74results about How to "Reduce particle pollution" patented technology

Methods and apparatus for using a flow of a relatively cool gas to establish a temperature gradient between a reticle and a reticle shield to reduce particle contamination on the reticle are disclosed. According to one aspect of the present invention, an apparatus that reduces particle contamination on a surface of an object includes a plate and a gas supply. The plate is positioned in proximity to the object such that the plate, which has a second temperature, and the object, which has a first temperature, are substantially separated by a space. The gas supply supplies a gas flow into the space. The gas has a third temperature that is lower than both the first temperature and the second temperature. The gas cooperates with the plate and the object to create a temperature gradient and, hence, a thermophoretic force that conveys particles in the space away from the object.

A method and system is described for reducing particle contamination of a substrate in a deposition system. The deposition system comprises one or more particle diffusers disposed therein and configured to prevent or partially prevent the passage of film precursor particles, or break-up or partially break-up film precursor particles. The particle diffuser may be installed in the film precursor evaporation system, or the vapor delivery system, or the vapor distribution system, or two or more thereof.

A system for processing a workpiece includes a process head assembly and a base assembly. The process head assembly has a process head and an upper rotor. The base assembly has a base and a lower rotor. The base and lower rotor have magnets wherein the upper rotor is engageable with the lower rotor via a magnetic force created by the magnets. The engaged upper and lower rotors form a process chamber where a semiconductor wafer is positioned for processing. Process fluids for treating the workpiece are introduced into the process chamber, optionally while the processing head spins the workpiece. Additionally, air flow around and through the process chamber is managed to reduce particle adders on the workpiece.

The present invention is directed to aligning wafers within semiconductor fabrication tools. More particularly, one or more aspects of the present invention pertain to quickly and efficiently finding an alignment marking, such as an alignment notch, on a wafer to allow the wafer to be appropriately oriented within an alignment tool. Unlike conventional systems, the notch is located without firmly holding and spinning or rotating the wafer. Exposure to considerable backside contaminants is thereby mitigated and the complexity and / or cost associated with aligning the wafer is thereby reduced.

A method is disclosed for reducing particle contamination in an ion implantation system, wherein an ion beam is created via the ion source operating in conjunction with an extraction electrode assembly. A cathode voltage is applied to the ion source for generating ions therein, and a suppression voltage is applied to the extraction assembly for preventing electrons in the ion beam from being drawn into the ion source. The suppression voltage is selectively modulated, thereby inducing a current flow or an arc discharge through the extraction assembly to remove deposits on surfaces thereof to mitigate subsequent contamination of workpieces. An improvement to an ion implantation system is also disclosed in accordance with the foregoing, wherein a controller is configured to selectively modulate a voltage between a predetermined voltage and a predetermined suppression voltage generally concurrent with the transferring of the workpiece, thereby inducing a current flow or an arc discharge through the extraction electrode assembly to remove deposits on surfaces thereof to mitigate subsequent contamination of workpieces.

A ceramic sprayed member comprises a substrate and a ceramic sprayed coating thereon. Splats have been removed from the surface of the sprayed coating, typically by blasting. The ceramic sprayed member with improved plasma resistance mitigates particle contamination of wafers and enables stable manufacture when used in a halogen plasma process for semiconductor fabrication or the like.