50results about How to "Large processing window" patented technology

A method is provided for removing sidelobes that are formed when patterning a positive photoresist layer with an Att. PSM, Alt. PSM or a binary mask with scattering bars. A water soluble negative tone photoresist is coated over the positive photoresist pattern and is exposed through a mask having small islands that correspond in shape, size and location to the small holes in the mask used to pattern the positive tone photoresist. After development, exposed negative tone photoresist covers sidelobes formed by the positive tone process. The negative tone photoresist functions as a mask for a subsequent etch transfer of the positive tone pattern into the substrate. A method of aligning openings in a positive tone pattern over the same openings in a negative tone pattern is also useful in preventing sidelobes in the positive tone photoresist from being transferred into the substrate.

A pressure sensor includes a sense element port, a support ring and a plurality of interference fit slits to provide a flexible interference fit between the sense element port and the support ring to form a substantially flush lap joint. The sensor also includes an electronics board inside the support ring and attached to planar mounting tabs which provide a stable mounting. Gel flow barriers protect electronics board features from unwanted non-conductive gel. Double-ended symmetrical, tapered contact springs provide manufacturing cost savings and contribute to improved alignment of an interface connector of the sensor.

The present invention relates to a method for making an open celled microcellular foam comprising providing at least one foamable polymer and a crosslinking agent in an extruder, injecting at least one blowing agent into said at least one foamable polymer and said crosslinking agent in said extruder, blending said blowing agent injected into said at least one foamable polymer and said crosslinking agent in said extruder, feeding said blended blowing agent, at least one foamable polymer and said crosslinking agent in said extruder to a die, and depressurizing said blended blowing agent, said at least one foamable polymer and said crosslinking agent.

A multi-junction solar cell having a first subcell made of an InGaAs compound. The first subcell has a first lattice constant and A second subcell has a second lattice constant. The first lattice constant is at least 0.008 Å greater than the second lattice constant. A metamorphic buffer is formed between the first subcell and the second subcell and has a sequence of at least three layers and a lattice constant increases from layer to layer in the sequence in the direction toward the first subcell. The lattice constants of the layers of the buffer are greater than the second lattice constant, and a layer of the metamorphic buffer has a third lattice constant that is greater than the first lattice constant. A number N of compensation layers for compensating the residual stress of the metamorphic buffer is formed between the metamorphic buffer and the first subcell.

A method of manufacturing contact hole is provided. First, a mask layer is formed on a substrate and a plurality of trenches is formed in the mask layer along two directions that cross over each other. The depth of the trenches is not greater than the thickness of the mask layer. However, there is an opening in the mask layer in the place where the trenches cross over each other. The opening exposes the substrate. Part of the substrate exposed by the opening is removed to form a contact hole in the substrate. In photolithography, it is easier to form lines than to form dots. Hence, the dimensions of contact holes are more precisely controlled.

A pressure sensor includes a sense element port, a support ring and a plurality of interference fit slits to provide a flexible interference fit between the sense element port and the support ring to form a substantially flush lap joint. The sensor also includes an electronics board inside the support ring and attached to planar mounting tabs which provide a stable mounting. Gel flow barriers protect electronics board features from unwanted non-conductive gel. Double-ended symmetrical, tapered contact springs provide manufacturing cost savings and contribute to improved alignment of an interface connector of the sensor.

A semiconductor memory device includes a substrate, shallow trench isolations protruding from the substrate, a floating gate formed conformally on the surface of the recess between each shallow trench isolation, a tunnel layer formed between each floating gate and the substrate, a dielectric layer formed conformally on the floating gates, and a control gate formed on the dielectric layer.

The present invention provides a SWP (surface wave plasma) processing system that does not create underdense conditions when operating at low microwave power and high gas pressure, thereby achieving a larger process window. The DC ring subsystem can be used to adjust the edge to central plasma density ratio to achieve uniformity control in the SWP processing system.

A method for SAC etching is provided involving a) etching a Si wafer having a nitride present thereon with a first etching gas containing a first perfluorocarbon and carbon monoxide, and b) etching the resultant Si wafer having an initially etched nitride photoresist thereon with a second etching gas containing a second perfluorocarbon in the substantial absence of carbon monoxide, wherein the etching steps a) and b) are performed at high RF power and low pressure compared to conventional processes to provide higher selectivity etching and a larger process window for SAC etching, as well as the ability to perform SAC etching and island contact etching under the same conditions with high verticality of the island contact and SAC walls.

The invention relates to a method for producing partially-hardened components from steel sheets, in which a component that is cold-formed from a hardenable steel sheet material is heated, in a furnace, to a temperature below the austenitisation temperature (<AC₃), and a radiating element acts upon the component in sections where said component is to be austenitised (<AC₃), this radiating element having a component-side contour that corresponds to the contour of the component in the section to be austenitised. The invention also relates to a device for carrying out said method.

A method for reducing the surface roughness of a metal layer is provided. In some embodiments, the method may include polishing the metal layer to a level substantially above any layers arranged directly beneath the metal layer. In some cases, the semiconductor topography comprising the metal layer may be substantially absent of any material laterally adjacent to the metal layer during polishing. In either case, a semiconductor topography having a metal layer with a mean surface roughness less than the mean surface roughness obtained during the deposition of the metal layer may be obtained. As such, the method may include reducing the mean surface roughness of a metal layer. For example, the method may include reducing the mean surface roughness of a metal layer by at least a factor of ten.

Environmentally friendly thick film layers for a micro-fluid ejection head and micro-fluid ejection heads are disclosed. The environmentally friendly thick film layer includes a negative photoresist layer derived from a composition comprising a multi-functional epoxy compound, a low molecular weight polymeric difunctional epoxy compound, a monomeric difunctional epoxy compound, a methide-based photoacid generator that does not contain antimony, a chromophore and an aryl ketone solvent. Optionally the photoresist layer contains an adhesion enhancer. The negative photoresist layer is environmentally friendly and provides good resolution, well defined critical dimensions, straight side walls, and a large processing window.

A liquid crystal display and a method for manufacturing the liquid crystal display is disclosed. The method includes the steps of: (a) applying an adhesive onto at least one of a pair of substrates; (b) dispensing a liquid crystal material to at least one of the pair of substrates; (c) superposing one of the pair of substrates upon the other substrate; and (d) conducting a curing process of the adhesive in an air pressure greater than atmospheric pressure such that one of the substrates is concave toward the other substrate in the finished liquid crystal display.

Described are systems and methods for orienting a semiconductor wafer during semiconductor fabrication with the aid of an optical alignment system, the semiconductor wafer having an alignment mark with regular structures, on the basis of which the position of the semiconductor wafer can be determined.

A fabrication method of a flash memory is provided. The substrate having a cell region and a peripheral circuitry region is provided. A patterned dielectric layer and a patterned conductive layer are formed on the substrate, and isolation structures are formed in the substrate. An inter gate dielectric layer and a poly layer are formed sequentially over the substrate. The poly layer and the inter gate dielectric in peripheral circuitry region are removed. After forming a second conductive layer and a mask layer over substrate, memory cells are formed in the cell region and a gate structure is formed in the peripheral circuitry region. A conductive plug is formed above the gate structure for electrically connecting the second conductive layer. Since the inter gate dielectric layer in the peripheral circuitry region is removed, the fabrication of the conductive plug can be simpler and the process window thereof can be improved.