High-precision integrated circuit chip packaging device and packaging process thereof

Abstract

The high-precision integrated circuit chip packaging device comprises an upper shell, a lower shell and a lining plate, a chip is fixed to the lining plate, the opposite sides of the upper shell and the lower shell are each provided with a second light guide frame, the inner side and the outer side of a frame body of each second light guide frame are each provided with a gluing groove, and the gluing grooves are formed in the inner side and the outer side of the frame body of each second light guide frame. The second light guide frame of the upper shell is provided with four folding blocks, the four folding blocks are evenly distributed at equal angles, the top ends of the folding blocks extend to penetrate through the upper shell and are fixedly provided with a first light guide frame, and the second light guide frame of the lower shell is provided with folding grooves matched with the folding blocks. And the packaging structure can be completely disassembled after being packaged, is convenient to maintain and reuse, is simple in process, effectively reduces the manufacturing cost, has market prospects and is suitable for popularization.

Description

technical field [0001] The invention relates to the field of chip packaging, more specifically, to a high-precision integrated circuit chip packaging device and a packaging process thereof. Background technique [0002] In the existing semiconductor stack packaging technology, usually an adhesive material is directly arranged between the chips to complete the bonding, and then the bonded chip package is packaged with a resin material. However, in the actual packaging process, especially in the packaging process of high-precision integrated circuit chips, due to the low stability of chip bonding, it is easy to cause chip peeling and dislocation during the process of packaging with resin, which will affect the semiconductor stack. The stability of the packaging structure leads to an increase in manufacturing costs. At the same time, the existing packaging devices do not have shock resistance and high heat dissipation, and cannot effectively protect high-precision integrated ci...

AI Technical Summary

Problems solved by technology

However, in the actual packaging process, especially in the packaging process of high-precision integrated circuit chips, due to the low stability of chip bonding, it is easy to cause chip peeling and dislocation during the process of packaging with resin, which will affect the semiconductor stack. The stability of the packaging structure leads to an increase in manufacturing costs. At the same time, the existing packaging devices do not have shock resistance and high heat dissipation, and cannot effectively protect high-precision integrated circuit chips.

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