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34results about How to "Mass productivity can be improved" patented technology

Circuit for compensating passband flatness, apparatus and method for compensating passband flatness

Disclosed is an apparatus for compensating passband flatness according to the present invention. The apparatus for compensating passband flatness for a mobile communication repeater to compensate passband flatness of band passed input signals comprises: a circuit for compensating passband flatness that includes a varactor diode formed to be connected to an inductance element to correct micro resonance frequencies for passbands of input signals according to voltages applied from the outside; and a controller that controls voltages input to the circuit for compensating passband flatness and varies the voltages applied to the varactor diode of the circuit for compensating passband flatness based on preset voltage values applied to the varactor diode so that passband flatness characteristics are compensated according to the corresponding frequency bands.
Owner:ECTELECOM

Apparatus and method for treating a substrate

Provided are a substrate treating apparatus and method of manufacturing a phase-change layer having superior deposition characteristics. The substrate treating method of manufacturing a phase-change memory includes forming a bottom electrode on a substrate on which a pattern is formed, performing surface treating for removing impurities generated or remaining on a surface of the substrate while the bottom electrode is formed, performing nitriding on the surface of the substrate from which the impurities are removed, and successively depositing a phase-change layer and a top electrode on the bottom electrode. The substrate treating apparatus for manufacturing a phase-change memory includes a load lock chamber into/from which a plurality of substrates are loaded or unloaded, the load lock chamber being converted between an atmosphere state and a vacuum state, a nitriding chamber in which nitriding is performed on a surface of a substrate on which a bottom electrode is disposed, the nitriding chamber being coupled to one side of a plurality of sides of the vacuum transfer chamber, and a process chamber in which a phase-change layer is deposited on the surface of the substrate on which nitriding is performed in the nitriding process chamber, the process chamber being coupled to one of the plurality of sides of the vacuum transfer chamber.
Owner:WONIK IPS CO LTD
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