The invention discloses a high-precision integrated circuit chip packaging device and its packaging technology, comprising an upper case, a lower case and a liner, a chip is fixed on the liner, and the opposite sides of the upper case and the lower case are There is a second light guide frame, the inner and outer sides of the second light guide frame are provided with glued grooves, and the second light guide frame of the upper shell is provided with a mating block, and the four mating blocks are equiangularly divided. Arrangement, the top of the mating block extends through the upper case and is fixed with the first light guide frame, and the second light guide frame of the lower case is provided with a mating groove that matches the mating block. The structure of the present invention is simple , high packaging efficiency, strong heat dissipation and shock resistance of the packaging structure, and can be completely disassembled after packaging, easy to maintain and reuse, simple process, effectively reducing manufacturing costs, has market prospects, and is suitable for promotion.