52results about How to "Realize electrostatic protection" patented technology

The invention discloses a touch screen display panel and a touch screen display device. The touch screen display panel comprises a plurality of drive electrodes, a plurality of induction electrodes insulated from the drive electrodes, a plurality of drive electrode leads, a plurality of induction electrode leads, a plurality of first external terminals and a plurality of second external terminals. The drive electrodes, the induction electrodes, the drive electrode leads, the induction electrode leads, the first external terminals and the second external terminals are arranged on a color film substrate, wherein the drive electrodes are connected with the first external terminals through the drive electrode leads, and the induction electrodes are connected with the second external terminals through the induction electrode leads. The touch screen display panel further comprises a plurality of third external terminals, a plurality of fourth external terminals, a common electrode line and a static protection unit, wherein the third external terminals and the first external terminals are correspondingly arranged and electrically connected, the fourth external terminals and the second external terminals are correspondingly arranged and electrically connected, the third external terminals, the fourth external terminals, the common electrode line and the static protection unit are arranged on a TFT array substrate, and the third external terminals and the fourth external terminals are connected with the common electrode line through the static protection unit. By the adoption of the touch screen display panel and the touch screen display device, static protection of the drive electrodes and the induction electrodes can be achieved.

The invention discloses a processing method of a multipath electrostatic discharge (ESD) protector. The processing method of the multipath ESD protector comprises that N through holes are formed in a first base material which comprises a first conducting layer, a second conducting layer and a first insulating layer located between the first conducting layer and the second conducting layer; the N through holes are filled with conducting materials; pattern processing is carried out on the second conducting layer; pattern processing is carried out on the first conducting layer and / or blind grooves penetrating through the first conducting layer to the first insulating layer are machined on the first conducting layer, and a first resin layer is arranged on the first conducting layer; a protective layer is arranged on the first resin layer, N / 2 blind holes penetrating from the protective layer to the first insulating layer are formed in the protective layer; the N / 2 blind holes are filled with slurry; the protective layer is peeled from the first resin layer; and a protective upper body is arranged on the first resin layer. By means of the processing method, manufacturing cost of the ESD protector can be lowered, and safety of the ESD protector can be improved.

An embodiment of the invention discloses a processing method for a multi-way ESD (electrostatic discharge) protection device. The processing method for the multi-way ESD protection device includes: processing N blind holes on a first base material which comprises a first conductive layer, a second conductive layer and a first insulating layer between the first conductive layer and the second conductive layer; filling conductive materials in the N blind holes; performing graphic processing on the second conductive layer; performing graphic processing on the first conductive layer and / or processing a blind groove, penetrating through the first insulating layer, on the first conductive layer, and setting a first resin layer on the first conductive layer; setting a protection layer on the first resin layer; processing N / 2 blind holes, penetrating through the first insulating layer, on the protection layer; filling slurry in the N / 2 blind holes; stripping the protection layer from the first resin layer; and setting a protection upper body on the first resin layer. By means of the processing method for the multi-way ESD protection device, manufacturing cost of the ESD protection device can be lowered, and safety of the ESD protection device can be improved.

An embodiment of the present invention discloses a capacitive touch panel, which is provided with an electrostatic protection touching layer, the electrostatic protection touching layer comprises a touching array pattern and an electrostatic protection discharging pattern, and the electrostatic protection discharging pattern is disposed in a space of the touching array pattern, complementing with the touching array pattern. The capacitive touch panel of the embodiment of the present invention, reduces the thickness of touch panel, and saves the material by forming the electrostatic protection layer and the touch sensing layer on one layer, which realizes the touching sense as well as the electrostatic protection, eliminates the capacitance between the electrostatic protection layer and the touch sensing layer, and improves the sensitivity of touching sense.

A sealing ring structure and a preparation method thereof relate to the technical field of integrated circuits. The sealing ring structure includes an enhanced high electron mobility transistor, a diode group and a resistor manufactured through a semiconductor epitaxial layer. On the periphery of the device area; the anode of the diode group is used for metal connection with the first electrode of the semiconductor device, the cathode is metal connected with the first metal end of the resistor, and the second metal end of the resistor is used for metal connection with the second electrode of the semiconductor device; The gate of the type high electron mobility transistor is connected with the cathode metal of the diode group, the drain is used for connecting with the first electrode metal, and the source is used for connecting with the second electrode metal of the semiconductor device. The sealing ring structure can utilize the area of ​​the sealing ring to realize the electrostatic protection function, thereby saving the area of ​​the device.

The present invention provides a display panel and a display device, wherein the display panel includes: a signal line arranged along a first direction in the display area and extending to a non-display area; at least one first-type reference voltage bus line in the The non-display area is arranged along a second direction, wherein the second direction intersects with the first direction; an electrostatic discharge unit is arranged in the non-display area on the first-type reference voltage bus along the first direction, and the electrostatic discharge unit is arranged symmetrically with respect to the first-type reference voltage bus, wherein the signal line is electrically connected to the first-type reference voltage bus through the electrostatic discharge unit. It is used to realize the electrostatic protection of the display panel in a limited space.

The invention provides an embedded chip and a preparation method thereof. When the embedded chip is patterned and plated on a circuit board, a conductive closed-loop structure surrounding the chip body inside the circuit board is formed, so that the chip The pin pads of the main body are connected to each other through a conductive closed-loop structure, and then when the chip pins are subsequently formed, the electrostatic current generated by cutting the chip can be dispersed through the conductive closed-loop structure to achieve electrostatic protection for the chip.

The present invention discloses a space electrostatic protection solar cell interconnection package structure and a method. The space electrostatic protection solar cell interconnection package structure disclosed by the invention comprises a substrate, solar cells and anti-radiation conductive glass cover sheets; the surface of the substrate is coated with a layer of high-resistance conductive adhesive; the solar cells are bonded onto the surface of the substrate; one missing corner of each solar cell is connected in parallel with a bypass diode; the conductive layers of the anti-radiation conductive glass cover sheets are far away from the solar cells and cover the surfaces of the solar cells; the upper surface, lower surface and corresponding side surfaces of one corner of each anti-radiation conductive glass cover sheet are plated with metal thin films; and the metal thin films are connected in series with the bypass diodes through the high-resistance conductive adhesive. The method of the invention is not only compatible with a traditional solar cell ray assembly process, but also is simple and reliable. With the method adopted, automatic assembly can be realized.

The invention provides an embedded chip and a preparation method thereof. The embedded chip includes a circuit board on which electroplated metal is arranged; a chip body located inside the circuit board, and the chip body has a plurality of solder pins a disc, the plurality of pin pads are led out from the electroplated metal to form a plurality of chip pins; and a conductive insert, which is detachably inserted into the plurality of chip pins. By providing the embedded chip with a conductive insert that can be detachably plugged with its chip pins, the chip pins are connected to each other through the conductive insert during the placement and movement of the embedded chip, thereby improving the resistance of the chip. Electrostatic capability, to achieve electrostatic protection of the chip, just remove the conductive plug-in when the embedded chip needs to be used.

The invention discloses an electrostatic protection circuit and relates to the technical field of integrated circuit design. The electrostatic protection circuit is applied to an integrated circuit chip. An internal circuit in the integrated circuit chip is connected with a bonding pad end, an internal power supply end and a grounding end. The electrostatic protection circuit comprises: an electrostatic protection circuit; and the input end of the first protection circuit is connected between the internal circuit and the bonding pad end. The output end of a first protection circuit is connected with the internal power supply end. The first protection circuit is used for electrostatic protection between the integrated circuit chip and the internal power supply end. The electrostatic protection circuit has the beneficial effects that ESD current generated between the bonding pad end and the internal power supply end is prevented from damaging the internal circuit, so that electrostatic protection between the integrated circuit chip and the internal power supply end is realized. The invention further provides a semiconductor integrated circuit device and electronic equipment which have the effects.