Radar component package and manufacturing method thereof

Abstract

The present invention relates to a radar component packaging body, comprising: a case cover, which has a metal layer arranged on the inner surface of the case cover, wherein a cavity is formed between the case cover and the case body; and a case body, which has: An insulator, which is connected to the box cover, wherein a hole is opened in the first insulator, one end of the hole corresponds to the position of the antenna and the other end communicates with the cavity; one or more chips, the chip is flip-chip arranged on the second insulator and covered by the first insulator; the second insulator; the third insulator; and the antenna and the conductive line, the antenna and the conductive line are arranged in the third insulator and pass through the soldering of the second insulator and the chip A pad connection, wherein a metal barrier layer is arranged between the antenna and the pad and between the conductive line and the pad, respectively, and the conductive line is exposed from the third insulator for electrical contact. The invention also relates to a method of manufacturing the package.

Description

technical field [0001] The present invention relates generally to the field of semiconductor manufacturing, and in particular to a radar component package and a method for manufacturing such a radar component package. Background technique [0002] As the functions of consumer products become more and more diverse, there is a need for wireless detection (such as detection of moving objects and their speed) in many fields such as automobiles, robots and smartphones, so the application of radar components is increasing. However, applications in many fields, such as smartphones, balloons, airships, etc., impose strict requirements on the size and weight of radar components, so technicians have been trying to improve the integration of radar component packages to reduce its weight and size. [0003] From the Chinese patent application 201510149446.5 titled "A device for four-sided flat leadless packaged radar transceiver assembly", a packaged radar transceiver assembly is disclo...

AI Technical Summary

Problems solved by technology

However, the disadvantage of this packaged radar transceiver assembly is that it uses wire bonding to arrange the chips, which not only causes the length of the line to be too long and thus causes a large loss, but also needs to reserve a certain height in the box for wire bonding. bonded wires, resulting in a larger thickness of the component

In addition, the manufacture of the packaged radar transceiver component adopts the traditional packaging process including patching, wire bonding, and substrate manufacturing steps, so that the thickness of the substrate and chip limits the further reduction of the thickness of the component

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