Infrared thermal imaging sensor pixel and infrared thermal imaging sensor

Abstract

The invention provides an infrared thermal imaging sensor pixel and an infrared thermal imaging sensor, and relates to the field of sensor pixels, wherein the infrared thermal imaging sensor pixel comprises bridge piers, bridge arms, a bridge floor, interconnection through holes, thermistors and release holes; and the whole pixel structure is of a sandwich type laminated structure, top aluminum is located on the bottommost layer of the pixel structure, the bridge floor is located on the topmost layer of the pixel structure, and the bridge piers, the bridge arms, the interconnection through holes and the thermistors are all located in the laminated structure. Through the design of the sandwich type laminated structure, the arrangement area of the thermistors is increased, the utilization rate of the whole pixel structure is improved, and the flicker noise of the material is reduced. In combination with the folding arrangement of the bridge arms, the length of the bridge arms is further increased in a limited space, so that the thermal conductivity of the pixel structure is reduced, and the overall response rate of the pixel structure is improved. In addition, due to the design of the central release hole, the release of the PI adhesive in the combustion process of a PI sacrificial layer is optimized under the condition that the thermistors are not damaged.

Description

technical field [0001] The invention relates to the field of imaging sensors, and more specifically, to an infrared thermal imaging sensor pixel and an infrared thermal imaging sensor. Background technique [0002] With the development of uncooled infrared thermal focal plane detector technology, the application of infrared imaging technology has gradually entered people's lives. In the infrared system, the infrared thermal imaging sensor is the core, which uses the physical effect presented by the interaction between infrared radiation and matter to detect infrared radiation. In an infrared imaging sensor, the pixel structure is the core, mainly composed of a ROIC (ReadOut Integrated Circuit, readout integrated circuit) substrate, bridge piers, bridge decks, and bridge arms. [0003] With the development of micro-machine manufacturing MEMS (Micro-Electro-Mechanical System, Micro-Electro-Mechanical System) technology, infrared thermal imaging sensors have achieved miniaturi...

AI Technical Summary

Problems solved by technology

However, due to the fact that the cross-section of the bridge arm is in a special shape such as continuous trapezoidal waveform or zigzag, the preparation process is complicated and the cost is high. The existing MEMS planar process is difficult to support the widespread use of this improved technology.

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