utilizing the supply of hot nitrogen; S5, the wafer dried andbaked in the step S4 is transferred to a visual inspection station so as to be subjected to visual inspection, and whether the wafer is a qualified product or not is determined; and S6, if the waferis a qualified product, the cleaning process is terminated, and the material is conveyed out through a material conveying-out mechanism until the cleaning process is ended. With the product cleaning process adopted, automatic cleaning can be conducted, and a cleaning effect is improved.

Description

technical field [0001] The invention relates to the technical field of chip wafer cleaning equipment, in particular to a product cleaning process for digital cleaning of chip wafers. Background technique [0002] At present, the cleaning of chip wafers on the market mainly uses manual proportioning of the chemical solution, and then uses the method of soaking in the chemical solution, ordinary drying, and additional baking to clean the chip wafer. Although the process is simple, there are many problems. First, Difficult to digitize the ratio of the chemical solution has a great quality risk to the product quality; secondly, it is difficult to meet the cleaning requirements of the chip wafer during the soaking process, and the residual chemical solution and the damage to the product are serious; thirdly, the chemical solution cleaning There is a risk of secondary pollution to the chip wafer in the groove; the chip wafer after cleaning cannot guarantee the drying of water and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/02H01L21/66
CPCH01L21/02041H01L21/02057H01L22/12
Inventor 庞亮李谦
Owner 厦门英惟达智能科技有限公司
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