The invention provides an
infrared thermal imaging sensor pixel and an
infrared thermal imaging sensor, and relates to the field of sensor pixels, wherein the
infrared thermal imaging sensor pixel comprises bridge piers, bridge arms, a bridge floor,
interconnection through holes, thermistors and release holes; and the whole pixel structure is of a
sandwich type laminated structure, top aluminum is located on the bottommost layer of the pixel structure, the bridge floor is located on the topmost layer of the pixel structure, and the bridge piers, the bridge arms, the
interconnection through holes and the thermistors are all located in the laminated structure. Through the design of the
sandwich type laminated structure, the arrangement area of the thermistors is increased, the
utilization rate of the whole pixel structure is improved, and the
flicker noise of the material is reduced. In combination with the folding arrangement of the bridge arms, the length of the bridge arms is further increased in a limited space, so that the
thermal conductivity of the pixel structure is reduced, and the overall response rate of the pixel structure is improved. In addition, due to the design of the central release hole, the release of the PI
adhesive in the
combustion process of a PI sacrificial layer is optimized under the condition that the thermistors are not damaged.