The invention discloses a
cutting method for reducing the
cutting loss of an LED
chip. The method comprises steps of firstly carrying out the half-
cutting of a P surface of the
chip, carrying out thetesting through a testing
machine, and facilitating the output of photoelectric parameters, such as brightness,
voltage and
wavelength, of the
chip;
coating photoresist on the P surface of the chip byusing a spin coater to form a shielding film, exposing and developing the P surface of the chip, and corroding and exposing a cutting channel;
coating photoresist on the N surface of the chip to protect the
metal on the N surface and facilitate subsequent
dry etching; washing off the shielding film on the P surface, pasting a blue film, finally washing off the
adhesive film on the N surface, pouring the film, and finishing the cutting operation. According to the cutting method for reducing the cutting loss of the LED chip, the N-surface
adhesive film design is utilized, and
dry etching is matched, so situations of edge breakage,
wafer flying and the like during chip cutting are effectively avoided, cutting loss of the chip is reduced, meanwhile, light emitting efficiency of tube core particles is guaranteed, the product yield is increased, and practicability is high.