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Biodegradable polymer films and sheets suitable for use as laminate coatings as well as wraps and other packaging materials

Biodegradable polymer blends suitable for laminate coatings, wraps and other packaging materials manufactured from at least one "hard" biopolymer and at least one "soft" biopolymer. "Hard" biopolymers tend to be more brittle and rigid and typically have a glass transition temperature greater than about 10° C. "Soft" biopolymers tend to be more flexible and pliable and typically have a glass transition temperature less than about 0° C. While hard and soft polymers each possess certain intrinsic benefits, certain blends of hard and soft polymers have been discovered which possess synergistic properties superior to those of either hard or soft polymers by themselves. Biodegradable polymers include polyesters, polyesteramides and thermoplastically processable starch. The polymer blends may optionally include an inorganic filler. Films and sheets made from the polymer blends may be textured so as to increase the bulk hand feel. Wraps will typically be manufactured so as to have good "dead-fold" properties so as to remain in a wrapped position and not spring back to an "unwrapped" and planar form. Laminate films will typically have good water vapor barrier properties as measured by the their Water Vapor Permeability Coefficient (WVPC).
Owner:BIO TEC BIOLOGISCHE NATURVERPACKUNGEN

Absorbable Medical Implant Made of Fiber-Reinforced Magnesium or Fiber-Reinforced Magnesium Alloys

A medical implant comprising a composite material which is composed of reinforcement fibers made of a magnesium-containing, bio-corrosive alloy, another bio-corrosive alloy containing a main component that is selected from the group consisting of Mg, Ca, Fe, and Y, or a non-biodegradable fiber material, embedded in a matrix made of crystalline magnesium or magnesium alloys.
Owner:BIOTRONIK

Steam floor mop

The present invention discloses a steam floor mop, comprising a handle; a central body inside which a manual water pump, a water tank, and a steam generator are housed; and a floor brush connected flexibly to the central body, wherein the manual water pump, the water tank, and the steam generator are connected to the floor brush by means of pipes; said handle is connected directly to the piston rod of the manual water pump and serves to manipulate the operation of the manual water pump; said floor brush is covered by a cleaning cloth. In accordance with the steam floor mop of the present invention, by only pushing the handle of the steam floor mop, the steam can be generated and distributed to the floor brush so that the cleaning work having an effect of high temperature disinfecting and sterilization can be realized. It is not needed to power on the water pump additionally so as to supply water to the steam generator to generate the steam. Besides, a plurality of rib stripes are set on the floor brush, and a plurality of steam distributing grooves are formed between the rib stripes, so that the steam can be distributed uniformly to the whole cleaning surface of the floor brush. In addition, the floor brush is covered tightly by a cleaning cloth having a plurality of #-shaped checks formed thereon, so that the stains adhered to the floor can be cleaned easily. Therefore, by utilizing the steam floor mop of the present invention, the cleaning work can be performed conveniently and is time and labor saving, the effect of high temperature disinfecting and sterilization can be realized thoroughly.
Owner:SHARKNINJA OPERATING LLC

Plating method, semiconductor device fabrication method and circuit board fabrication method

The plating method comprises the step of forming a resin layer 10 over a substrate 16; the step of cutting the surface part of the resin layer 10 with a cutting tool 12; the step of forming a seed layer 36 on the resin layer 10 by electroless plating; and the step of forming a plating film 44 on the seed layer 36 by electroplating. Suitable roughness can be give to the surface of the resin layer 10, whereby the adhesion between the seed layer 36 and the resin layer 10 can be sufficiently ensured. Excessively deep pores are not formed in the surface of the resin layer 10, as are by desmearing treatment, whereby a micronized pattern of a photoresist film 40 can be formed on the resin layer 10. Thus, interconnections 44, etc. can be formed over the resin layer 10 at a narrow pitch with high reliability ensured.
Owner:FUJITSU LTD

Radiation treated ethylene polymers and articles made from said polymers

InactiveUS20040132854A1Superior compatability and adhesion propertyEasily blendSynthetic resin layered productsGranular deliveryIonizing radiationPolymer
The invention relates to ethylene polymers that are modified by ionizing radiation, prior to article formation, at a temperature less than the crystalline melt temperature and preferably under ambient atmosphere, as well as articles made from said polymers. The irradiated ethylene polymers exhibit enhanced melt strength, tensile strength, impact resistance, tear strength, adhesion to polar substances and thermal stability, decreased elongation, and lower melt flow index, but are easily processed and converted into and onto articles by conventional technologies including injection molding, extrusion, film and bottle blowing and powder coating.
Owner:GAMMATRON +1
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