40results about How to "Achieve electrical contact" patented technology

A loudspeaker includes a shell, a circuit arranged within the shell, a negative pin electrically connected with the circuit, a positive pin electrically connected with the circuit, a flexible printed circuit board, and two spaced copper pads electrically attached on the flexible printed circuit board. Each of the negative and positive pins has a bent portion exposed outside the shell. The bent portions deformably abut against the copper pads respectively, thereby establishing an electrical connection between the circuit between the flexible printed circuit board.

An HF housing coupler having a connector part connected to a housing is described, which has a connecting structure, via which a coaxial plug can be detachably connected to the connector part in a fixed manner. The invention is distinguished in that the connector part is implemented as a component differentiable from the housing, and provides at least one region which at least sectionally forms aformfitting connection with a housing wall which can be associated with the housing.

A photovoltaic (PV) device has at least one lower PV cell on a substrate, the cell having a metallic back contact, and a I-III-VI absorber, and a transparent conductor layer. An upper PV cell is adhered to the lower PV cell, electrically in series to form a stack. The upper PV cell has III- V absorber and junction layers, the cells are adhered by transparent conductive adhesive having filler of conductive nanostructures or low temperature solder. The upper PV cell has no substrate. An embodiment has at least one shape of patterned conductor making contact to both a top of the upper and a back contact of the lower cells to couple them together in series.; In an embodiment, a shape of patterned conductor draws current from excess area of the lower cell to the upper cell, in an alternative embodiment shapes of patterned conductor couples I-III-VI cells not underlying upper cells in series strings, a string being in parallel with at least one stack. In an embodiment, the bonding agent is a polymeric adhesive containing conductive nanostructures. In an embodiment the III-V absorber is grown on single crystal, substrate. A method for forming the device is described.

The invention relates to a multi-contact tactile sensor including an elastically deformable interaction layer (10) and a supporting layer (11), the lower surface of the interaction layer (10) having an array of strip conductors (12) and the upper surface of the supporting layer (11) having an array of strip conductors (13) that are not parallel to the array of strip conductors (12) on the interaction layer (10). The interaction layer (10) and the supporting layer (11) are separated by a first series of rigid insulating spacers (14). A second series of conducting spacers (15) is placed in contact with at least one of the two arrays of strip conductors (12, 13). The impedance and the dimensions of the spacers (14) of the second series are determined so as to prevent contact at rest and to enable local contact during the deformation of the interaction layer (10) between the spacers (15) of the second series and the array of strip conductors of the layer opposite said spacers (15). The invention also relates to a controller for controlling one such sensor, a mult-contact tactile screen including one such sensor and a keyboard comprising a set of discrete keys, formed by one such sensor.

The invention relates to a connection device for a coil (5) of an electromagnetic switching device having a switching region comprising contacts and a driving region comprising an anchor, a coil and a yoke, the contacts of the switching region being operatively connected to the driving region. The invention is characterized in that the contacting between the driving region and the coil (5) is established via a form-flexible connection element (3).

The present invention relates to a micropipe three-dimensional heterojunction device structure and its preparation method and application. The structure includes: micropipe semiconductor two-dimensional material three-dimensional heterojunction, inner wall electrodes, outer wall electrodes and substrate; The inner wall material of the tubular three-dimensional heterojunction forms electrical contact; the outer wall electrode only forms electrical contact with the outer wall material of the microtubular three-dimensional heterojunction; both the inner wall electrode and the outer wall electrode are insulated from the substrate; the microtubular semiconductor two-dimensional material three-dimensional The heterojunction is a tubular three-dimensional heterojunction formed by the self-curling of the plane heterojunction of the semiconductor two-dimensional material on the substrate. The invention solves the problem that the tubular three-dimensional heterojunction device cannot be prepared, has simple process, can simultaneously realize the preparation of the microtubular three-dimensional heterojunction and the electrical contact between the outer wall material and the outer wall electrode, and also ensures that the current only passes through the microstructure in the radial direction. Tubular three-dimensional heterojunctions can be widely used in photodetection, photovoltaics, gas sensing, electronic components and other fields without passing through planar heterojunctions.

The present invention relates to a radar component packaging body, comprising: a case cover, which has a metal layer arranged on the inner surface of the case cover, wherein a cavity is formed between the case cover and the case body; and a case body, which has: An insulator, which is connected to the box cover, wherein a hole is opened in the first insulator, one end of the hole corresponds to the position of the antenna and the other end communicates with the cavity; one or more chips, the chip is flip-chip arranged on the second insulator and covered by the first insulator; the second insulator; the third insulator; and the antenna and the conductive line, the antenna and the conductive line are arranged in the third insulator and pass through the soldering of the second insulator and the chip A pad connection, wherein a metal barrier layer is arranged between the antenna and the pad and between the conductive line and the pad, respectively, and the conductive line is exposed from the third insulator for electrical contact. The invention also relates to a method of manufacturing the package.

The invention discloses a plug-in type connector and a liquid heater. The plug-in type connector comprises a plug and a socket with a slot, the socket is in plug-in fit with the plug through the slot, an anti-loosening structure for preventing the plug and the slot from loosening in plug-in is arranged between the socket and the plug, and the plug has a plurality of plug-in directions relative to the slot. One of the plug and the socket is provided with a first ground wire sheet, the other one of the plug and the socket is provided with a second ground wire sheet, the first ground wire sheet and the second ground wire sheet can be electrically contacted when the plug is in different plugging directions, and after the plug is inserted into the slot, the plug cannot rotate relative to the socket. According to the invention, the anti-loosening structure between the plug and the socket can prevent the plug and the slot from being plugged and matched to be loosened, the first ground wire sheet and the second ground wire sheet can be electrically contacted when the plug is in different plugging orientations, a user can realize the electrical contact between the plug and the socket without identifying the plugging orientation, and the operation is simple.