36results about How to "Meet the needs of packaging" patented technology

The invention discloses a method for quickly producing uniform core-shell type alloy solder balls. The method includes the following steps: weighing Cu, Sn and Bi alloys in the appropriate proportion prior to putting the alloy into a crucible, and closing the crucible and a vacuum chamber; heating to enable the metal to melt; jetting out the molten metal from holes in the bottom of the crucible, and performing jet breaking to form uniform small droplets under the condition of oscillation of a piezoelectric oscillator; feeding the uniform droplets into a spiral liquid nitrogen cooling device to form the core-shell type solder balls. The core-shell type solder balls produced by the one-step method have the advantages of high uniformity and high finished product ratio. The defects of complicated original preparation technology and particle nonuniformity are overcome. The requirements on electronic packaging of existing integrated circuits can be met, reliability in solder joint connection is improved, and application and popularization prospect is high.

The invention discloses a preparation method of release paper with a simulated watermark pattern, which comprises the following steps of: firstly, manufacturing a printing roller; secondly, preparing a release agent: the release agent comprises 1 part by weight of silicone oil, 8 / 1000 parts by weight of catalyst, 3-6 parts by weight of food special organic solvent, the catalyst is a noble metal catalyst, and the food special organic solvent is No. 6 solvent oil or edible aromatic hydrocarbon; thirdly, printing the watermark pattern: installing the manufactured printing roller on a printing press, taking the release agent as printing ink and printing the watermark pattern on greaseproof paper; and fourthly, drying: drying the printed release paper in a drying tunnel, ensuring that the temperature of the drying tunnel is 80-120 DEG C, the air quantity in the drying tunnel is 7000-9000 m3 / h, and the drying time is 15-30s and obtaining the release paper with the simulated watermark pattern. The preparation method has simple process and lower cost; and the prepared release paper with the simulated watermark pattern can fully satisfy the demands of food packaging.

Green phosphor activated by cerium ions is characterized in that the general chemical formula is as follows: (Ca1-x-p-q, M1x) (Sc1-y, M2y) <2> M3bO3+a+2b: Cep, M4q, wherein the M1 refers to Ba, Sr, Mg or Zn; M2 refers to Ga, Al or B; M3 presents Si or Ge, and M4 presents Y, La, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb or Lu; and x is smaller than 1 and larger than 0, y is smaller than or equal to 0.1 and larger than or equal to 0, a is smaller than or equal to 3 and larger than or equal to1, b is smaller than or equal to 3 and larger than or equal to 0, p is smaller than or equal to 0.2 and larger than or equal to 0.001, and q is smaller than or equal to 0.3 and larger than or equal to 0. The green phosphor provided by the invention can emit 480-620 nm light under the excitation of 400-480 nm light, and is the green phosphor suitable for an LED (Light Emitting Diode) chip with blue light.

The invention discloses a method and a device for improving the color temperature consistency of a white light LED (Light Emitting Diode) lighting device. The method comprises the following steps: step 1, firstly covering a light transmitting lens on an LED chip fixed on a substrate and spraying a layer of silica gel on the light transmitting lens, wherein the thickness of the silica gel is 10-1000 micron, and the LED chip is a blue light chip; step 2, spraying and fixing a layer of yellow fluorescent powder on the silica gel; step 3, supplying power to the LED chip so that the LED chip emits light, and detecting the color temperature of the light which transmits through the transmitting lens, the silica gel and the fluorescent powder by using a probe of color temperature detecting equipment; and if a preset light wave length range or a color temperature range is achieved, stopping the fluorescent powder spraying process and carrying out a next step, or else turning back to the step 2. By adoption of the method and the device for improving the color temperature consistency of the white light LED lighting device, the color temperature of the LED lighting device can be regulated on line, and the precision is high.

The Cu-W film coating integrated composite heat sink comprises an oxygen-free copper matrix 1 with deposed 8 mum-15 mum Cu-W film 2 that composes by 8.1-17.5wt% Cu and W. This invention matches semiconductor chip on thermal expansion, can avoid damage to the chip, and satisfies the request of high-power semiconductor laser to improve the laser lifetime greatly.

The invention belongs to the technical field of bonding wire materials, and relates to a high- platinum-metal-content silver-palladium bonding wire and a preparation process thereof. The silver-platinum bonding wire comprises the following composition components of silver, platinum, copper, calcium, chromium, and other doped elements of indium, lanthanum, and iridium. Use of silver metal in combination with platinum metal helps to enhance strength and improve elongation of the wire, tensile force and thrust can meet the corresponding requirements, excellent welding performance and mechanical properties are achieved, during a preparation process, alloys are adopted for separate casting, a layer of platinum-silver alloy layer is further plated, in addition, the process of refining the wire and corresponding uniform annealing treatment are conducted, so that the bonding material with high radian, long span, good tensile force and large thrust can be formed, and the requirements of applications to in-line LED packaging, discrete devices, chip packaging and common integrated circuit packaging can be met.

The invention relates to a cigarette packaging machine, which comprises a cigarette packet packaging device and a transparent paper packaging device. The cigarette packet packaging device is connected with a cigarette packet overturning device through a conveying device, and the cigarette packet overturning device is then connected with the transparent paper packaging device through the conveying device; and the cigarette packet overturning device comprises at least one rotating tower which is placed horizontally or vertically. The rotating towers can be placed in different modes, so that the direction of a cigarette packet entering a transparent paper packaging position can be flexibly changed, and requirements on packaging of cigarette packets at different pull strap head positions can be met.

The invention relates to the field of smart card manufacturing, in particular to a flexible double-faced package substrate. The flexible double-faced package substrate comprises a mutually-compressed cured piece, two adhesive films and two copper foils, wherein the adhesive films are located on two sides of the cured piece respectively, the two copper foils are located on the adhesive films respectively, and through holes are formed in the cured piece, the two adhesive films and one copper foil. The invention further provides a method for manufacturing the flexible double-faced package substrate. The flexible double-faced package substrate is not sticky and does not influence operation during follow-up and high-temperature baking and can meet double-interface application.

The invention provides an agricultural wheat straw environmental protection treatment device. The device comprises a fixed base, a wheat straw crushing and stirring shaft structure, a wheat straw continuous feeding transmission belt structure, an environment-friendly dust recovery cover structure, an adjustable leakage-proof recovery plate structure, a wheat straw feed containing frame structure capable of being used for weighing, a material guide distributing cylinder, support base frames, a funnel, a manual regulating valve, a filter screen plate, a wheat straw treatment box, an anti-dust box cover, a corrugated connection cover, a slope plate and a device control box. According to the invention, through the arrangement of a wheat straw stirring driving motor, a stirring shaft, crushingblades and a stirring rod, stirring and crushing on wheat straw are facilitated, the wheat straw is prepared into feed for easy storage and is used as the feed for livestock animals, and the environmental protection treatment of wheat straw is facilitated. Through the arrangement of a leaked material recovery plate, a recovery pipe and a wheat straw leakage storage box, the recovery and collectionof wheat straw materials which are leaked inadvertently during a conveying process are facilitated, and the utilization rate of the wheat straw is improved.

The invention discloses a forming device for aluminum-plastic boards for capsules. The forming device for the aluminum-plastic boards for the capsules comprises an operating table. A first supporting plate and a second supporting plate are fixedly and vertically arranged under the operating table. A storage plate is horizontally arranged between the first supporting plate and the second supporting plate. A sliding block is arranged on the side, close to the first supporting plate, of the storage plate. A sliding groove corresponding to the sliding block is formed in the first supporting plate. The side, away from the first supporting plate, of the storage plate penetrates through the second supporting plate and is connected with a rack. A first opening corresponding to the storage plate is formed in the second supporting plate. A driving motor is arranged on one side of the storage plate. The output end of the driving motor is connected with a rotary shaft. The forming device for the aluminum-plastic boards for the capsules is simple in structure, convenient to use, small in size and low in cost; and only through movement of the driving motor, the aluminum-plastic boards are continuously formed through extrusion, the production efficiency is high, and the requirement for capsule packaging can be met.

The invention discloses a steel pipe discharging packaging production line and belongs to the field of steel pipe discharging equipment. The steel pipe discharging packaging production line comprisesa conveying chain. Multiple hanging tools are arranged at the lower ends of the two sides of the conveying chain, and lifting hooks are arranged at the lower ends of the hanging tools. Steel pipes arehung at the lower ends of the lifting hooks, and packaging assemblies are arranged at the discharging end of the conveying chain. An unhooking assembly is arranged at the end, close to each packagingassembly, of the conveying chain. Each unhooking assembly comprises a rotating plate. The upper ends of the rotating plates are hinged to a fixing device of a production line, and the lower ends of the rotating plates are fixedly provided with unhooking air cylinders. Push plates are arranged on output shafts of the unhooking air cylinders, the push plates are arranged corresponding to the uppermiddle ends of the lifting hooks, the push plates are arranged on the inner sides of the lifting hooks, and the moving direction of the push plates is perpendicular to the side faces of the lifting hooks. By means of the steel pipe discharging packaging production line, automatic discharging of the steel pipes can be achieved, the labor intensity is lowered, and the work efficiency is improved.

The invention belongs to the technical field of bonding wire materials, and relates to a silver-platinum bonding wire material containing high platinum metal and a preparation process thereof. The composition of the silver-platinum bonding wire includes silver, platinum, copper, calcium, chromium, and other doping elements indium, lanthanum, and iridium; the use of silver metal in combination with platinum metal helps to enhance the strength and elongation of the wire The increase in tension and thrust can meet the corresponding requirements, and it has excellent welding performance and mechanical properties. The wire material and the corresponding uniform annealing treatment form a bonding material with high radian, long span, good tensile force and large thrust force, which can meet the requirements of in-line LED packaging, discrete devices, chip packaging and ordinary integrated circuit packaging. demand.

The invention provides a chain plate type cleaning device and part cleaning equipment, and relates to the field of part cleaning, the chain plate type cleaning device comprises a chain plate conveying mechanism and a cleaning component, the intermittently moving chain plate conveying mechanism is provided with a plurality of positioning blocks at equal intervals in the moving direction, and the cleaning component is located above the chain plate conveying mechanism; the cleaning component comprises a cleaning mechanism, a drying mechanism and a cooling mechanism which are arranged in sequence, double-layer partition plates are arranged between the cleaning mechanism and the drying mechanism and between the drying mechanism and the cooling mechanism respectively, and part matching parts are arranged on the positioning blocks; in order to solve the problem that high-precision parts cannot be effectively cleaned by existing part cleaning equipment, a positioning block on a chain plate conveying mechanism can restrain the positions of the parts to be cleaned, the parts are conveyed into a cleaning area in a stable state, the postures of the parts can be matched with the positions of nozzles of cleaning components, and the cleaning effect is guaranteed; the position change of the part in the washing process is avoided, the posture of the part is kept, and damage to the part in the cleaning process is reduced.

The invention provides a packaging box molding machine applied to a full-automatic packaging line for an LED lamp tube. A rack (1) is provided with a feed bin base plate frame (2); a rail A (4) is arranged by the side of the feed bin base plate frame (2); a rail bearing A (3) is arranged at the top end of the rail A (4); the upper end of the rail A (4) is provided with a rail rod (5); a side plate(6) is arranged by the side of the rail rod (5); a servo control motor (8) is arranged at the side of the rack (1) and is fixed to a servo control motor fixing frame (7); the rack is provided with avacuum sucking disc rotation control cylinder fixing frame (9) and a packaging box tape adhering device; the packaging box tape adhering device can be used for sealing a packaging box in time so as toimprove the box sealing efficiency and meet the requirements of lamp tube machining and packaging under different working conditions; each molding machine can realize automatic feeding and discharging in an overall production line; and thus automatic matching and transmission can be implemented between the molding machines and the procedures.

Various woven bags for packaging on the current market are formed by weaving plastic and are used for packaging in the food industry, the general merchandise industry, the chemical industry, the medicine industry and the like, and as is well-known, plastic woven bag products cannot be degraded after being discarded in the natural environment for hundreds of years. In order to solve the problem, the invention provides a 100% compostable full-degradable environment-friendly packaging woven bag product. 100% compostable completely-degradable environment-friendly flat threads are pulled out from 100% completely-degradable PBAT, PLA, biological starch and other materials through special equipment, then the flat threads are woven into a cylinder material to be rolled up, finally the cylinder material is sewn into a 100% compostable completely-degradable environment-friendly packaging woven bag through pure cotton threads, and different packaging schemes are formed by covering the 100% compostable full-degradable environment-friendly packaging woven bag with 100% pure paper or by the 100% compostable full-degradable packaging bag. The use requirements of various industries for woven bags can be met, the product can be completely degraded after composting when discarded and finally becomes substances such as water and carbon dioxide which do not pollute the environment, and the product will be the best substitute for various plastic woven bags in the future.

The Cu-W film coating integrated composite heat sink comprises an oxygen-free copper matrix 1 with deposed 8 mum-15 mum Cu-W film 2 that composes by 8.1-17.5wt% Cu and W. This invention matches semiconductor chip on thermal expansion, can avoid damage to the chip, and satisfies the request of high-power semiconductor laser to improve the laser lifetime greatly.

The invention discloses an inclined light-emitting LED packaging structure which comprises a fixing support and a packaging support, the packaging support is movably embedded into the fixing support, a plurality of packaging fixing grooves are formed in the packaging support, each packaging fixing groove is connected with a plurality of 7-shaped inclined functional weld legs, each inclined functional weld leg comprises a packaging part, a first connecting part, a first fixing part and a first limiting part, the packaging part is vertically connected with one end of the first connecting part, the other end of the first connecting part is obliquely connected with one end part of the first fixing part, and the other end part of the first fixing part is connected with the first limiting part. The inclined light-emitting LED packaging structure has the advantages of simple structure, attractiveness, compactness and low cost.

The invention discloses a preparation method of release paper with a simulated watermark pattern, which comprises the following steps of: firstly, manufacturing a printing roller; secondly, preparing a release agent: the release agent comprises 1 part by weight of silicone oil, 8 / 1000 parts by weight of catalyst, 3-6 parts by weight of food special organic solvent, the catalyst is a noble metal catalyst, and the food special organic solvent is No. 6 solvent oil or edible aromatic hydrocarbon; thirdly, printing the watermark pattern: installing the manufactured printing roller on a printing press, taking the release agent as printing ink and printing the watermark pattern on greaseproof paper; and fourthly, drying: drying the printed release paper in a drying tunnel, ensuring that the temperature of the drying tunnel is 80-120 DEG C, the air quantity in the drying tunnel is 7000-9000 m3 / h, and the drying time is 15-30s and obtaining the release paper with the simulated watermark pattern. The preparation method has simple process and lower cost; and the prepared release paper with the simulated watermark pattern can fully satisfy the demands of food packaging.

The invention discloses a liquid packaging bottle. The liquid packaging bottle includes a bottle body, a straw, a first twist-off part and a second twist-off part. The bottle body has an accommodating chamber for containing liquid, and the bottle body is provided with a first opening and a second opening, both of which are connected to the accommodating chamber. The straw is located in the accommodating chamber, and the straw is connected to the inner wall of the accommodating chamber, one end of the straw communicates with the first opening, and the other end is located at the bottom of the accommodating chamber. The first twist-off part is connected to the bottle body and seals the first opening, when the first twist-off part is separated from the bottle body, the first opening is opened, the second twist-off part is connected to the bottle body, and The second opening is sealed, and when the second twist-off part is separated from the bottle body, the second opening is opened. The liquid packaging bottle of the present invention not only maintains the airtightness of the liquid in the bottle, but also prevents pollutants outside the bottle from entering the bottle.

The invention relates to the field of smart card manufacturing, in particular to a flexible double-faced package substrate. The flexible double-faced package substrate comprises a mutually-compressed cured piece, two adhesive films and two copper foils, wherein the adhesive films are located on two sides of the cured piece respectively, the two copper foils are located on the adhesive films respectively, and through holes are formed in the cured piece, the two adhesive films and one copper foil. The invention further provides a method for manufacturing the flexible double-faced package substrate. The flexible double-faced package substrate is not sticky and does not influence operation during follow-up and high-temperature baking and can meet double-interface application.

The invention discloses a seed transmission branch guide material packaging mechanism, which belongs to the field of seed transmission packaging machinery and equipment. The invention includes a material transfer bracket, a seed storage hopper, a seed transmission mechanism, a material retaining mechanism, a metering transfer mechanism and a tank transfer mechanism. It is directly fixed on the material transfer bracket on the upper side of the seed transmission mechanism, the material blocking mechanism and the metering transfer mechanism are sequentially arranged on the material transfer bracket at the lower side of one end of the seed transfer mechanism from top to bottom, and the transfer brackets on both sides of the metering transfer mechanism are respectively A tank passing mechanism is arranged horizontally and symmetrically. The invention has a reasonable structural design, and can continuously and stably transport and guide the seeds, so that the seeds can be measured, transported and packaged in separate paths accurately and efficiently, realize automatic delivery and packaging of the seeds, and meet the needs of seed packaging and use.

The invention provides an antimicrobial UV curing printing ink, comprising 7-10wt% of compound antibacterial agent, 10-25wt% of pigment, 33-62wt% of UV vehicle, 3.9-9wt% of photoinitiator, 4-40wt% of diluent, and 1-4wt% of auxiliary agent. The invention further provides a preparation method of the antimicrobial UV curing printing ink. According to the invention, the problems of no antibacterial effect, impact on people' health, unsanitariness, etc. of UV printing inks in the prior art are overcome, and the antimicrobial UV curing printing ink disclosed herein has high-efficiency antibacterial property, good usage effect, and wide range of application, can effectively cut off the propagation approach of pathogens and guarantee people' health, and has good market prospect, etc.

The invention belongs to the field of LED packaging materials, and particularly relates to a small-spacing epoxy molding compound applied to an outdoor display screen and a preparation method thereof. The epoxy resin composition is prepared from the following raw materials in parts by weight: 50 parts of triglycidyl isocyanurate epoxy resin, 1-30 parts of a chain extender, 10-100 parts of a curing agent and 0.05-10 parts of an additive which comprises an adhesion promoter. The preparation method of the epoxy resin-based molding compound containing the triglycidyl isocyanurate structure epoxy resin capable of being applied to outdoor display small spacing is simple, process parameters are easy to control, no solvent is used in the manufacturing process, and the preparation method is a green and environment-friendly production and preparation process. The obtained low-light-decay epoxy resin-based plastic packaging material has the advantages of strong adhesion, high and low temperature impact resistance and reflow soldering resistance, and the light decay can meet the requirements of packaging of most white light LEDs.

The invention discloses a silicon nitride ceramic heat dissipating fin copper-clad plate and a preparation method thereof. The silicon nitride ceramic heat dissipating fin copper-clad plate comprisesa silicon nitride ceramic plate and a metal conductive layer,and a transition layer of an aluminum oxide layer or metal silicon layer is sputtered between the silicon nitride ceramic layer and the metal conductive layer through magnetic control to weld the silicon nitride ceramic layer and the metal conductive layer. The method solves the problems that the silicon nitride ceramic is difficultly welded with a metal copper plate or an aluminum plate,and the heat dissipating fin is arranged at one side away from the metal layer,so that the heat dissipation area is increased,the heat dissipation efficiency is improved,and the requirement of the high-power IGBT package can be satisfied.

The invention discloses a method and a device for improving the color temperature consistency of a white light LED (Light Emitting Diode) lighting device. The method comprises the following steps: step 1, firstly covering a light transmitting lens on an LED chip fixed on a substrate and spraying a layer of silica gel on the light transmitting lens, wherein the thickness of the silica gel is 10-1000 micron, and the LED chip is a blue light chip; step 2, spraying and fixing a layer of yellow fluorescent powder on the silica gel; step 3, supplying power to the LED chip so that the LED chip emits light, and detecting the color temperature of the light which transmits through the transmitting lens, the silica gel and the fluorescent powder by using a probe of color temperature detecting equipment; and if a preset light wave length range or a color temperature range is achieved, stopping the fluorescent powder spraying process and carrying out a next step, or else turning back to the step 2. By adoption of the method and the device for improving the color temperature consistency of the white light LED lighting device, the color temperature of the LED lighting device can be regulated on line, and the precision is high.

According to the technical scheme, a special packaging device comprises paper; hollow words are printed on the paper; and the words can be Chinese characters or English letters or flower and bird patterns or combinations of the Chinese characters, the English letters and the flower and bird patterns. The packaging paper which can be selected by people freely is provided, can be processed and decorated to a certain extent according to the hobby of a user, is more unique, better conforms to characteristics of a gift and effectively meets the requirement of the user for gift packaging.

The invention relates to a cigarette packaging machine, which comprises a cigarette packet packaging device and a transparent paper packaging device. The cigarette packet packaging device is connected with a cigarette packet overturning device through a conveying device, and the cigarette packet overturning device is then connected with the transparent paper packaging device through the conveying device; and the cigarette packet overturning device comprises at least one rotating tower which is placed horizontally or vertically. The rotating towers can be placed in different modes, so that the direction of a cigarette packet entering a transparent paper packaging position can be flexibly changed, and requirements on packaging of cigarette packets at different pull strap head positions can be met.

According to the surface-mounted thin film capacitor and the manufacturing method, the thin film capacitor is more miniaturized, and the requirement for integration of miniaturized circuit elements is met. The film capacitor comprises a capacitor core with an elliptical end face, two ends of the capacitor core are respectively connected with an electrode, the electrode is of an integrally formed structure and is approximately Z-shaped, and the inner electrode face of the electrode is fixedly connected with the capacitor core; the capacitor further comprises a U-shaped shell, notch parts are arranged at the ends of the two outer side faces of the shell, insertion teeth are arranged in the notch parts, insertion holes matched with the insertion teeth are formed in the two electrodes, the shell is arranged outside the capacitor core in a sleeving mode, and the insertion teeth of the shell are inserted into the insertion holes of the electrodes to be matched in an inserted mode. And the interior of the shell and the capacitor core are packaged by using an epoxy resin potting material.

The invention discloses a packaging method for a weaving-structured thin cable for a space solar battery array. The packaging method is characterized by comprising the steps of 1, performing installation position positioning; 2, performing surface treatment on a packaging position; 3, performing blade coating of a packaging material; 4, performing cable cleaning and forming; 5, performing primary packaging of the cable; and 6, performing secondary packaging of the cable. By adoption of the technical scheme, the packaging dimensions and positions of the weaving-structured thin cable can be effectively controlled, so as to satisfy use requirements on cable packaging thickness by special space models; the thickness is not greater than 0.3mm after a cable with the thickness of 0.2mm is packaged; the packaging material adopted by the packaging method is high in high-temperature characteristic and low-temperature characteristic; and the packaged weaving-structured thin cable can keep high structural growth rate in a track working condition, and is high in adaptivity to a complex thermal stress environment caused by space high temperature and low temperature alternation, so that the reliability and safety of the product are improved.