Product cleaning process for digitally cleaning chip wafers
A cleaning station, wafer technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of chip wafer cleaning quality, efficiency, yield, labor, time-consuming resources, and high costs. Improve the risk of secondary pollution, increase the utilization rate of liquid medicine, and reduce the effect of energy waste
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[0032] It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present invention will be described in detail below by way of examples.
[0033] It should be noted that the terminology used here is only for describing specific implementations, and is not intended to limit the exemplary implementations according to the present application. As used herein, unless the context clearly dictates otherwise, the singular is intended to include the plural, and it should also be understood that when the terms "comprising" and / or "comprising" are used in this specification, they mean There are features, steps, operations, means, components and / or combinations thereof.
[0034] It should be noted that the terms "first" and "second" in the specification and claims of the present application are used to distinguish similar objects, but not necessarily used to describe a specific ...
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