32results about How to "Eliminate alignment errors" patented technology

An electrical connector adapter (40) is disclosed for electrically interconnecting a portable electronic component such as an MP3 player, CD player, or other portable device with sound or other equipment in a vehicle. The adapter (40) includes a one-piece insulating housing (60) having a system mating end (42) for interconnecting to a vehicle's electrical system and a component mating end (44) for interconnecting to a portable electrical component. Three electric contacts (62, 64, 68) are retained in three openings (90, 92, 94) respectively in the housing (60) and are arranged to electrically mate with a plug (54) of a portable electrical component.

A lever-type electrical connector assembly reduces the connection mating forces required to mate female and male connectors. The connector assembly employs a first connector with cam follower projections, a base housing with cam grooves ans a sliding guide rail, a slide lever housing including a sliding projection and a sliding guide rail, and a cover housing pivotally mounted on the base housing, the cover housing having a sliding projection. As the cover housing is rotated from an open to a closed position, it engages the sliding projection in the guide rail to permit rotation of the lever housing. This rotation engages the sliding projection in the guide rail. As the lever housing is rotated from an open to a closed position, it rotates the cam grooves to engage the cam follower projections thereby drawing the first connector into the base housing to a connected position.

A field emission display device and a method of fabricating the same are provided. The field emission display device may include a substrate, a transparent cathode layer, an insulation layer, a gate electrode, a resistance layer, and carbon nanotubes. The transparent cathode layer is deposited on the substrate. The insulation layer is formed on the cathode layer and has a well exposing the cathode layer. The gate electrode is formed on the insulation layer and has an opening corresponding to the well. The resistance layer is formed to surround the surface of the gate electrode and the inner walls of the opening and the well so as to block ultraviolet rays. The carbon nanotube field emitting source is positioned on the exposed cathode layer.

A semiconductor device comprises a plurality of vertical transistors each comprising barrier metal layers corresponding to source / drain regions in which a conduction region is formed under a channel region having a pillar form, and a bit line comprising a metal layer to connect the plurality of vertical transistors.

The invention discloses a cutting tool for boring an inner hole groove. The cutting tool can be used for directly boring the inner hole groove without taking off a workpiece after the inner hole process is performed on a drilling machine or a milling machine. The cutting tool for boring the inner hole groove comprises a cutter bar and a tool bit, wherein the tool bit is inserted in a square hole of the cutter bar in a sliding fit way; the upper end of the tool bit is connected with a cutting feed shifting fork; the cutting feed shifting fork toggles the tool bit to move axially along a boringtool bar to bore the inner hole groove; the cutting feed shifting fork is hinged with the cutter bar through a hinged shaft; the cutting feed shifting fork abuts against a sliding sleeve; the slidingsleeve is in sliding fit connection with the cutter bar; the shifting fork connected with the sliding sleeve is arranged at the lower end of a threaded rod; the threaded rod is connected with a fixedseat with nuts; the fixed seat is arranged on the cutter bar through a shaft; the lower part of the cutting feed shifting fork is provided with a spring; and a guide sleeve and a guide post are arranged on one side of the fixed seat to play an auxiliary guide role and prevent safety accidents caused by that the fixed seat rotates along with the cutter bar.

The invention provides a positioning marking method, device and system of an in-built part of a rotating shell, and relates to the technical field of assembling. The positioning marking method comprises the steps that laser scanning is conducted on the inner surface of the rotating shell, so that a shell inner surface model is obtained; a preset assembling model is adjusted according to the obtained inner surface model, so that a practical assembling model is obtained; position data of the part in the rotating shell are determined according to the practical assembling model; and positioning marking is conducted on the part in the rotating shell according to the position data, so that automatic positioning marking of the part is achieved. The whole marking process is accomplished by an operator through a computer, and manual and mechanical measurement and other manual labor are not required.

Equipment for machining a high-precision fused-quartz micro shell resonant structure comprises an XYZ three-dimensional feed mechanism, a W-direction servo rotation mechanism, a forming mold and a high-temperature flame control system; the high-temperature flame control system comprises a high-temperature flame gun, a to-be-processed quartz sheet is fixedly disposed on the forming mold, the forming mold is fixedly connected with the W-direction servo rotation mechanism, the W-direction servo rotation mechanism is capable of driving the forming mold to synchronously rotate at a high speed, the XYZ three-dimensional feed mechanism and the W-direction servo rotation mechanism are used to achieve alignment between the to-be-processed quartz sheet and high-temperature flame ejected by the high-temperature flam gun. The equipment for machining the high-precision fused-quartz micro shell resonant structure is capable of substantially improving the processing precision of a fused quartz micro shell resonant structure, substantially improves the machining efficiency, and is also applicable to machine resonant structures made from multiple materials with multiple dimension scopes.

The present invention relates to a fiber optic fusion splicing technique, in particular to a fiber optic fusion splicer for reliable and stable fiber optic fusion splicing, that is characterized by comprising: an alignment part for fixing and aligning first and second optical fibers that are to be fusion spliced; a fusion splicing module having an electrode bar for fusion splicing the first and second optical fibers that are fixed to and aligned in the alignment module; an optical module for photographing the aligned state of the first and second optical fibers aligned by the alignment module,and the fusion-spliced state of the first and second optical fibers fusion-spliced by the fusion splicing module; a support part in which the fusion splicing module and the optical module are mounted; and a lift module for moving the support part up and down.

The invention discloses a processing method of a rotating casing. By combining the processing procedures of the rotating casing parts into four turning-milling composite processes, the part transfer, production waiting time and processing preparation time are greatly shortened, and the process route of the parts is shortened. Divided into rough and finish machining, the parts only need to be clamped three times in total, so that the reference conversion of the parts is reduced to 3 times, the alignment error of the parts is greatly reduced, and the turning and milling composite technology is adopted, and the reference and precision holes can be processed in one process , can eliminate repeated clamping and alignment errors, improve the pass rate of precision hole position, and greatly improve the processing quality.

The invention discloses a self-reference interference alignment system for photoetching equipment. The system comprises a laser light source module, an optical module, a signal acquisition module and a processing module, wherein the laser light source module is used for providing illumination beams; the optical module is used for marking the illumination beams to form a diffraction optical signal; the signal acquisition module is used for processing the optical signal to acquire a light intensity signal; the processing module is used for processing the light intensity signal to acquire an alignment position by combining position data of a workpiece table; the optical module comprises a first optical channel and a second optical channel; an optical signal in the second optical channel is processed to be used for eliminating optical noises in the first optical channel.

The present invention relates to a weight balancer (100) and a pipe joining method that is capable of reducing a load of pipes when arranging and welding the pipes in ships, plants, piping work sites and the like. A weight balancer (100) according to the present invention includes an operation plate (180) for putting an alignment object; a plurality of load cells (145,146) installed in the lower portion of the operation plate (180); a controller (120) which receives a detection signal generated from the load cell (145,146) and analyzes the information of the alignment object to generate a control signal; an operation force driver (130) which receives the control signal from the controller (120) to control an operational pressure of each of a plurality of pressure supply lines; and a plurality of leveling cylinders (150) and balancing devices (160) which are connected to the pressure supply lines to control a location or pose of the operation plate (180) so as to correspond to the size of the operational pressure controlled by the operation force driver (130).

An infrared detecting device is provided that is capable of improving device characteristics thereof by narrowing the width of each beam portion. The infrared detecting device has an infrared detection portion having a thermoelectric transducing part formed over a semiconductor substrate via an air gap interposed therebetween, and the beam portions which are formed over the semiconductor substrate via the air gap interposed therebetween, support the infrared detection portion and electrically connect between the infrared detection portion and the semiconductor substrate, wherein each of the beam portions has an insulating material film and a conductive material layer exposed from the insulating material film to a side surface of each beam portion.